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Journal Articles

Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density

Haibin Zhang, Quan Sun, Zhidan Sun, Yebo Lu

J. Electron. Packag. June 2023, 145(2): 021006.

Paper No: EP-22-1017

DOI: https://doi.org/10.1115/1.4055469

Published Online: September 28, 2022

View Article titled, Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density

Topics: Current density, Silver, Wire, Temperature gradient, Electrodiffusion

Journal Articles

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata

J. Electron. Packag. March 2023, 145(1): 011102.

Paper No: EP-22-1016

DOI: https://doi.org/10.1115/1.4055394

Published Online: September 27, 2022

View Article titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Topics: Anodes, Creep, Current density, Electrodiffusion, Solder joints, Stress, Temperature

Journal Articles

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Mahsa Montazeri, Whit M. Vinson, David R. Huitink

J. Electron. Packag. June 2023, 145(2): 021002.

Paper No: EP-22-1037

DOI: https://doi.org/10.1115/1.4055024

Published Online: August 8, 2022

View Article titled, Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Topics: Electrodiffusion, Failure, Solder joints, Solders, Stress, Temperature, Tension, Testing, Current density, Tin

Journal Articles

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

Junjie Dai, Yuexin Zhang, Zhankun Li, Mingming Chen, Yuhua Guo, Zhekun Fan, Junhui Li

J. Electron. Packag. September 2022, 144(3): 031014.

Paper No: EP-21-1121

DOI: https://doi.org/10.1115/1.4053889

Published Online: March 8, 2022

View Article titled, Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

Topics: Columns (Structural), Copper, Current density, Flip-chip devices, Solder joints, Solders, Temperature, Tin, Joules, Reliability

Journal Articles

Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip

Zhankun Li, Zhekun Fan, Long Dou, Zhong Jin, Zhan Liu, Junhui Li

J. Electron. Packag. September 2022, 144(3): 031007.

Paper No: EP-21-1039

DOI: https://doi.org/10.1115/1.4051468

Published Online: September 15, 2021

View Article titled, Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip

Topics: Flip-chip, Flip-chip devices, Reliability, Thermal conductivity, Temperature, Current density

Journal Articles

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata

J. Electron. Packag. June 2022, 144(2): 021102.

Paper No: EP-21-1053

DOI: https://doi.org/10.1115/1.4052231

Published Online: September 13, 2021

View Article titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model

Topics: Creep, Current density, Electrodiffusion, Solder joints, Temperature, Anodes, Plasticity, Stress

Journal Articles

Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

J. Electron. Packag. September 2020, 142(3): 031107.

Paper No: EP-19-1129

DOI: https://doi.org/10.1115/1.4046849

Published Online: April 24, 2020

View Article titled, Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

Topics: Circuits, Damage, Electrodiffusion, Failure analysis, Flexible electronics, Inks, Metals, Nanoparticles, Reliability, Density

Journal Articles

Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect

Yasuhiro Kimura, Masumi Saka

J. Electron. Packag. June 2019, 141(2): 021008.

Paper No: EP-18-1073

DOI: https://doi.org/10.1115/1.4042980

Published Online: April 10, 2019

View Article titled, Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect

Topics: Current density, Electrodiffusion, Finite element analysis, Flow (Dynamics), Electric potential, Anodes, Damage, Density, Solders, Atoms

Journal Articles

Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections

Takeru Kato, Ken Suzuki, Hideo Miura

J. Electron. Packag. June 2017, 139(2): 020911.

Paper No: EP-16-1144

DOI: https://doi.org/10.1115/1.4036442

Published Online: June 12, 2017

View Article titled, Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections

Topics: Atoms, Copper, Current density, Diffusion (Physics), Electrodiffusion, Grain boundaries, Reliability, Temperature, Thin films, Heating

Journal Articles

Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density

Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma

J. Electron. Packag. December 2014, 136(4): 041011.

Paper No: EP-13-1125

DOI: https://doi.org/10.1115/1.4026878

Published Online: September 19, 2014

View Article titled, Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density

Topics: Carbon nanotubes, Current density, Damage, Multi-walled carbon nanotubes, Oxidation, Density, Electrodes, Atoms, Carbon, Evaporation

Journal Articles

A Multiphysics Finite Element Model of a 35A Automotive Connector Including Multiscale Rough Surface Contact

Santosh V. Angadi, Robert L. Jackson, Song-yul Choe, George T. Flowers, Bong-Yi Lee, Liang Zhong

J. Electron. Packag. March 2012, 134(1): 011001.

DOI: https://doi.org/10.1115/1.4005955

Published Online: March 19, 2012

View Article titled, A Multiphysics Finite Element Model of a 35A Automotive Connector Including Multiscale Rough Surface Contact

