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Journal Articles

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Khalid Alzoubi, Alexander Hensel, Felix Häußler, Bettina Ottinger, Marcel Sippel, Jörg Franke
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031008.
Paper No: EP-22-1082
DOI: https://doi.org/10.1115/1.4056992
Published Online: March 8, 2023
View Article titled, Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
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Topics: Electronics, Experimental design, Intermetallic compounds, Optimization, Pressure, Shear strength, Silver, Sintering, Temperature, Failure
Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey
Journal: Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. March 2023, 145(1): 010301.
Paper No: EP-22-1094
DOI: https://doi.org/10.1115/1.4056558
Published Online: January 11, 2023
View Article titled, Special Section on InterPACK2021
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Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices
Journal Articles

Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011109.
Paper No: EP-22-1035
DOI: https://doi.org/10.1115/1.4056477
Published Online: January 11, 2023
View Article titled, Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications
Click here to open pdf in another window PDF for Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications
Topics: Adhesives, Electronics, Reliability, Surface preparation, Temperature, Stress, Inks, Silver
Journal Articles

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Paul Paret, Donal Finegan, Sreekant Narumanchi
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034501.
Paper No: EP-22-1053
DOI: https://doi.org/10.1115/1.4056306
Published Online: December 9, 2022
View Article titled, Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities
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Topics: Artificial intelligence, Design, Electric vehicles, Electronics, Thermal management, Semiconductor devices, Reliability, Manufacturing, Semiconductors (Materials)
Journal Articles

Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

Pradeep Lall, Kartik Goyal, Curtis Hill
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021011.
Paper No: EP-22-1029
DOI: https://doi.org/10.1115/1.4055986
Published Online: November 23, 2022
View Article titled, Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization
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Topics: Copper, Sintering, Surface mount devices, Electrical resistivity, Printing, Drops, Electronics
Journal Articles

Module-Level Thermal Interface Material Degradation in HALT

Joshua Tompkins, Alicia Medina Garcia, David Huitink, Haitao Liao
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011106.
Paper No: EP-22-1021
DOI: https://doi.org/10.1115/1.4056030
Published Online: November 23, 2022
View Article titled, Module-Level Thermal Interface Material Degradation in HALT
Click here to open pdf in another window PDF for Module-Level Thermal Interface Material Degradation in HALT
Topics: Cycles, Life testing, Stress, Temperature, Testing, Thermal resistance, Vibration, Electronics, Reliability, Heating
Includes: Supplementary data
Journal Articles

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Okafor Ekene Gabriel, David Ryan Huitink
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. June 2023, 145(2): 020801.
Paper No: EP-22-1045
DOI: https://doi.org/10.1115/1.4055774
Published Online: October 22, 2022
View Article titled, Failure Mechanisms Driven Reliability Models for Power Electronics: A Review
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Topics: Failure, Fatigue, Reliability, Stress, Temperature, Fatigue life, Electronics, Failure mechanisms, Corrosion, Modeling
Journal Articles

Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics

Hayden Carlton, Ange Iradukunda, Asif Imran, Sarah Myane, Noah Akey, Fang Luo, David Huitink
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. June 2022, 144(2): 024502.
Paper No: EP-21-1049
DOI: https://doi.org/10.1115/1.4053642
Published Online: February 16, 2022
View Article titled, Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics
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Topics: Electromagnetic interference, Electronics, Nanocomposites, Silicones, Nanoparticles, Iron
Journal Articles

Special Issue on InterPACK2020

Jin Yang, Sukwon Choi, Jaeho Lee, Saket Karajgikar
Journal: Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. June 2022, 144(2): 020301.
Paper No: EP-21-1158
DOI: https://doi.org/10.1115/1.4053122
Published Online: January 4, 2022
View Article titled, Special Issue on InterPACK2020
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Topics: Additive manufacturing, Cloud computing, Computers, Data centers, Electric vehicles, Electronic packaging, Electronics, Engineering teachers, Microelectronic packaging, Modeling
Journal Articles

Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021113.
Paper No: EP-21-1059
DOI: https://doi.org/10.1115/1.4052715
Published Online: January 4, 2022
View Article titled, Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation
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Topics: Flip-chip, Glass transition, High temperature, Mechanical properties, Oxidation, Solders, Storage, Temperature, Viscoelasticity, Optical microscopes
Journal Articles

Please Join the ASME Community and the Bar-Cohen Family to Support the Establishment of the ASME Avram Bar-Cohen Memorial Medal

