Topics: Ceramics , Cooling , Density , Epoxy resins , Finite element methods , Manufacturing , Microwaves , Reliability , System-in-package , Thermal expansion

Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

Woon-Seong Kwon, Hyoung-Joon Kim, Kyung-Wook Paik, Se-Young Jang, Soon-Min Hong

J. Electron. Packag. June 2004, 126(2): 202–207. doi: https://doi.org/10.1115/1.1756143

Abstract

View articletitled, Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

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Topics: Adhesion , Aluminum , Cycles , Damage , Delamination , Dielectric materials , Displacement , Flip-chip packages , Fracture (Materials) , Fracture (Process)

Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy

Qiang Xiao, Harold J. Bailey, William D. Armstrong

J. Electron. Packag. June 2004, 126(2): 208–212. doi: https://doi.org/10.1115/1.1756144

Abstract

View articletitled, Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy

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Topics: Alloys , Solders , Temperature , Eutectic alloys , Lead-free solders , Tin , Hardening , Tensile strength

Transport Phenomena in Two-Phase Micro-Channel Heat Sinks

Weilin Qu, Graduate Research Assistant, Student Mem. ASME, Issam Mudawar, Professor, Fellow ASME

J. Electron. Packag. June 2004, 126(2): 213–224. doi: https://doi.org/10.1115/1.1756145

Abstract

View articletitled, Transport Phenomena in Two-Phase Micro-Channel Heat Sinks

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Topics: Boiling , Flow (Dynamics) , Heat sinks , Microchannels , Pressure drop , Two-phase flow , Heat transfer , Water , Temperature , Hydrodynamic stability

Testing and Modeling of Solders Using New Test Device, Part 1: Models and Testing

Chandrakant S. Desai, Zhichao Wang, Russell Whitenack, Tribikram Kundu

J. Electron. Packag. June 2004, 126(2): 225–231. doi: https://doi.org/10.1115/1.1756146

Extract

View articletitled, Testing and Modeling of Solders Using New Test Device, Part 1: Models and Testing

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Topics: Failure , Solders , Stress , Temperature , Testing , Thermomechanics , Modeling , Electronic packaging , Fracture (Process) , Constitutive equations

Testing and Modeling of Solders Using New Test Device, Part 2: Calibration and Validation

Chandrakant S. Desai, Zhichao Wang, Russell Whitenack, Tribikram Kundu

J. Electron. Packag. June 2004, 126(2): 232–236. doi: https://doi.org/10.1115/1.1756147

Extract

View articletitled, Testing and Modeling of Solders Using New Test Device, Part 2: Calibration and Validation

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Topics: Calibration , Modeling , Solders , Temperature , Testing , Finite element analysis , Electronic packaging , Shear (Mechanics) , Stress , Boundary-value problems

Development of G-Helix Structure as Off-Chip Interconnect

Qi Zhu, Lunyu Ma, Suresh K. Sitaraman

J. Electron. Packag. June 2004, 126(2): 237–246. doi: https://doi.org/10.1115/1.1756148

Abstract

View articletitled, Development of G-Helix Structure as Off-Chip Interconnect

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Topics: Design , Displacement , Geometry , Manufacturing , Optimization , Packaging , Reliability , Solders , Stress , Thermomechanics

Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks

Duckjong Kim, Sung Jin Kim

J. Electron. Packag. June 2004, 126(2): 247–255. doi: https://doi.org/10.1115/1.1756149

Abstract

View articletitled, Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks

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Topics: Flow (Dynamics) , Fluid dynamics , Heat sinks , Heat transfer , Modeling , Porous materials , Temperature distribution , Permeability , Pressure drop

Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment

Raghuram V. Pucha, Krishna Tunga, James Pyland, Suresh K. Sitaraman

J. Electron. Packag. June 2004, 126(2): 256–264. doi: https://doi.org/10.1115/1.1756150

Abstract

View articletitled, Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment

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Topics: Avionics , Creep , Cycles , Military systems , Solders , Temperature , Damage

Warpage Analysis of Underfilled Wafers

Hai Ding, I. Charles Ume, Cheng Zhang

J. Electron. Packag. June 2004, 126(2): 265–270. doi: https://doi.org/10.1115/1.1707036

Abstract

View articletitled, Warpage Analysis of Underfilled Wafers

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Topics: Finite element analysis , Semiconductor wafers , Shades and shadows , Warping , Young's modulus , Design , Regression analysis , Regression models

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Characterization of Substrate Materials for System-in-a-Package Applications

Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy

Transport Phenomena in Two-Phase Micro-Channel Heat Sinks

Testing and Modeling of Solders Using New Test Device, Part 1: Models and Testing

Testing and Modeling of Solders Using New Test Device, Part 2: Calibration and Validation

Development of G-Helix Structure as Off-Chip Interconnect

Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks

Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment

Warpage Analysis of Underfilled Wafers

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