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Issues
March 2004
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Technical Papers
A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology
J. Electron. Packag. March 2004, 126(1): 1–7.
doi: https://doi.org/10.1115/1.1646419
A Hybrid Thermal Energy Storage Device, Part 2: Thermal Performance Figures of Merit
J. Electron. Packag. March 2004, 126(1): 8–13.
doi: https://doi.org/10.1115/1.1646420
Topics:
Design
,
Heat
,
Metals
,
Storage
,
Thermal energy storage
,
Temperature
Natural Convection and Passive Heat Rejection from Two Heat Sources Maintained at Different Temperatures on a Printed Circuit Board
J. Electron. Packag. March 2004, 126(1): 14–21.
doi: https://doi.org/10.1115/1.1635393
Topics:
Energy dissipation
,
Heat
,
Heat conduction
,
Natural convection
,
Printed circuit boards
,
Temperature
,
Copper
Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices
J. Electron. Packag. March 2004, 126(1): 22–25.
doi: https://doi.org/10.1115/1.1646421
Topics:
Solder joints
,
Solders
,
Surface tension
,
Wetting
Engineering of Superconductive Ceramics
J. Electron. Packag. March 2004, 126(1): 26–33.
doi: https://doi.org/10.1115/1.1646423
Topics:
Ceramics
,
Nanotechnology
,
Silver
,
Wire
,
Adhesion
,
Durability
,
Crystals
,
Copper
,
Temperature
The Moulded Electronic Package (MEP)
J. Electron. Packag. March 2004, 126(1): 34–36.
doi: https://doi.org/10.1115/1.1646424
Topics:
Electronic packages
,
Circuits
Why Gold Flash Can Be Detrimental to Long-Term Reliability
J. Electron. Packag. March 2004, 126(1): 37–40.
doi: https://doi.org/10.1115/1.1646425
Topics:
Corrosion
,
Reliability
,
Porosity
,
Diffusion (Physics)
,
Corrosion resistance
Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition
J. Electron. Packag. March 2004, 126(1): 41–47.
doi: https://doi.org/10.1115/1.1646426
Topics:
Ceramics
,
Deformation
,
Manufacturing
,
Solders
,
Temperature
,
Interferometry
,
Ball-Grid-Array packages
,
Stress
,
Displacement
Investigation of Flip-Chip Bonding for MEMS Applications
J. Electron. Packag. March 2004, 126(1): 48–51.
doi: https://doi.org/10.1115/1.1646427
Topics:
Bonding
,
Finite element analysis
,
Flip-chip
,
Microelectromechanical systems
,
Solder joints
,
Solders
,
Shapes
Optimum Gullwing Fillet Solder Joint Under Thermomechanical Forces
J. Electron. Packag. March 2004, 126(1): 52–56.
doi: https://doi.org/10.1115/1.1646429
Topics:
Solder joints
,
Solders
,
Stress
,
Surface tension
,
Thermomechanics
,
Wetting
,
Geometry
,
Shapes
,
Reliability
,
Finite element analysis
Interfacial Bond Stress Relationship for Gullwing Solder Joints
J. Electron. Packag. March 2004, 126(1): 57–59.
doi: https://doi.org/10.1115/1.1646428
Topics:
Solder joints
,
Stress
,
Thermomechanics
,
Solders
,
Shear (Mechanics)
Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components
J. Electron. Packag. March 2004, 126(1): 60–66.
doi: https://doi.org/10.1115/1.1647124
Topics:
Flow (Dynamics)
,
Heat sinks
,
Microchannels
,
Thermal resistance
,
Computer simulation
,
Cooling
Design of Cast Pin Fin Coldwalls for Air-Cooled Electronics Systems
J. Electron. Packag. March 2004, 126(1): 67–73.
doi: https://doi.org/10.1115/1.1648063
Topics:
Design
,
Flow (Dynamics)
,
Heat transfer
,
Pressure drop
,
Electronics
An Improved Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects
J. Electron. Packag. March 2004, 126(1): 74–81.
doi: https://doi.org/10.1115/1.1648058
Topics:
Die cutting
,
Displacement
,
Manufacturing
,
Shear (Mechanics)
,
Shear deformation
,
Shearing (Deformation)
,
Solders
,
Stress
,
Temperature
A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film
Naotaka Tanaka, Senior Researcher, Kenya Kawano, Researcher, Hideo Miura, Chief Researcher, Yoshiyuki Kado, Engineer, Ikuo Yoshida, Senior Engineer
