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Journal Articles

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Paul Paret, Donal Finegan, Sreekant Narumanchi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034501.
Paper No: EP-22-1053
https://doi.org/10.1115/1.4056306
Published Online: December 9, 2022
View Article titled, Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities
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Topics: Artificial intelligence, Design, Electric vehicles, Electronics, Thermal management, Semiconductor devices, Reliability, Manufacturing, Semiconductors (Materials)
Journal Articles

Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices

Hyoungsoon Lee, Damena D. Agonafer, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010907.
Paper No: EP-15-1104
https://doi.org/10.1115/1.4032655
Published Online: March 10, 2016
View Article titled, Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices
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Topics: Boiling, Computational fluid dynamics, Flow (Dynamics), Flux (Metallurgy), Gallium nitride, Heat conduction, Heat transfer coefficients, Microchannels, Microcoolers, Simulation
Journal Articles

Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging

C. L. Gan, U. Hashim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021010.
Paper No: EP-12-1099
https://doi.org/10.1115/1.4024013
Published Online: April 12, 2013
View Article titled, Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging
Open the PDF for Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging in another window
Topics: High temperature, Packaging, Reliability, Stress, Wire, Failure mechanisms, Temperature, Semiconductors (Materials), Nanoscale phenomena, Nanoelectronics
Journal Articles

Damage Mechanics of Surface Mount Technology Solder Joints Under Concurrent Thermal and Dynamic Loading

R. Chandaroy, C. Basaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 61–68.
https://doi.org/10.1115/1.2792669
Published Online: June 1, 1999
View Article titled, Damage Mechanics of Surface Mount Technology Solder Joints Under Concurrent Thermal and Dynamic Loading
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Topics: Damage mechanics, Dynamic testing (Materials), Solder joints, Surface mount technology, Fatigue life, Failure mechanisms, Reliability, Stress, Vibration, Constitutive equations
Journal Articles

Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory

C. Basaran, R. Chandaroy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 8–11.
https://doi.org/10.1115/1.2792663
Published Online: March 1, 1999
View Article titled, Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory
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Topics: Dynamic analysis, Surface mount packaging, Solder joints, Failure mechanisms, Constitutive equations, Cycles, Defense industry, Failure, Fatigue, Fatigue life
Journal Articles

Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 1—Theory and Formulation

C. Basaran, C. S. Desai, T. Kundu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 41–47.
https://doi.org/10.1115/1.2792284
Published Online: March 1, 1998
View Article titled, Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 1—Theory and Formulation
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Topics: Electronic packaging, Finite element analysis, Thermomechanics, Constitutive equations, Cycles, Damage, Deformation, Design, Failure, Semiconductor devices
Journal Articles

Optimization of Extruded Type External Heat Sink for Multichip Module

A. Mertol
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1993, 115(4): 440–444.
https://doi.org/10.1115/1.2909354
Published Online: December 1, 1993
View Article titled, Optimization of Extruded Type External Heat Sink for Multichip Module
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Topics: Heat sinks, Multi-chip modules, Optimization, Junctions, Dimensions, Temperature, Air flow, Design, Finite element analysis, Finite element model
Journal Articles

On the Use of Micro Heat Pipes as an Integral Part of Semiconductor Devices

A. K. Mallik, G. P. Peterson, M. H. Weichold
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 436–442.
https://doi.org/10.1115/1.2905477
Published Online: December 1, 1992
View Article titled, On the Use of Micro Heat Pipes as an Integral Part of Semiconductor Devices
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Topics: Heat pipes, Semiconductor devices, Computer simulation, Heat, Temperature, Temperature gradient, Density, Flat heat pipes, Flux (Metallurgy), Heat flux
Journal Articles

Temperature Dependence of the Mechanical Properties of GaAs Wafers

Jun Ming Hu, Michael Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 331–336.
https://doi.org/10.1115/1.2905416
Published Online: December 1, 1991
View Article titled, Temperature Dependence of the Mechanical Properties of GaAs Wafers
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Topics: Gallium arsenide, Mechanical properties, Semiconductor wafers, Temperature effects, Materials properties, Temperature, Bending strength, Design, Elastic moduli, Elemental semiconductors
Journal Articles

Thermal Analysis of a New IMPATT Semiconductor Device

A. A. Tseng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1989, 111(2): 135–142.
https://doi.org/10.1115/1.3226518
Published Online: June 1, 1989
View Article titled, Thermal Analysis of a New IMPATT Semiconductor Device
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Topics: Semiconductor devices, Thermal analysis, Design, Packaging, Computation, Computers, Energy dissipation, Heat, Heat sinks, Modeling