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Issues
June 2013
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module
J. Electron. Packag. June 2013, 135(2): 021001.
doi: https://doi.org/10.1115/1.4023215
Topics:
Cooling
,
Flow (Dynamics)
,
Fluids
,
Heat transfer coefficients
,
Temperature
,
Vapors
,
Thermal resistance
,
Pressure drop
,
Thermal management
Study on Heat Conduction in a Simulated Multicore Processor Chip—Part I: Analytical Modeling
J. Electron. Packag. June 2013, 135(2): 021002.
doi: https://doi.org/10.1115/1.4023291
Topics:
Heat
,
Temperature
,
Heat conduction
Study on Heat Conduction in a Simulated Multicore Processor Chip—Part II: Case Studies
J. Electron. Packag. June 2013, 135(2): 021003.
doi: https://doi.org/10.1115/1.4023292
Topics:
Cooling
,
Heat
,
Heat transfer coefficients
,
Temperature
,
Heat conduction
,
Heat sinks
,
Dimensions
Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints
J. Electron. Packag. June 2013, 135(2): 021004.
doi: https://doi.org/10.1115/1.4023846
Topics:
Solder joints
,
Soldering
,
Solders
,
Temperature
,
Tin
,
Intermetallic compounds
Promising Technology for Electronic Cooling: Nanofluidic Micro Pulsating Heat Pipes
J. Electron. Packag. June 2013, 135(2): 021005.
doi: https://doi.org/10.1115/1.4023847
Topics:
Computer cooling
,
Ferrofluids
,
Fluids
,
Heat pipes
,
Heating
,
Magnetic fields
,
Nanofluids
,
Thermal resistance
,
Water
,
Heat transfer
Effect of Indium Content on the Melting Point, Dross, and Oxidation Characteristics of Sn-2Ag-3Bi-xIn Solders
J. Electron. Packag. June 2013, 135(2): 021006.
doi: https://doi.org/10.1115/1.4023529
Development of Accelerated Method for Thermal Cycling in Electronic Packaging Application
J. Electron. Packag. June 2013, 135(2): 021007.
doi: https://doi.org/10.1115/1.4023911
Topics:
Temperature
,
Wire
,
Cycles
,
Polysilicon
Comparative Study of Thermal Performance of Longitudinal and Transversal-Wavy Microchannel Heat Sinks for Electronic Cooling
J. Electron. Packag. June 2013, 135(2): 021008.
doi: https://doi.org/10.1115/1.4023530
Topics:
Heat transfer
,
Microchannels
,
Heat sinks
,
Pressure drop
,
Reynolds number
,
Flow (Dynamics)
Application of Kriging and Radial Basis Function for Reliability Optimization in Power Modules
J. Electron. Packag. June 2013, 135(2): 021009.
doi: https://doi.org/10.1115/1.4024056
Topics:
Aluminum
,
Design
,
Optimization
,
Wire
,
Warping
,
Finite element analysis
,
Reliability
,
Failure
Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging
J. Electron. Packag. June 2013, 135(2): 021010.
doi: https://doi.org/10.1115/1.4024013
Topics:
High temperature
,
Packaging
,
Reliability
,
Stress
,
Wire
,
Failure mechanisms
,
Temperature
,
Semiconductors (Materials)
,
Nanoscale phenomena
,
Nanoelectronics
Thermally Actuated Microswitches: Computation of Power Requirements for Alternate Heating Configurations
J. Electron. Packag. June 2013, 135(2): 021011.
doi: https://doi.org/10.1115/1.4024012
Topics:
Heat
,
Heating
,
Switches
,
Displacement
,
Simulation
,
Steady state
,
Bridges (Structures)
,
Boundary-value problems
Technical Briefs
A Novel Low Cost Package for Radio Frequency Applications
J. Electron. Packag. June 2013, 135(2): 024501.
doi: https://doi.org/10.1115/1.4023041
Topics:
Design
,
Laminates
,
Manufacturing
,
Simulation
,
Strip transmission lines
,
Strips
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