J. Electron. Packag. March 2004, 126(1): 82–86.
doi: https://doi.org/10.1115/1.1648059
Topics:
Adhesives
,
Deformation
,
Relaxation (Physics)
,
Reliability
,
Stress
,
Temperature
,
Design
,
Glass transition
,
Elasticity
Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation
J. Electron. Packag. March 2004, 126(1): 87–93.
doi: https://doi.org/10.1115/1.1648062
Topics:
Heat
,
Nanoindentation
,
Recrystallization
,
Stress
,
Wire
,
Secondary ion mass spectrometry
,
Temperature
,
Bonding
,
Elastic moduli
,
Manganese (Metal)
Research of Underfill Delamination in Flip Chip by the J-Integral Method
J. Electron. Packag. March 2004, 126(1): 94–99.
doi: https://doi.org/10.1115/1.1648061
Failure Analysis of Miniature Solder Specimen
J. Electron. Packag. March 2004, 126(1): 100–105.
doi: https://doi.org/10.1115/1.1648060
Topics:
Damage
,
Failure analysis
,
Finite element analysis
,
Solders
,
Creep
,
Fatigue
,
Constitutive equations
,
Nonequilibrium thermodynamics
,
Stress
,
Displacement
The Peeling Moment–A Key Rule for Delamination Resistance in I.C. Assemblies
J. Electron. Packag. March 2004, 126(1): 106–109.
doi: https://doi.org/10.1115/1.1649240
Topics:
Delamination
,
Stress
,
Temperature
,
Design
Effects of Wafer Thinning Condition on the Roughness, Morphology and Fracture Strength of Silicon Die
J. Electron. Packag. March 2004, 126(1): 110–114.
doi: https://doi.org/10.1115/1.1647123
Topics:
Fracture toughness
,
Grinding
,
Semiconductor wafers
,
Surface roughness
,
Polishing
,
Plasma etching
A Note on Suhir’s Solution of Thermal Stresses for a Die-Substrate Assembly
J. Electron. Packag. March 2004, 126(1): 115–119.
doi: https://doi.org/10.1115/1.1648056
Topics:
Manufacturing
,
Stress
,
Thermal stresses
,
Warping
,
Finite element analysis
,
Shear (Mechanics)
,
Deformation
Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding
J. Electron. Packag. March 2004, 126(1): 120–123.
doi: https://doi.org/10.1115/1.1649238
Topics:
Annealing
,
Bonding
,
Glass
,
Semiconductor wafers
,
Temperature
,
Surface roughness
,
Scanning probe microscopy
Air Flow and Heat Transfer in Fan Cooled Electronic Systems
J. Electron. Packag. March 2004, 126(1): 124–134.
doi: https://doi.org/10.1115/1.1649241
Topics:
Flow (Dynamics)
,
Heat transfer
,
Temperature
,
Air flow
,
Electronic systems
Analysis of Interfacial Cracking in Flip Chip Packages With Viscoplastic Solder Deformation
J. Electron. Packag. March 2004, 126(1): 135–141.
doi: https://doi.org/10.1115/1.1649242
Topics:
Deformation
,
Flip-chip
,
Flip-chip devices
,
Fracture (Materials)
,
Solders
,
Stress
,
Fracture (Process)
,
Flip-chip packages
Controlled Fracture of Nonmetallic Thin Wafers Using a Laser Thermal Shock Method
J. Electron. Packag. March 2004, 126(1): 142–147.
doi: https://doi.org/10.1115/1.1649245
Topics:
Fracture (Materials)
,
Laser beams
,
Lasers
,
Microcracks
,
Semiconductor wafers
,
Thermal shock
,
Thermal stresses
,
Temperature
Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications
J. Electron. Packag. March 2004, 126(1): 148–158.
doi: https://doi.org/10.1115/1.1649246
Topics:
Algorithms
,
Computer simulation
,
Constitutive equations
,
Damage
,
Hardening
,
Shear (Mechanics)
,
Solders
,
Stress
,
Viscoplasticity
,
Finite element analysis
Transient Convective Heat Transfer of Air Jet Impinging Onto a Confined Ceramic-Based MCM Disk
Li-Kang Liu, Graduate Student, Wen-Shien Su, Graduate Student, Ying-Huei Hung, Professor, Fellow ASME
J. Electron. Packag. March 2004, 126(1): 159–172.
doi: https://doi.org/10.1115/1.1649239
Topics:
Disks
,
Heat transfer
,
Transients (Dynamics)
,
Steady state
,
Convection
,
Ceramics
,
Reynolds number
Technical Brief
CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering
J. Electron. Packag. March 2004, 126(1): 173–176.
doi: https://doi.org/10.1115/1.1646422
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Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag