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Issues
March 2010
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Design of a Static TIM Tester
J. Electron. Packag. March 2010, 132(1): 011001.
doi: https://doi.org/10.1115/1.4000715
Topics:
Design
,
Errors
,
Flow (Dynamics)
,
Heat
,
Heat flux
,
Sensors
,
Temperature
,
Thermal resistance
Electromigration Simulation for Metal Lines
J. Electron. Packag. March 2010, 132(1): 011002.
doi: https://doi.org/10.1115/1.4000716
Topics:
Algorithms
,
Atoms
,
Density
,
Electrodiffusion
,
Simulation
,
Stress
,
Current density
,
Failure
,
Metals
,
Temperature
Evaluation of Stress Effects on Electrical Characteristics of N-Type MOSFETs: Variations of DC Characteristics During the Resin-Molding Process
J. Electron. Packag. March 2010, 132(1): 011003.
doi: https://doi.org/10.1115/1.4000718
Topics:
Electron mobility
,
Molding
,
Resins
,
Stress
,
Silicon
An Inverse Problem in Estimating the Volumetric Heat Generation for a Three-Dimensional Encapsulated Chip
J. Electron. Packag. March 2010, 132(1): 011004.
doi: https://doi.org/10.1115/1.4000720
Topics:
Heat
,
Inverse problems
,
Temperature
,
Heat conduction
,
Errors
Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages
J. Electron. Packag. March 2010, 132(1): 011005.
doi: https://doi.org/10.1115/1.4000754
Topics:
Constitutive equations
,
Creep
,
Density
,
Fatigue
,
Finite element methods
,
Hardening
,
Lead-free solders
,
Modeling
,
Reliability
,
Semiconductor wafers
Numerical and Experimental Study of Interface Delamination in Flip Chip BGA Package
J. Electron. Packag. March 2010, 132(1): 011006.
doi: https://doi.org/10.1115/1.4001145
Topics:
Ball-Grid-Array packages
,
Delamination
,
Flip-chip
,
Flip-chip devices
,
Fracture (Materials)
,
Shrinkage (Materials)
,
Stress
,
Temperature
,
Epoxy resins
,
Molding
High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer
J. Electron. Packag. March 2010, 132(1): 011007.
doi: https://doi.org/10.1115/1.4001229
Topics:
Adhesives
,
Coating processes
,
Coatings
,
Copper
,
Particulate matter
,
Contact resistance
,
Anisotropy
,
Polymers
,
Fillers (Materials)
Technical Briefs
Evaluation of Transverse Shear Effect on Film Delamination in Blister Test
J. Electron. Packag. March 2010, 132(1): 014501.
doi: https://doi.org/10.1115/1.4000717
Topics:
Delamination
,
Shear (Mechanics)
,
Film thickness
Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement
J. Electron. Packag. March 2010, 132(1): 014502.
doi: https://doi.org/10.1115/1.4000719
Topics:
Cavities
,
Computer simulation
,
Epoxy adhesives
,
Epoxy resins
,
Finite difference methods
,
Flow (Dynamics)
,
Integrated circuits
,
Molding
,
Pressure
,
Simulation
Book Reviews
Mechanical Design of Electronic Systems
J. Electron. Packag. March 2010, 132(1): 016501.
doi: https://doi.org/10.1115/1.4000755
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Optimization of Micropillars Electroplating Bonding Processes and Additives
J. Electron. Packag (June 2025)
Microbead Encapsulation for Protection of Electronic Components
J. Electron. Packag (June 2025)
