1-20 of 302
Cooling
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling

Jimil M. Shah, Thomas Crandall, Phillip E. Tuma
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041101.
Paper No: EP-22-1089
DOI: https://doi.org/10.1115/1.4062403
Published Online: May 15, 2023
View Article titled, Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling
Click here to open pdf in another window PDF for Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling
Topics: Boilers, Boiling, Bose-Einstein condensates, Cooling, Fluids, Junctions, Slug flows, Temperature, Thermal resistance, Vehicles
Journal Articles

Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning

Accepted Manuscript
Linmeng Xu, Wanying Zhao, Junhui Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-22-1063
DOI: https://doi.org/10.1115/1.4062530
Published Online: May 15, 2023
View Article titled, Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning
Click here to open pdf in another window PDF for Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning
Topics: Cooling, Simulation, Computer software, Convection, Cooling systems, Energy conservation, Finite element analysis, Finite element methods, Hardware, Heat
Journal Articles

HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions

Ange Christian Iradukunda, David Huitink, Kevin Kayijuka, Tarek Gebrael, Nenad Miljkovic
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011105.
Paper No: EP-22-1022
DOI: https://doi.org/10.1115/1.4056031
Published Online: November 11, 2022
View Article titled, HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions
Click here to open pdf in another window PDF for HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions
Topics: Coolants, Electrodes, Flow (Dynamics), Fluids, Temperature, Cooling
Journal Articles

Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft

Joshua Kasitz, Aniket Ajay Lad, Muhammad Jahidul Hoque, Nenad Miljkovic, David Huitink
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011101.
Paper No: EP-22-1023
DOI: https://doi.org/10.1115/1.4055464
Published Online: September 27, 2022
View Article titled, Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft
Click here to open pdf in another window PDF for Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft
Topics: Aircraft, Cooling, Cooling systems, Flight, Heat exchangers, Stress, Temperature, Thermal management, Transients (Dynamics), Motors
Journal Articles

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021001.
Paper No: EP-22-1003
DOI: https://doi.org/10.1115/1.4054972
Published Online: August 8, 2022
View Article titled, Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
Click here to open pdf in another window PDF for Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
Topics: Computers, Cooling, Copper, Corrosion, Nickel plating, Plates (structures), Pressure drop, Temperature, Thermal resistance, Flow (Dynamics)
Journal Articles

Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology

Mohammad I. Tradat, Yaman “Mohammad Ali” Manaserh, Ahmad Gharaibeh, Bahgat G. Sammakia, Dave Hall, Kourosh Nemati, Mark Seymour
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031015.
Paper No: EP-21-1151
DOI: https://doi.org/10.1115/1.4053890
Published Online: March 8, 2022
View Article titled, Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology
Click here to open pdf in another window PDF for Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology
Topics: Air flow, Computational fluid dynamics, Cooling, Data centers, Flow (Dynamics), Pressure, Temperature, Tiles, Modeling
Journal Articles

Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Wei Tong, Alireza Ganjali, Omidreza Ghaffari, Chady al Sayed, Luc Fréchette, Julien Sylvestre
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041011.
Paper No: EP-21-1119
DOI: https://doi.org/10.1115/1.4053310
Published Online: January 28, 2022
View Article titled, Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
Click here to open pdf in another window PDF for Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
Topics: Boiling, Cooling, Heat, Heat transfer coefficients, Temperature, Critical heat flux, Temperature distribution, Flat heat pipes
Journal Articles

Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers

Pardeep Shahi, Apruv Pravin Deshmukh, Hardik Yashwant Hurnekar, Satyam Saini, Pratik Bansode, Rajesh Kasukurthy, Dereje Agonafer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041008.
Paper No: EP-21-1115
DOI: https://doi.org/10.1115/1.4052324
Published Online: November 22, 2021
View Article titled, Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers
Click here to open pdf in another window PDF for Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers
Topics: Computational fluid dynamics, Cooling, Design, Flow (Dynamics), Flow control, Valves, Pressure drop
Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
DOI: https://doi.org/10.1115/1.4052767
Published Online: November 22, 2021
View Article titled, Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
Click here to open pdf in another window PDF for Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities
Journal Articles

Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging

Palash V. Acharya, Manojkumar Lokanathan, Abdelhamid Ouroua, Robert Hebner, Shannon Strank, Vaibhav Bahadur
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041109.
Paper No: EP-21-1087
DOI: https://doi.org/10.1115/1.4052814
Published Online: November 5, 2021
View Article titled, Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging
Click here to open pdf in another window PDF for Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging
Topics: Algorithms, Artificial neural networks, Bridges (Structures), Cooling, Heat sinks, Junctions, Machine learning, Machinery, Simulation, Steady state
Includes: Supplementary data
Journal Articles

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Jimmy Chuang, Jin Yang, David Shia, Y. L. Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041108.
Paper No: EP-21-1037
DOI: https://doi.org/10.1115/1.4052711
Published Online: November 2, 2021
View Article titled, Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies
Click here to open pdf in another window PDF for Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies
Topics: Boiling, Cooling, Electronic packages, Injection molding, Metals, Printing, Additive manufacturing, Flat heat pipes, Manufacturing
Journal Articles

