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Journal Articles

Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams

Varun Prasanna Rajamuthu, Sanskar S. Panse, Srinath Ekkad
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031003.
Paper No: EP-20-1090
DOI: https://doi.org/10.1115/1.4049173
Published Online: January 19, 2021
View Article titled, Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams
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Topics: Density, Foams (Chemistry), Heat transfer, Porosity, Reynolds number, Metal foams, Copper, Flow (Dynamics), Jets
Journal Articles

Low-Dielectric Constant Nanoporous Epoxy for Electronic Packaging

Jisu Jiang, Landon Keller, Paul A. Kohl
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011006.
Paper No: EP-19-1031
DOI: https://doi.org/10.1115/1.4044626
Published Online: September 24, 2019
View Article titled, Low-Dielectric Constant Nanoporous Epoxy for Electronic Packaging
Click here to open pdf in another window PDF for Low-Dielectric Constant Nanoporous Epoxy for Electronic Packaging
Topics: Epoxy adhesives, Epoxy resins, Porosity
Includes: Supplementary data
Journal Articles

Challenges in Three-Dimensional Printing of High-Conductivity Copper

Tahany I. El-Wardany, Ying She, Vijay N. Jagdale, Jacquelynn K. Garofano, Joe J. Liou, Wayde R. Schmidt
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020907.
Paper No: EP-17-1104
DOI: https://doi.org/10.1115/1.4039974
Published Online: May 9, 2018
View Article titled, Challenges in Three-Dimensional Printing of High-Conductivity Copper
Click here to open pdf in another window PDF for Challenges in Three-Dimensional Printing of High-Conductivity Copper
Topics: Copper, Copper powders, Lasers, Porosity, Electrical conductivity, Additive manufacturing, Density, Modeling, Thermal conductivity
Journal Articles

Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications

Vana Snigdha Tummala, Ahsan Mian, Nowrin H. Chamok, Dhruva Poduval, Mohammod Ali, Jallisa Clifford, Prasun Majumdar
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020904.
Paper No: EP-16-1137
DOI: https://doi.org/10.1115/1.4036384
Published Online: June 12, 2017
View Article titled, Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications
Click here to open pdf in another window PDF for Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications
Topics: Additive manufacturing, Density, Dimensions, X-rays, Resonance, Microscopy, Manufacturing, Porosity, Design
Journal Articles

Measurement of Air Flow Rate Through Perforated Floor Tiles in a Raised Floor Data Center

Vaibhav K. Arghode, Taegyu Kang, Yogendra Joshi, Wally Phelps, Murray Michaels
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011007.
Paper No: EP-15-1115
DOI: https://doi.org/10.1115/1.4035596
Published Online: January 10, 2017
View Article titled, Measurement of Air Flow Rate Through Perforated Floor Tiles in a Raised Floor Data Center
Click here to open pdf in another window PDF for Measurement of Air Flow Rate Through Perforated Floor Tiles in a Raised Floor Data Center
Topics: Air flow, Flow (Dynamics), Tiles, Porosity, Data centers
Journal Articles

Experimental Investigation of Air Flow Through a Perforated Tile in a Raised Floor Data Center

Vaibhav K. Arghode, Yogendra Joshi
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011011.
Paper No: EP-14-1017
DOI: https://doi.org/10.1115/1.4028835
Published Online: March 1, 2015
View Article titled, Experimental Investigation of Air Flow Through a Perforated Tile in a Raised Floor Data Center
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Topics: Air flow, Tiles, Porosity, Data centers
Journal Articles

Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams

Mahmood R. S. Shirazy, Luc G. Fréchette
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041003.
Paper No: EP-13-1098
DOI: https://doi.org/10.1115/1.4026353
Published Online: September 19, 2014
View Article titled, Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams
Click here to open pdf in another window PDF for Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams
Topics: Containers, Copper, Evaporation, Flux (Metallurgy), Foams (Chemistry), Heat, Heat losses, Porosity, Temperature, Ethanol
Journal Articles

Performance of Axial Fans in Close Proximity to the Electromagnetic Compatibility Screens

R. Antón, A. Bengoechea, A. Rivas, J. C. Ramos, G. S. Larraona
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011004.
DOI: https://doi.org/10.1115/1.4005913
Published Online: March 19, 2012
View Article titled, Performance of Axial Fans in Close Proximity to the Electromagnetic Compatibility Screens
Click here to open pdf in another window PDF for Performance of Axial Fans in Close Proximity to the Electromagnetic Compatibility Screens
Topics: Fans, Flow (Dynamics), Porosity, Pressure, Electromagnetic compatibility, Air flow
Journal Articles

Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data Center

Emad Samadiani, Jeffrey Rambo, Yogendra Joshi
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021002.
DOI: https://doi.org/10.1115/1.4001589
Published Online: May 20, 2010
View Article titled, Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data Center
Click here to open pdf in another window PDF for Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data Center
Topics: Computer simulation, Data centers, Flow (Dynamics), Pipes, Tiles, Air flow, Modeling, Porosity
Journal Articles

Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications

K. Lafdi, O. Mesalhy, A. Elgafy
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021004.
DOI: https://doi.org/10.1115/1.2912185
Published Online: April 25, 2008
View Article titled, Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications
Click here to open pdf in another window PDF for Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications
Topics: Cooling, Design, Fins, Heat, Heat sinks, Phase change materials, Porosity, Shapes, Temperature, Thermal conductivity
Journal Articles

