Recent advances in flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be presented in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended.

Issue Section:
Review Article
Keywords:
3D packaging, High density interconnects, Underfill, Wafer level packaging
Topics:
Bonding, Flip-chip, Flip-chip assemblies, Flip-chip devices, Manufacturing, Semiconductor wafers, Solders, Columns (Structural), Silicon, Packaging, Solder joints

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