Topics: Cables, Contact resistance, Finite element model, Heating, Surface roughness, Temperature, Joules, Current density, Stress, Flow (Dynamics)

Journal Articles

Prediction of Electromigration Failure of Solder Joints and Its Sensitivity Analysis

Lihua Liang, Yuanxiang Zhang, Yong Liu

J. Electron. Packag. September 2011, 133(3): 031002.

DOI: https://doi.org/10.1115/1.4004658

Published Online: September 14, 2011

View Article titled, Prediction of Electromigration Failure of Solder Joints and Its Sensitivity Analysis

Topics: Algorithms, Density, Electrodiffusion, Failure, Sensitivity analysis, Simulation, Solder joints, Solders, Current density, Stress

Journal Articles

Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films

X. Zhao, M. Saka, M. Yamashita, F. Togoh

J. Electron. Packag. June 2010, 132(2): 021003.

DOI: https://doi.org/10.1115/1.4001687

Published Online: June 11, 2010

View Article titled, Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films

Topics: Current density, Diffusion (Physics), Electrodiffusion, Grain boundary diffusion, Grain size, Temperature, Sputtering (Irradiation), Circuits, Damage, Strips

Journal Articles

Electromigration Simulation for Metal Lines

JianPing Jing, Lihua Liang, Guang Meng

J. Electron. Packag. March 2010, 132(1): 011002.

DOI: https://doi.org/10.1115/1.4000716

Published Online: March 4, 2010

View Article titled, Electromigration Simulation for Metal Lines

Topics: Algorithms, Atoms, Density, Electrodiffusion, Simulation, Stress, Current density, Failure, Metals, Temperature

Journal Articles

Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints

Hao Lu, Chun Yu, Peilin Li, Junmei Chen

J. Electron. Packag. September 2008, 130(3): 031008.

DOI: https://doi.org/10.1115/1.2957322

Published Online: August 1, 2008

View Article titled, Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints

Topics: Current density, Electrodiffusion, Finite element analysis, Lead-free solders, Solder joints, Solders, Tin

Journal Articles

Effect of Test Conditions on Electromigration Reliability of Sn - Ag - Cu Flip-Chip Solder Interconnects

Yi-Shao Lai, Chiu-Wen Lee, Chin-Li Kao

J. Electron. Packag. March 2007, 129(1): 56–62.

DOI: https://doi.org/10.1115/1.2429710

Published Online: May 19, 2006

View Article titled, Effect of Test Conditions on Electromigration Reliability of Sn - Ag - Cu Flip-Chip Solder Interconnects

Topics: Electrodiffusion, Flip-chip, Reliability, Solders, Tin, Current density, Temperature, Temperature distribution

Journal Articles

Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

C. Basaran, H. Ye, D. C. Hopkins, D. Frear, J. K. Lin

J. Electron. Packag. June 2005, 127(2): 157–163.

DOI: https://doi.org/10.1115/1.1898338

Published Online: September 15, 2004

View Article titled, Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

Topics: Current density, Electrodiffusion, Failure, Flip-chip, Flip-chip devices, Solder joints, Failure mechanisms, Nucleation (Physics)

Journal Articles

A New Approach to Calculate Atomic Flux Divergence by Electromigration

K. Sasagawa, N. Nakamura, M. Saka, H. Abe´

J. Electron. Packag. December 1998, 120(4): 360–366.

DOI: https://doi.org/10.1115/1.2792647

Published Online: December 1, 1998

View Article titled, A New Approach to Calculate Atomic Flux Divergence by Electromigration

Topics: Electrodiffusion, Corners (Structural elements), Current density, Temperature, Computational methods

Journal Articles

Time-Dependent Ductility of Electro-Deposited Copper

Yoshiki Oshida, P. C. Chen, J. D. Reid, T. Nishihara

J. Electron. Packag. December 1992, 114(4): 448–454.

DOI: https://doi.org/10.1115/1.2905479

Published Online: December 1, 1992

View Article titled, Time-Dependent Ductility of Electro-Deposited Copper

Topics: Copper, Ductility, Temperature, Annealing, Current density, Dislocation density, Electrodes, Electrons, Film thickness, Grain size

Journal citation

NARROW

Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model

Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect

Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections

Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density

A Multiphysics Finite Element Model of a 35A Automotive Connector Including Multiscale Rough Surface Contact

Prediction of Electromigration Failure of Solder Joints and Its Sensitivity Analysis

Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films

Electromigration Simulation for Metal Lines

Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints

Effect of Test Conditions on Electromigration Reliability of Sn - Ag - Cu Flip-Chip Solder Interconnects

Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

A New Approach to Calculate Atomic Flux Divergence by Electromigration

Time-Dependent Ductility of Electro-Deposited Copper

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