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

Jimil M. Shah, Keerthivasan Padmanaban, Hrishabh Singh, Surya Duraisamy Asokan, Satyam Saini, Dereje Agonafer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021109.
Paper No: EP-21-1016
DOI: https://doi.org/10.1115/1.4052536
Published Online: October 14, 2021
View Article titled, Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling
Click here to open pdf in another window PDF for Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling
Topics: Cables, Cooling, Cycles, Fluids, Mineral oil, Printed circuit boards, Reliability, Temperature, Capacitance, Optical cables
Journal Articles

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Kidus Guye, De Dong, Yunseo Kim, Hyoungsoon Lee, Baris Dogruoz, Damena Agonafer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041106.
Paper No: EP-21-1120
DOI: https://doi.org/10.1115/1.4052465
Published Online: October 13, 2021
View Article titled, Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer
Click here to open pdf in another window PDF for Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer
Topics: Design, Drops, Evaporation, Heat conduction, Heat transfer, Heat transfer coefficients, Optimization, Particle swarm optimization, Shapes, Vapors
Journal Articles

Coupled Calculations of Data Center Cooling and Power Distribution Systems

Aaron P. Wemhoff, Faisal Ahmed
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041002.
Paper No: EP-21-1044
DOI: https://doi.org/10.1115/1.4052101
Published Online: October 6, 2021
View Article titled, Coupled Calculations of Data Center Cooling and Power Distribution Systems
Click here to open pdf in another window PDF for Coupled Calculations of Data Center Cooling and Power Distribution Systems
Topics: Cooling, Cooling systems, Data centers, Power systems (Machinery), Stress, Energy efficiency, Electronic systems, Uncertainty
Journal Articles

Recent Developments in Air Pumps for Thermal Management of Electronics

Tsrong-Yi Wen, Jia-Cheng Ye
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. September 2022, 144(3): 030802.
Paper No: EP-20-1109
DOI: https://doi.org/10.1115/1.4051970
Published Online: October 1, 2021
View Article titled, Recent Developments in Air Pumps for Thermal Management of Electronics
Click here to open pdf in another window PDF for Recent Developments in Air Pumps for Thermal Management of Electronics
Topics: Pumps, Flow (Dynamics), Diaphragms (Mechanical devices), Diaphragms (Structural), Fans, Electronics, Cooling
Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021105.
Paper No: EP-21-1012
DOI: https://doi.org/10.1115/1.4052071
Published Online: September 24, 2021
View Article titled, A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics
Click here to open pdf in another window PDF for A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics
Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat
Journal Articles

A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling

Weicheng Shu, Xinfeng Zhang, Xuan Yang, Xiaobing Luo
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031010.
Paper No: EP-21-1079
DOI: https://doi.org/10.1115/1.4051754
Published Online: September 15, 2021
View Article titled, A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling
Click here to open pdf in another window PDF for A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling
Topics: Cooling, Temperature, Temperature control, Water, Water temperature, Weight (Mass)
Includes: Supplementary data
Journal Articles

Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Omidreza Ghaffari, Wei Tong, Yaser Nabavi Larimi, Chady al Sayed, Alireza Ganjali, Jean-François Morissette, Francis Grenier, Simon Jasmin, Luc Fréchette, Julien Sylvestre
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041103.
Paper No: EP-21-1083
DOI: https://doi.org/10.1115/1.4051943
Published Online: August 27, 2021
View Article titled, Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
Click here to open pdf in another window PDF for Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
Topics: Boiling, Cooling, Dielectric liquids, Heat, Temperature, Copper, Flat heat pipes, Pool boiling, Critical heat flux, Subcooling
Journal Articles

Viability of Cryogenic Cooling to Reduce Processor Power Consumption

Alec Nordlund, Matthew Harrison, Joshua Gess
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041101.
Paper No: EP-21-1034
DOI: https://doi.org/10.1115/1.4051752
Published Online: August 9, 2021
View Article titled, Viability of Cryogenic Cooling to Reduce Processor Power Consumption
Click here to open pdf in another window PDF for Viability of Cryogenic Cooling to Reduce Processor Power Consumption
Topics: Coolants, Cooling, Energy consumption, Flow (Dynamics), Nitrogen, Temperature, Design, Leakage, Solenoids, Thermal stability
Journal Articles

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Gilberto Moreno, Sreekant Narumanchi, Xuhui Feng, Paul Anschel, Steve Myers, Phil Keller
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011004.
Paper No: EP-20-1093
DOI: https://doi.org/10.1115/1.4049815
Published Online: August 6, 2021
View Article titled, Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions
Click here to open pdf in another window PDF for Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions
Topics: Cooling, Electronics, Fluids, Heat exchangers, Heat transfer, Thermal management, Thermal resistance, Vehicles, Heat, Temperature