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Issues
September 2021
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Review Article
A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling
J. Electron. Packag. September 2021, 143(3): 030801.
doi: https://doi.org/10.1115/1.4048861
Topics:
Heat sinks
,
Metal foams
,
Heat transfer
Research Papers
Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling
J. Electron. Packag. September 2021, 143(3): 031001.
doi: https://doi.org/10.1115/1.4049018
Topics:
Computational fluid dynamics
,
Coolants
,
Cooling
,
Flow (Dynamics)
,
Flow control
,
Matlab
,
Optimization
,
Plates (structures)
,
Temperature
,
Testing
Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint
J. Electron. Packag. September 2021, 143(3): 031002.
doi: https://doi.org/10.1115/1.4049128
Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams
J. Electron. Packag. September 2021, 143(3): 031003.
doi: https://doi.org/10.1115/1.4049173
Topics:
Density
,
Foams (Chemistry)
,
Heat transfer
,
Porosity
,
Reynolds number
,
Metal foams
,
Copper
,
Flow (Dynamics)
,
Jets
Flow-Controlled Spray Cooling Approaches for Dynamic Thermal Management
J. Electron. Packag. September 2021, 143(3): 031004.
doi: https://doi.org/10.1115/1.4049174
Topics:
Cooling
,
Flow (Dynamics)
,
Sprays
,
Temperature
,
Heat
Study of Different Dispensing Patterns of No-Flow Underfill Using Numerical and Experimental Methods
J. Electron. Packag. September 2021, 143(3): 031005.
doi: https://doi.org/10.1115/1.4049175
Topics:
Flow (Dynamics)
,
Pressure
,
Ball-Grid-Array packaging
Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes
J. Electron. Packag. September 2021, 143(3): 031006.
doi: https://doi.org/10.1115/1.4049564
Topics:
Cooling
,
Flow (Dynamics)
,
Heat
,
Heat flux
,
Microchannels
,
Pumps
,
Refrigerants
,
Temperature
,
Electronics
,
Flux (Metallurgy)
Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap
J. Electron. Packag. September 2021, 143(3): 031007.
doi: https://doi.org/10.1115/1.4049814
Topics:
Computational fluid dynamics
,
Cooling
,
Integrated circuits
,
Leakage
,
Simulation
,
Temperature
,
Transients (Dynamics)
,
Fins
,
Steady state
,
Heat
Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules
J. Electron. Packag. September 2021, 143(3): 031008.
doi: https://doi.org/10.1115/1.4049577
Topics:
Deflection
,
Design
,
Finite element analysis
,
Light-emitting diodes
,
Manufacturing
,
Stress
,
Testing
,
Simulation
,
Finite element model
,
Engineering prototypes
Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets
J. Electron. Packag. September 2021, 143(3): 031009.
doi: https://doi.org/10.1115/1.4049579
Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores
J. Electron. Packag. September 2021, 143(3): 031010.
doi: https://doi.org/10.1115/1.4049129
Topics:
Columns (Structural)
,
Manufacturing
,
Polymers
,
Reliability
,
Temperature
,
Silicon chips
,
Bonding
Technical Brief
Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology
Jerzy Szałapak, Konrad Kiełbasiński, Łucja Dybowska-Sarapuk, Jakub Krzeminski, Marian Teodorczyk, Tomasz Kowaluk, Małgorzata Jakubowska
J. Electron. Packag. September 2021, 143(3): 034501.
doi: https://doi.org/10.1115/1.4049240
Topics:
Carbon
,
Carbon nanotubes
,
Electrical resistivity
,
Graphene
,
Nanoparticles
,
Silver
,
Thermal conductivity
,
Temperature
,
Joining
,
High temperature
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Optimization of Micropillars Electroplating Bonding Processes and Additives
J. Electron. Packag (June 2025)
Microbead Encapsulation for Protection of Electronic Components
J. Electron. Packag (June 2025)