Journal: Journal of Electronic Packaging
Article Type: Announcements
J. Electron. Packag. December 2021, 143(4): 048001.
Paper No: EP-21-1128
DOI: https://doi.org/10.1115/1.4052403
Published Online: October 1, 2021
View Article titled, Please Join the ASME Community and the Bar-Cohen Family to Support the Establishment of the ASME Avram Bar-Cohen Memorial Medal
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Topics: Electronics, Engineers, Leadership, Mentoring, Packaging, Photonics
Journal Articles

Recent Developments in Air Pumps for Thermal Management of Electronics

Tsrong-Yi Wen, Jia-Cheng Ye
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. September 2022, 144(3): 030802.
Paper No: EP-20-1109
DOI: https://doi.org/10.1115/1.4051970
Published Online: October 1, 2021
View Article titled, Recent Developments in Air Pumps for Thermal Management of Electronics
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Topics: Pumps, Flow (Dynamics), Diaphragms (Mechanical devices), Diaphragms (Structural), Fans, Electronics, Cooling
Journal Articles

Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors

Mei-Chien Lu
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. June 2022, 144(2): 020801.
Paper No: EP-21-1008
DOI: https://doi.org/10.1115/1.4052069
Published Online: September 24, 2021
View Article titled, Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors
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Topics: Sensors, Bonding, Electronics
Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021105.
Paper No: EP-21-1012
DOI: https://doi.org/10.1115/1.4052071
Published Online: September 24, 2021
View Article titled, A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics
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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat
Journal Articles

Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model

Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021104.
Paper No: EP-20-1142
DOI: https://doi.org/10.1115/1.4052074
Published Online: September 24, 2021
View Article titled, Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model
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Topics: Composite materials, Energy storage, Thermal conductivity, Electronics, Optimization, Temperature, Design, Heat sinks, Latent heat, Phase change materials
Journal Articles

Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Omidreza Ghaffari, Wei Tong, Yaser Nabavi Larimi, Chady al Sayed, Alireza Ganjali, Jean-François Morissette, Francis Grenier, Simon Jasmin, Luc Fréchette, Julien Sylvestre
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041103.
Paper No: EP-21-1083
DOI: https://doi.org/10.1115/1.4051943
Published Online: August 27, 2021
View Article titled, Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
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Topics: Boiling, Cooling, Dielectric liquids, Heat, Temperature, Copper, Flat heat pipes, Pool boiling, Critical heat flux, Subcooling
Journal Articles

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Gilberto Moreno, Sreekant Narumanchi, Xuhui Feng, Paul Anschel, Steve Myers, Phil Keller
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011004.
Paper No: EP-20-1093
DOI: https://doi.org/10.1115/1.4049815
Published Online: August 6, 2021
View Article titled, Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions
Click here to open pdf in another window PDF for Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions
Topics: Cooling, Electronics, Fluids, Heat exchangers, Heat transfer, Thermal management, Thermal resistance, Vehicles, Heat, Temperature
Journal Articles

Modular Heat Sinks for Enhanced Thermal Management of Electronics

Muhammad Jahidul Hoque, Alperen Günay, Andrew Stillwell, Yashraj Gurumukhi, Robert C. N. Pilawa-Podgurski, Nenad Miljkovic
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020903.
Paper No: EP-20-1081
DOI: https://doi.org/10.1115/1.4049294
Published Online: February 22, 2021
View Article titled, Modular Heat Sinks for Enhanced Thermal Management of Electronics
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Topics: Electronics, Gallium nitride, Heat sinks, Thermal management, Power density, Design, Temperature, Power converters, Manufacturing
Journal Articles

Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Nazli Donmezer, Ashutosh Giri, Patrick E. Hopkins, Sukwon Choi, Darshan Pahinkar, Jingjing Shi, Samuel Graham, Zhiting Tian, Laura Ruppalt
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020804.
Paper No: EP-20-1070
DOI: https://doi.org/10.1115/1.4049293
Published Online: February 22, 2021
View Article titled, Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
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Topics: Electronics, Gallium nitride, Heat, Nanoscale phenomena, Phonons, Temperature, Thermal conductivity, Electromagnetic scattering, Energy gap, Diamonds
Journal Articles

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

Fabio Battaglia, Farah Singer, David C. Deisenroth, Michael M. Ohadi
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031006.
Paper No: EP-19-1118
DOI: https://doi.org/10.1115/1.4049564
Published Online: February 19, 2021
View Article titled, Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes
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Topics: Cooling, Flow (Dynamics), Heat, Heat flux, Microchannels, Pumps, Refrigerants, Temperature, Electronics, Flux (Metallurgy)