About the Journal
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems
Diversity and Inclusion The Technical Committee on Publications and Communications endorses the commitment of ASME to support diversity and to create and ensure inclusive and ethical practices for publishing as well as the science and engineering professions.
Frequency: QuarterlyISSN: 1043-7398
Journal of Electronic Packaging (ISSN: 1043-7398), 1989 - Present
Announcements and Call for Papers
Impact Factor: 1.931
2021 Journal Citation Reports ®
(Clarivate Analytics, 2022)