Fig. 1 Proposed antenna-in-package structure adopting fan-out technology More

Fig. 2 Conventional ME dipole structure More

Fig. 3 Modified ME dipole with stacked patches More

Fig. 4 Simulation diagram of dual ME dipoles More

Fig. 5 Simulated results of the dual ME dipoles: ( a ) input reflection coefficient, ( b ) gain versus frequency in band, and ( c ) radiation pattern at 60 GHz More

Fig. 6 SIW fed by right-angle transition board: ( a ) top view and ( b ) side view More

Fig. 7 Simulated results for the right-angle transition structure More

Fig. 8 4 × 4 SIW ME dipole array fed by right-angle transition structure More

Fig. 9 Simulated results for the 4 × 4 SIW ME dipole array: ( a ) input reflection coefficient and ( b ) gain versus frequency More

Fig. 10 Simulated results for the 4 × 4 array with thicknesses of PCB cores and EMC increasing or reducing by 10%: ( a ) input reflection coefficient and ( b ) gain versus frequency More

Fig. 11 Thermal simulation structure with 1.12 W power consumption More

Fig. 12 Fan-out package for ansys warpage simulation: ( a ) top view and ( b ) side view More

Fig. 13 Warpage simulation results for ( a ) 27 °C and ( b ) 240 °C More

Fig. 14 Procedure for AiP fabrication and test board assembly More

Fig. 15 Test board for SIW antenna More

Fig. 16 Measured results of SIW antenna: ( a ) input reflection coefficient and ( b ) gain versus frequency More

Fig. 17 Radiation pattern at 60 GHz: ( a ) E-plane and ( b ) H-plane More

Fig. 18 Interface profile between the RO4350 substrate and EMC More

Fig. 19 Manufactured fan-out BGA More