Skip Nav Destination
Issues
December 2006
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages
J. Electron. Packag. December 2006, 128(4): 305–310.
doi: https://doi.org/10.1115/1.2351891
Optimization Study for a Parallel Plate Impingement Heat Sink
J. Electron. Packag. December 2006, 128(4): 311–318.
doi: https://doi.org/10.1115/1.2351893
Topics:
Design
,
Heat sinks
,
Fins
,
Pressure drop
,
Optimization
Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material
J. Electron. Packag. December 2006, 128(4): 319–323.
doi: https://doi.org/10.1115/1.2351895
Topics:
Boron
,
Contact resistance
,
Paraffin wax
,
Particulate matter
,
Pressure
,
Temperature
,
Thermal conductivity
,
Electrical conductance
,
Copper
Predicting the Liquid Formation for the Solder Joints in Flip Chip Technology
J. Electron. Packag. December 2006, 128(4): 331–338.
doi: https://doi.org/10.1115/1.2229216
Topics:
Flip-chip devices
,
Solder joints
,
Solders
,
Surface tension
,
Shapes
,
Flip-chip
Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board
J. Electron. Packag. December 2006, 128(4): 339–345.
doi: https://doi.org/10.1115/1.2351897
Topics:
Aluminum
,
Damage
,
Life testing
,
Shock (Mechanics)
,
Stress
,
Vibration
,
Testing
,
Printed circuit boards
,
Cycles
,
Failure
The Exergy Cost of Information Processing: A Comparison of Computer-Based Technologies and Biological Systems
J. Electron. Packag. December 2006, 128(4): 346–352.
doi: https://doi.org/10.1115/1.2351899
Topics:
Brain
,
Computers
,
Exergy
,
Energy efficiency
Optimization of Synthetic Jet Fluidic Structures in Printed Wiring Boards
J. Electron. Packag. December 2006, 128(4): 353–359.
doi: https://doi.org/10.1115/1.2351900
An Exergy-Based Figure-of-Merit for Electronic Packages
J. Electron. Packag. December 2006, 128(4): 360–369.
doi: https://doi.org/10.1115/1.2351901
Topics:
Exergy
,
Energy dissipation
,
Junctions
,
Cooling
,
Heat sinks
,
Temperature
Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders
J. Electron. Packag. December 2006, 128(4): 370–379.
doi: https://doi.org/10.1115/1.2351902
Topics:
Flat heat pipes
,
Silicon
,
Surface roughness
,
Thermal resistance
,
Natural convection
,
Heat transfer
,
Heat
Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature
J. Electron. Packag. December 2006, 128(4): 380–387.
doi: https://doi.org/10.1115/1.2356866
Topics:
Ceilings
,
Data centers
,
Optimization
,
Temperature
,
Design
Cooling of Power Electronics by Embedded Solids
J. Electron. Packag. December 2006, 128(4): 388–397.
doi: https://doi.org/10.1115/1.2351903
Topics:
Cooling
,
Temperature
,
Aluminum
Effects of Dissolved Air on Subcooled Flow Boiling of a Dielectric Coolant in a Microchannel Heat Sink
J. Electron. Packag. December 2006, 128(4): 398–404.
doi: https://doi.org/10.1115/1.2351905
Topics:
Boiling
,
Bubbles
,
Flow (Dynamics)
,
Heat sinks
,
Heat transfer
,
Microchannels
,
Pressure drop
,
Temperature
,
Wall temperature
,
Flow instability
Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials
J. Electron. Packag. December 2006, 128(4): 405–411.
doi: https://doi.org/10.1115/1.2386242
Experimental Investigation of Heat Transfer in Impingement Air Cooled Plate Fin Heat Sinks
J. Electron. Packag. December 2006, 128(4): 412–418.
doi: https://doi.org/10.1115/1.2351906
Topics:
Flow (Dynamics)
,
Heat sinks
,
Heat transfer
,
Thermal resistance
Test Methods for Silicon Die Strength
J. Electron. Packag. December 2006, 128(4): 419–426.
doi: https://doi.org/10.1115/1.2351907
Topics:
Silicon
,
Stress
,
Semiconductor wafers
,
Failure
,
Surface roughness
,
Deflection
,
Finite element analysis
A Graphite Foams Based Vapor Chamber for Chip Heat Spreading
J. Electron. Packag. December 2006, 128(4): 427–431.
doi: https://doi.org/10.1115/1.2351908
Topics:
Fluids
,
Graphite
,
Thermal conductivity
,
Vapors
,
Thermal resistance
,
Ethanol
,
Foams (Chemistry)
,
Heat flux
Constructal Peripheral Cooling of a Rectangular Heat-Generating Area
J. Electron. Packag. December 2006, 128(4): 432–440.
doi: https://doi.org/10.1115/1.2351909
Topics:
Cooling
,
Heat
,
Flow (Dynamics)
,
Degrees of freedom
Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies
J. Electron. Packag. December 2006, 128(4): 441–448.
doi: https://doi.org/10.1115/1.2353280
Topics:
Ball-Grid-Array packaging
,
Manufacturing
,
Reliability
,
Stiffness
,
Mirrors
,
Cycles
,
Solder joints
,
Solders
,
Finite element analysis
,
Capacitors
Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components
J. Electron. Packag. December 2006, 128(4): 449–455.
doi: https://doi.org/10.1115/1.2353281
Topics:
Computer cooling
,
Cooling
,
Design
,
Finite element analysis
,
Finite element model
,
Optimization
,
Printed circuit boards
,
Screws
,
Testing
,
Materials properties
Graphite Foam Thermal Management of a High Packing Density Array of Power Amplifiers
J. Electron. Packag. December 2006, 128(4): 456–465.
doi: https://doi.org/10.1115/1.2353282
Topics:
Cooling
,
Flow (Dynamics)
,
Graphite
,
Thermal management
,
Temperature
,
Copper
,
Density
,
Packing (Shipments)
,
Packings (Cushioning)
Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment
J. Electron. Packag. December 2006, 128(4): 466–478.
doi: https://doi.org/10.1115/1.2353284
Topics:
Cooling
,
Design
,
Flow (Dynamics)
,
Heat
,
Heat transfer
,
Optimization
,
Simulation
,
Computer simulation
,
Pressure drop
,
Cooling systems
Research Papers
The Role of Fin Geometry in Heat Sink Performance
J. Electron. Packag. December 2006, 128(4): 324–330.
doi: https://doi.org/10.1115/1.2351896
Topics:
Drag (Fluid dynamics)
,
Entropy
,
Geometry
,
Heat sinks
,
Heat transfer
,
Reynolds number
,
Thermal resistance
,
Heat transfer coefficients
,
Viscosity
Technical Briefs
Singulation of Electronic Packages With Abrasive Waterjets
J. Electron. Packag. December 2006, 128(4): 479–483.
doi: https://doi.org/10.1115/1.2353328
Topics:
Cutting
,
Strips
,
Nozzles
,
Machinery
,
Flow (Dynamics)
Thermal Management of Electronics in Telecommunications Products: Designing for the Network Equipment Building System (NEBS) Standards
J. Electron. Packag. December 2006, 128(4): 484–493.
doi: https://doi.org/10.1115/1.2353327
Topics:
Temperature
,
Telecommunications
,
Heating
,
Reynolds number
Email alerts
RSS Feeds
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag