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Journal Articles

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041012.
Paper No: EP-21-1136
https://doi.org/10.1115/1.4053365
Published Online: January 28, 2022
View Article titled, Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current
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Topics: Damage, Density, Electric current, Inks, Nanoparticles, Reliability, Lasers, Diffusion (Physics), Atoms, Grain boundaries
Journal Articles

Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication

Victor Adrian Chiriac, Tien-Yu Tom Lee, Vern Hause
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 429–434.
https://doi.org/10.1115/1.1827257
Published Online: January 24, 2005
View Article titled, Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication
Open the PDF for Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication in another window
Topics: Heat, Junctions, Optimization, Solders, Temperature, Thermal conductivity, Thermal resistance, Epoxy adhesives, Epoxy resins, Numerical analysis