1-8 of 8
Electrical conductivity
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink

Neil Dalal, Yuan Gu, Guang Chen, Daniel R. Hines, Abhijit Dasgupta, Siddhartha Das
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011012.
Paper No: EP-19-1002
https://doi.org/10.1115/1.4044960
Published Online: November 14, 2019
View Article titled, Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink
Open the PDF for Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink in another window
Topics: Aerosols, Electrical conductivity, Flow (Dynamics), Gas flow, Inks, Magnification, Nanoparticles, Printing, Silver, Agglomeration (Materials)
Includes: Supplementary data
Journal Articles

Challenges in Three-Dimensional Printing of High-Conductivity Copper

Tahany I. El-Wardany, Ying She, Vijay N. Jagdale, Jacquelynn K. Garofano, Joe J. Liou, Wayde R. Schmidt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020907.
Paper No: EP-17-1104
https://doi.org/10.1115/1.4039974
Published Online: May 9, 2018
View Article titled, Challenges in Three-Dimensional Printing of High-Conductivity Copper
Open the PDF for Challenges in Three-Dimensional Printing of High-Conductivity Copper in another window
Topics: Copper, Copper powders, Lasers, Porosity, Electrical conductivity, Additive manufacturing, Density, Modeling, Thermal conductivity
Journal Articles

Modeling Thermal Microspreading Resistance in Via Arrays

Michael Fish, Patrick McCluskey, Avram Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010909.
Paper No: EP-15-1097
https://doi.org/10.1115/1.4032348
Published Online: March 11, 2016
View Article titled, Modeling Thermal Microspreading Resistance in Via Arrays
Open the PDF for Modeling Thermal Microspreading Resistance in Via Arrays in another window
Topics: Boundary-value problems, Convection, Electrical conductivity, Modeling, Thermal conductivity, Heat, Flow (Dynamics), Finite element model
Journal Articles

Interstitial Heat Transfer Coefficient and Dispersion Conductivity in Compressed Metal Foam Heat Sinks

Sheng-Chung Tzeng, Tzer-Ming Jeng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 113–119.
https://doi.org/10.1115/1.2721081
Published Online: August 11, 2006
View Article titled, Interstitial Heat Transfer Coefficient and Dispersion Conductivity in Compressed Metal Foam Heat Sinks
Open the PDF for Interstitial Heat Transfer Coefficient and Dispersion Conductivity in Compressed Metal Foam Heat Sinks in another window
Topics: Heat transfer coefficients, Metal foams, Porosity, Thermal conductivity, Aluminum, Electrical conductivity, Heat sinks, Heat transfer, Flow (Dynamics), Foams (Chemistry)
Journal Articles

Lattice Boltzmann Modeling of Subcontinuum Energy Transport in Crystalline and Amorphous Microelectronic Devices

Rodrigo Escobar, Brian Smith, Cristina Amon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 115–124.
https://doi.org/10.1115/1.2188951
Published Online: January 19, 2006
View Article titled, Lattice Boltzmann Modeling of Subcontinuum Energy Transport in Crystalline and Amorphous Microelectronic Devices
Open the PDF for Lattice Boltzmann Modeling of Subcontinuum Energy Transport in Crystalline and Amorphous Microelectronic Devices in another window
Topics: Phonons, Silicon, Temperature, Thermal conductivity, Thin films, Lattice Boltzmann methods, Mean free path, Microelectronic devices, Electrical conductivity
Journal Articles

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate

Alfonso Ortega, Shankar Ramanathan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 235–243.
https://doi.org/10.1115/1.1569507
Published Online: June 10, 2003
View Article titled, On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate
Open the PDF for On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate in another window
Topics: Cooling, Electrical conductivity, Electronic components, Flow (Dynamics), Forced convection, Heat, Heat conduction, Heat transfer, Temperature, Thermal conductivity
Journal Articles

Laminar Heat Transfer Between a Series of Parallel Plates With Surface-Mounted Discrete Heat Sources

S. H. Kim, N. K. Anand
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1995, 117(1): 52–62.
https://doi.org/10.1115/1.2792067
Published Online: March 1, 1995
View Article titled, Laminar Heat Transfer Between a Series of Parallel Plates With Surface-Mounted Discrete Heat Sources
Open the PDF for Laminar Heat Transfer Between a Series of Parallel Plates With Surface-Mounted Discrete Heat Sources in another window
Topics: Heat, Heat transfer, Plates (structures), Thermal resistance, Friction, Air flow, Cooling, Electrical conductivity, Electronic equipment, Flow (Dynamics)
Journal Articles

Effects of Substrate Conductivity on Convective Cooling of Electronic Components

C. Y. Choi, S. J. Kim, A. Ortega
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 198–205.
https://doi.org/10.1115/1.2905686
Published Online: September 1, 1994
View Article titled, Effects of Substrate Conductivity on Convective Cooling of Electronic Components
Open the PDF for Effects of Substrate Conductivity on Convective Cooling of Electronic Components in another window
Topics: Cooling, Electrical conductivity, Electronic components, Thermal conductivity, Heat conduction, Fluids, Heat, Temperature, Boundary-value problems, Convection