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Journal Articles

Performance Analysis of a Brazed Plate Heat Exchanger During Condensation of R1233zd(E)

R. Khalid, M. McMullen, R. L. Amalfi, A. Ortega, A. P. Wemhoff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021005.
Paper No: EP-24-1060
https://doi.org/10.1115/1.4067377
Published Online: December 31, 2024
View Article titled, Performance Analysis of a Brazed Plate Heat Exchanger During Condensation of R1233zd(E)
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Topics: Condensation, Condensers (steam plant), Flow (Dynamics), Fluids, Friction, Heat exchangers, Pressure, Refrigerants, Temperature, Heat transfer
Journal Articles

Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric

Victor A. Martinez, Carol Caceres, Alfonso Ortega
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041118.
Paper No: EP-24-1040
https://doi.org/10.1115/1.4066101
Published Online: August 24, 2024
View Article titled, Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric
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Topics: Temperature, Thermal resistance, Thermocouples, Coolants, Errors, Flow (Dynamics), Heat exchangers, Uncertainty
Journal Articles

Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks

Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Jeremy Rodriguez, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041102.
Paper No: EP-24-1007
https://doi.org/10.1115/1.4065537
Published Online: June 17, 2024
View Article titled, Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks
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Topics: Coolants, Cooling, Data centers, Density, Heat, Heat exchangers, Temperature, Fluids, Stress, Cooling systems
Journal Articles

Characterization of a Rack-Level Thermosyphon-Based Cooling System

R. Khalid, S. G. Schon, R. L. Amalfi, A. Ortega, A. P. Wemhoff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031007.
Paper No: EP-23-1068
https://doi.org/10.1115/1.4064524
Published Online: March 11, 2024
View Article titled, Characterization of a Rack-Level Thermosyphon-Based Cooling System
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Topics: Condensers (steam plant), Cooling, Cooling systems, Data centers, Fluids, Heat, Heat recovery, Refrigerants, Stress, Temperature
Journal Articles

Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling

R. Khalid, E. Youssef, R. L. Amalfi, A. Ortega, A. P. Wemhoff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021005.
Paper No: EP-23-1016
https://doi.org/10.1115/1.4063252
Published Online: November 10, 2023
View Article titled, Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling
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Topics: Flow (Dynamics), Heat exchangers, Refrigerants, Temperature, Heat, Cooling, Fluids, Pressure
Journal Articles

Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft

Joshua Kasitz, Aniket Ajay Lad, Muhammad Jahidul Hoque, Nenad Miljkovic, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011101.
Paper No: EP-22-1023
https://doi.org/10.1115/1.4055464
Published Online: September 27, 2022
View Article titled, Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft
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Topics: Aircraft, Cooling, Cooling systems, Flight, Heat exchangers, Stress, Temperature, Thermal management, Transients (Dynamics), Motors
Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
https://doi.org/10.1115/1.4052767
Published Online: November 22, 2021
View Article titled, Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities
Journal Articles

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Gilberto Moreno, Sreekant Narumanchi, Xuhui Feng, Paul Anschel, Steve Myers, Phil Keller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011004.
Paper No: EP-20-1093
https://doi.org/10.1115/1.4049815
Published Online: August 6, 2021
View Article titled, Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions
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Topics: Cooling, Electronics, Fluids, Heat exchangers, Heat transfer, Thermal management, Thermal resistance, Vehicles, Heat, Temperature
Journal Articles

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger

Hua Zhu, Zhuo Yang, Tariq Amin Khan, Wei Li, Zhijian Sun, Jincai Du, Zhengjiang Zhang, Jianxin Zhou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031008.
Paper No: EP-18-1108
https://doi.org/10.1115/1.4043482
Published Online: May 17, 2019
View Article titled, Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger
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Topics: Artificial neural networks, Computational fluid dynamics, Computer simulation, Flow (Dynamics), Heat exchangers, Heat transfer, Optimization, Friction, Reynolds number, Genetic algorithms
Journal Articles

Microfeature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold-Plate Operation

Noris Gallandat, Danielle Hesse, J. Rhett Mayor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010908.
Paper No: EP-15-1096
https://doi.org/10.1115/1.4032347
Published Online: March 10, 2016
View Article titled, Microfeature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold-Plate Operation
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Topics: Convection, Density, Flow (Dynamics), Heat, Heat exchangers, Heat transfer, Hydrofoil, Pressure drop, Temperature, Water
Journal Articles

Steady State and Transient Experimentally Validated Analysis of Hybrid Data Centers

Tianyi Gao, Bahgat Sammakia, Emad Samadiani, Roger Schmidt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021007.
Paper No: EP-14-1041
https://doi.org/10.1115/1.4029163
Published Online: June 1, 2015
View Article titled, Steady State and Transient Experimentally Validated Analysis of Hybrid Data Centers
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Topics: Cooling, Data centers, Doors, Failure, Heat exchangers, Steady state, Temperature, Water, Cooling systems, Air flow
Journal Articles

