Topics: Creep , Lead-free solders , Semiconductor wafers , Shear (Mechanics) , Solder joints , Taguchi methods , Temperature , Solders , Low temperature

Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder

David M. Pierce, Sheri D. Sheppard, Arlo F. Fossum, Paul T. Vianco, Mike K. Neilsen

J. Electron. Packag. March 2008, 130(1): 011002. doi: https://doi.org/10.1115/1.2837513

Abstract

View articletitled, Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder

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Topics: Constitutive equations , Creep , Damage , Finite element analysis , Plasticity , Simulation , Solders , Temperature , Stress , Fatigue

Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects

David M. Pierce, Sheri D. Sheppard, Paul T. Vianco, Jerome A. Regent, J. Mark Grazier

J. Electron. Packag. March 2008, 130(1): 011003. doi: https://doi.org/10.1115/1.2837515

Abstract

View articletitled, Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects

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Topics: Ball-Grid-Array packaging , Cycles , Fatigue cracks , Fatigue life , Finite element analysis , Fracture (Materials) , Manufacturing , Solder joints , Solders , Lead-free solders

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

Changsoo Jang, Seungbae Park, Bongtae Han, Samson Yoon

J. Electron. Packag. March 2008, 130(1): 011004. doi: https://doi.org/10.1115/1.2837521

Abstract

View articletitled, Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

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Topics: Diffusion (Physics) , Temperature , Transients (Dynamics) , Finite difference methods

Reliability of Fine Pitch Sn–3.8Ag–0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB

Dezhi Li, Changqing Liu, Paul P. Conway

J. Electron. Packag. March 2008, 130(1): 011005. doi: https://doi.org/10.1115/1.2837522

Abstract

View articletitled, Reliability of Fine Pitch Sn–3.8Ag–0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB

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Topics: Flip-chip , Flip-chip devices , Reliability , Solder joints , Solders , Tin , Solder masks , Failure , Fracture (Materials) , Cycles

Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection

Yung-Shin Tseng, Tzu-Chen Hung, Bau-Shei Pei

J. Electron. Packag. March 2008, 130(1): 011006. doi: https://doi.org/10.1115/1.2837524

Abstract

View articletitled, Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection

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Topics: Computational fluid dynamics , Cooling , Heat transfer , Natural convection , Temperature , Flow (Dynamics) , Thermal resistance , Computer cooling , Simulation

Investigation of Microporous Coatings and Mesoscale Evaporator Enhancements for Two-Phase Cooling of Electronic Components

Mark A. Trautman, Murli Tirumala, S. M. You

J. Electron. Packag. March 2008, 130(1): 011007. doi: https://doi.org/10.1115/1.2837509

Abstract

View articletitled, Investigation of Microporous Coatings and Mesoscale Evaporator Enhancements for Two-Phase Cooling of Electronic Components

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Topics: Boiling , Coatings , Cooling , Heat , Fluids , Fins , Heat conduction , Coating processes

Damage Initiation and Propagation in Voided Joints: Modeling and Experiment

Leila Jannesari Ladani, Abhijit Dasgupta

J. Electron. Packag. March 2008, 130(1): 011008. doi: https://doi.org/10.1115/1.2837562

Abstract

View articletitled, Damage Initiation and Propagation in Voided Joints: Modeling and Experiment

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Topics: Damage , Finite element analysis , Modeling , Solders , Durability , Solder joints , Creep

Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering

Wei Zhang, Chunqing Wang, Yanhong Tian

J. Electron. Packag. March 2008, 130(1): 011009. doi: https://doi.org/10.1115/1.2837518

Abstract

View articletitled, Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering

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Topics: Fibers , Solder joints , Soldering , Solders , Surface tension , Geometry , Shapes , Equilibrium (Physics) , Yaw

Boiling of Water at Subatmospheric Conditions With Enhanced Structures: Effect of Liquid Fill Volume

Aniruddha Pal, Yogendra Joshi

J. Electron. Packag. March 2008, 130(1): 011010. doi: https://doi.org/10.1115/1.2837523

Abstract

View articletitled, Boiling of Water at Subatmospheric Conditions With Enhanced Structures: Effect of Liquid Fill Volume

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Topics: Boiling , Pressure

Wiresweep Reduction via Direct Cavity Injection During Encapsulation of Stacked Chip-Scale Packages

Jason M. Brand, Salvatore A. Ruggero, Amip J. Shah

J. Electron. Packag. March 2008, 130(1): 011011. doi: https://doi.org/10.1115/1.2837561

Abstract

View articletitled, Wiresweep Reduction via Direct Cavity Injection During Encapsulation of Stacked Chip-Scale Packages

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Topics: Cavities , Compression , Flow (Dynamics) , Wire , Packaging , Stress , Vehicles , Deformation , Bonding

Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array Package

Andy Perkins, Suresh K. Sitaraman

J. Electron. Packag. March 2008, 130(1): 011012. doi: https://doi.org/10.1115/1.2837520

Abstract

View articletitled, Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array Package

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Topics: Ceramics , Failure , Fatigue life , Solder joints , Solders , Vibration , Stress , Cycles , Vehicles , Finite element model

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Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate

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Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability

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Research Papers

The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method

Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder

Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

Reliability of Fine Pitch Sn–3.8Ag–0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB

Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection

Investigation of Microporous Coatings and Mesoscale Evaporator Enhancements for Two-Phase Cooling of Electronic Components

Damage Initiation and Propagation in Voided Joints: Modeling and Experiment

Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering

Boiling of Water at Subatmospheric Conditions With Enhanced Structures: Effect of Liquid Fill Volume

Wiresweep Reduction via Direct Cavity Injection During Encapsulation of Stacked Chip-Scale Packages

Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array Package

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