Modeling of Resin Flow in Reinforced Dielectric Prepregs

Pavel Simacek, Suresh G. Advani, Kossi Zonvide, Leonard W. Barrett
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021001.
DOI: https://doi.org/10.1115/1.2837510
Published Online: April 15, 2008
View Article titled, Modeling of Resin Flow in Reinforced Dielectric Prepregs
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Topics: Copper, Flow (Dynamics), Pressure, Resins, Printed circuit boards, Permeability, Viscosity, Porosity
Journal Articles

Interstitial Heat Transfer Coefficient and Dispersion Conductivity in Compressed Metal Foam Heat Sinks

Sheng-Chung Tzeng, Tzer-Ming Jeng
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 113–119.
DOI: https://doi.org/10.1115/1.2721081
Published Online: August 11, 2006
View Article titled, Interstitial Heat Transfer Coefficient and Dispersion Conductivity in Compressed Metal Foam Heat Sinks
Click here to open pdf in another window PDF for Interstitial Heat Transfer Coefficient and Dispersion Conductivity in Compressed Metal Foam Heat Sinks
Topics: Heat transfer coefficients, Metal foams, Porosity, Thermal conductivity, Aluminum, Electrical conductivity, Heat sinks, Heat transfer, Flow (Dynamics), Foams (Chemistry)
Journal Articles

In-Plane Effective Thermal Conductivity of Symmetric, Diamond-Weave Screen Laminates

Jun Xu, Richard A. Wirtz
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. September 2005, 127(3): 353–356.
DOI: https://doi.org/10.1115/1.1997162
Published Online: October 31, 2004
View Article titled, In-Plane Effective Thermal Conductivity of Symmetric, Diamond-Weave Screen Laminates
Click here to open pdf in another window PDF for In-Plane Effective Thermal Conductivity of Symmetric, Diamond-Weave Screen Laminates
Topics: Diamonds, Laminates, Thermal conductivity, Porosity
Journal Articles

A Novel Semi-empirical Model for Evaluating Thermal Performance of Porous Metallic Foam Heat Sinks

Tzer-Ming Jeng, Li-Kang Liu, Ying-Huei Hung
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 223–234.
DOI: https://doi.org/10.1115/1.1997159
Published Online: May 8, 2004
View Article titled, A Novel Semi-empirical Model for Evaluating Thermal Performance of Porous Metallic Foam Heat Sinks
Click here to open pdf in another window PDF for A Novel Semi-empirical Model for Evaluating Thermal Performance of Porous Metallic Foam Heat Sinks
Topics: Aluminum, Fluids, Heat sinks, Heat transfer, Liquid crystals, Metal foams, Porosity, Reynolds number, Steady state, Temperature
Journal Articles

Why Gold Flash Can Be Detrimental to Long-Term Reliability

Jingsong Xie, Ming Sun, Michael Pecht, David F. Barbe
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 37–40.
DOI: https://doi.org/10.1115/1.1646425
Published Online: April 30, 2004
View Article titled, Why Gold Flash Can Be Detrimental to Long-Term Reliability
Click here to open pdf in another window PDF for Why Gold Flash Can Be Detrimental to Long-Term Reliability
Topics: Corrosion, Reliability, Porosity, Diffusion (Physics), Corrosion resistance
Journal Articles

Experiments on Chimney-Enhanced Free Convection From Pin-Fin Heat Sinks

W. W. Thrasher, T. S. Fisher, K. E. Torrance
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 350–355.
DOI: https://doi.org/10.1115/1.1289633
Published Online: February 10, 2000
View Article titled, Experiments on Chimney-Enhanced Free Convection From Pin-Fin Heat Sinks
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Topics: Heat sinks, Heat transfer, Porosity, Natural convection, Temperature
Journal Articles

Forced Convection Heat Transfer Augmentation in a Channel With A Localized Heat Source Using Fibrous Materials

D. Angirasa, G. P. Peterson
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 1–7.
DOI: https://doi.org/10.1115/1.2792656
Published Online: March 1, 1999
View Article titled, Forced Convection Heat Transfer Augmentation in a Channel With A Localized Heat Source Using Fibrous Materials
Click here to open pdf in another window PDF for Forced Convection Heat Transfer Augmentation in a Channel With A Localized Heat Source Using Fibrous Materials
Topics: Forced convection, Heat, Reynolds number, Computer simulation, Convection, Electronic components, Flow (Dynamics), Fluid dynamics, Heat transfer, Porosity
Journal Articles

Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study

D. Pal, Y. K. Joshi
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 40–50.
DOI: https://doi.org/10.1115/1.2792199
Published Online: March 1, 1997
View Article titled, Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study
Click here to open pdf in another window PDF for Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study
Topics: Phase change materials, Laminates, Transients (Dynamics), Computation, Computer simulation, Cooling, Cooling systems, Density, Dimensions, Enthalpy
Journal Articles

An Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process

L. J. Huang, K. Ramakrishna, P. S. Ayyaswamy, I. M. Cohen
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 1989, 111(3): 199–206.
DOI: https://doi.org/10.1115/1.3226534
Published Online: September 1, 1989
View Article titled, An Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process
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Topics: Aluminum, Bonding, Porosity, Shrinkage (Materials), Alloys, Metals, Density, Solidification, Accounting, Geometry