Constructal Theory Based Geometric Optimization of Wavy Channels in the Low Reynolds Number Regime

Gongnan Xie, Masoud Asadi, Bengt Sunden, Shaofei Zheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031013.
Paper No: EP-13-1138
https://doi.org/10.1115/1.4027728
Published Online: June 10, 2014
View Article titled, Constructal Theory Based Geometric Optimization of Wavy Channels in the Low Reynolds Number Regime
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Topics: Design, Flow (Dynamics), Geometry, Heat transfer, Optimization, Reynolds number, Thermal resistance, Vortices, Wavelength, Degrees of freedom
Journal Articles

Downhole Electronics Cooling Using a Thermoelectric Device and Heat Exchanger Arrangement

Ashish Sinha, Yogendra K Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041005.
https://doi.org/10.1115/1.4005290
Published Online: December 9, 2011
View Article titled, Downhole Electronics Cooling Using a Thermoelectric Device and Heat Exchanger Arrangement
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Topics: Copper, Heat, Heat exchangers, Temperature, Thermal management, Thermoelectric devices, Water, Manufacturing, Fluids, Cooling
Journal Articles

Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules

Giulio Lorenzini, Simone Moretti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031012.
https://doi.org/10.1115/1.3144152
Published Online: July 31, 2009
View Article titled, Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules
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Topics: Fins, Heat, Heat exchangers, Pressure, Shapes, Temperature, Thermal conductivity, Ducts, Reynolds number, Optimization
Journal Articles

Thermal Model of a Thinned-Die Cooling System

N. Boiadjieva, P. Koev
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 435–439.
https://doi.org/10.1115/1.1826079
Published Online: January 24, 2005
View Article titled, Thermal Model of a Thinned-Die Cooling System
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Topics: Air flow, Cooling systems, Flat heat pipes, Flow (Dynamics), Heat exchangers, Temperature, Cooling, Heat, Silicon
Journal Articles

Thermal Management of Outdoor Electronic Cabinets Using Soil Heat Exchangers

Hisham E. Hegab, Assistant Professor,, Eric B. Zimmerman, Associate Professor,, Gene T. Colwell, Professor Emeritus,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 7–11.
https://doi.org/10.1115/1.1392320
Published Online: March 1, 2002
View Article titled, Thermal Management of Outdoor Electronic Cabinets Using Soil Heat Exchangers
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Topics: Computer simulation, Heat, Heat exchangers, Heat pipes, Soil, Stress, Temperature, Thermal management, Cooling systems, Transients (Dynamics)
Journal Articles

Advanced Heat Exchange Technology for Thermoelectric Cooling Devices

R. L. Webb, M. D. Gilley, V. Zarnescu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 98–105.
https://doi.org/10.1115/1.2792292
Published Online: March 1, 1998
View Article titled, Advanced Heat Exchange Technology for Thermoelectric Cooling Devices
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Topics: Heat, Thermoelectric cooling, Thermoelectric coolers, Heat exchangers, Condensers (steam plant), Design, Electronic components, Temperature, Thermal resistance
Journal Articles

Uniform Channel Micro Heat Exchangers

X. Yin, H. H. Bau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 89–94.
https://doi.org/10.1115/1.2792225
Published Online: June 1, 1997
View Article titled, Uniform Channel Micro Heat Exchangers
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Topics: Heat exchangers, Dimensions, Heat, Thermal resistance, Flow (Dynamics), Nitrogen, Performance characterization, Semiconductor wafers, Temperature
Journal Articles

Micro Heat Exchangers Consisting of Pin Arrays

Xiaoqing Yin, H. H. Bau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 51–57.
https://doi.org/10.1115/1.2792200
Published Online: March 1, 1997
View Article titled, Micro Heat Exchangers Consisting of Pin Arrays
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Topics: Heat exchangers, Heat, Computer simulation, Coolants, Flow (Dynamics), Geometry, High temperature superconductors, Multi-chip modules, Nitrogen, Semiconductor wafers
Journal Articles

Natural Convection Heat Transfer From an Array of Rectangular Protrusions in an Enclosure Filled With Dielectric Liquid

Y. Joshi, M. D. Kelleher, M. Powell, E. I. Torres
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 138–147.
https://doi.org/10.1115/1.2905502
Published Online: June 1, 1994
View Article titled, Natural Convection Heat Transfer From an Array of Rectangular Protrusions in an Enclosure Filled With Dielectric Liquid
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Topics: Dielectric liquids, Heat transfer, Natural convection, Temperature, Boundary-value problems, Cooling, Electronic packages, Energy dissipation, Heat exchangers, Plates (structures)