With the ever increasing heat dissipated by information technology (IT) equipment housed in data centers, it is becoming more important to project the changes that can occur in the data center as the newer higher powered hardware is installed. The computational fluid dynamics (CFD) software that is available has improved over the years. CFD software specific to data center thermal analysis has also been developed. This has improved the time lines of providing some quick analysis of the effects of new hardware into the data center. But it is critically important that this software provide a good report to the user of the effects of adding this new hardware. It is the purpose of this paper to examine a large cluster installation and compare the CFD analysis with environmental measurements obtained from the same site. This paper shows measurements and CFD data for high powered racks as high as 27 kW clustered such that heat fluxes in some regions of the data center exceeded 700 W per square foot. This paper describes the thermal profile of a high performance computing cluster located in an data center and a comparison of that cluster modeled via CFD. The high performance advanced simulation and computing (ASC) cluster had a peak performance of 77.8 TFlop/s, and employed more than 12,000 processors, 50 Tbytes of memory, and 2 Pbytes of globally accessible disk space. The cluster was first tested in the manufacturer’s development laboratory in Poughkeepsie, New York, and then shipped to Lawrence Livermore National Laboratory in Livermore, California, where it was installed to support the national security mission of the U.S. Detailed measurements were taken in both data centers and were previously reported. The Poughkeepsie results will be reported here along with a comparison to CFD modeling results. In some areas of the Poughkeepsie data center, there were regions that did exceed the equipment inlet air temperature specifications by a significant amount. These areas will be highlighted and reasons given on why these areas failed to meet the criteria. The modeling results by region showed trends that compared somewhat favorably but some rack thermal profiles deviated quite significantly from measurements.

1.
2.
Schmidt
,
R.
,
Iyengar
,
M.
, and
Mayugh
,
S.
, 2006, “
Thermal Profile of World’s 3rd Fastest Supercomputer—IBM’s ASC Purple Cluster
,”
Proceedings of the ASHRAE Summer Annual Meeting
, Montreal, Canada, Jun. 21–25.
3.
ASHRAE
, 2005, “
Datacom Equipment Power Trends and Applications
,” available from http://tc99.ashraecs.org/http://tc99.ashraecs.org/
4.
Rambo
,
J.
, and
Joshi
,
Y.
, 2006, “
Convective Transport Processes in Data Centers
,”
Numer. Heat Transfer, Part A
1040-7782,
49
(
10
), pp.
923
945
.
5.
Rambo
,
J.
, and
Joshi
,
Y.
, 2007, “
Modeling of Data Center Airflow and Heat Transfer: State of the Art and Future Trends
,”
Distrib. Parallel Databases
,
21
(
2–3
), pp.
193
225
.
6.
Samadiani
,
E.
,
Joshi
,
Y.
, and
Mistree
,
F.
, 2008, “
The Thermal Design of a Next Generation Data Center: A Conceptual Exposition
,”
Trans. ASME
0097-6822,
130
(
4
), p.
0411041
.
7.
Kang
,
S.
,
Schmidt
,
R.
,
Kelkar
,
K.
, and
Patankar
,
S.
, 2001, “
A Methodology for the Design of Perforated Tiles in Raised Floor Data Centers Using Computational Flow Analysis
,”
IEEE-CPMT Journal
,
24
(
2
), pp.
177
183
.
8.
Schmidt
,
R.
,
Karki
,
K.
,
Kelkar
,
K.
,
Radmehr
,
A.
, and
Patankar
,
S.
, 2001, “
Measurements and Predictions of the Flow Distribution Through Perforated Tiles in Raised Floor Data Centers
,”
Proceedings of the Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition
, Kauai, HI, Jul. 8–13, Paper No. IPACK2001-15728.
9.
VanGilder
,
J.
, and
Schmidt
,
R.
, 2005, “
Airflow Uniformity Through Perforated Tiles in a Raised Floor Data Center
,”
Proceedings of the Pacific Rim/ASME International Electronic Packaging Technical Conference, InterPack ‘05
, San Francisco, CA, Jul. 17–22.
10.
Schmidt
,
R.
, and
Cruz
,
E.
, 2004, “
Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures
,”
ASME J. Electron. Packag.
1043-7398,
126
(
4
), pp.
510
518
.
11.
Schmidt
,
R.
, and
Iyengar
,
M.
, “
Effect of Data Center Layout on Rack Inlet Air Temperatures
,”
Proceedings of the Pacific Rim/ASME International Electronic Packaging Technical Conference, InterPack ‘05
, San Francisco, CA, Jul. 17–22.
12.
Bhopte
,
S.
,
Agonafer
,
D.
,
Schmidt
,
R.
, and
Sammakia
,
B.
, 2006, “
Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature
,”
ASME J. Electron. Packag.
1043-7398,
128
(
4
), pp.
380
387
.
13.
Shrivastava
,
S.
,
VanGilder
,
J.
, and
Sammakia
,
B.
, 2007, “
Prediction of Cold Aisle end Airflow Boundary Conditions Using Regression Modeling
,”
IEEE Trans. Compon. Packag. Technol.
1521-3331,
30
(
4
), pp.
866
874
.
14.
Bash
,
C.
,
Patel
,
C.
, and
Sharma
,
R.
, 2003, “
Efficient Thermal Management of Data Centers—Immediate and Long-Term Research Needs
,”
HVAC& R Res.
,
9
(
2
), pp.
137
152
.
15.
Sharma
,
R.
,
Bash
,
C.
,
Patel
,
C.
,
Friedrich
,
R.
, and
Chase
,
J.
, 2005, “
Balance of Power: Dynamic Thermal Management for Internet Data Centers
,”
IEEE Internet Comput.
1089-7801,
9
(
1
), pp.
42
49
.
16.
Boucher
,
T.
,
Auslander
,
D.
,
Bash
,
C.
,
Federspiel
,
C.
, and
Patel
,
C.
, 2006, “
Viability of Dynamic Cooling Control in a Data Center Environment
,”
ASME J. Electron. Packag.
1043-7398,
128
(
2
), pp.
137
144
.
17.
Beitelmal
,
A.
, and
Patel
,
C.
, 2007, “
Thermo-Fluids Provisioning of a High Performance High Density Data Center
,”
Distrib. Parallel Databases
,
21
(
2–3
), pp.
227
238
.
18.
Shah
,
A.
,
Carey
,
V.
,
Bash
,
C.
, and
Patel
,
C.
, 2006, “
An Exergy-Based Figure-of-Merit for Electronic Packages
,”
ASME J. Electron. Packag.
1043-7398,
128
(
4
), pp.
360
369
.
19.
Shah
,
A.
,
Carey
,
V.
,
Bash
,
C.
, and
Patel
,
C.
, 2008, “
Exergy Analysis of Data Center Thermal Management Systems
,”
ASME J. Heat Transfer
0022-1481,
130
(
2
), pp.
021401
.
20.
McAllister
,
S.
,
Carey
,
V.
,
Shah
,
A.
,
Bash
,
C.
, and
Patel
,
C.
, 2008, “
Strategies for Effective Use of Exergy-Based Modeling of Data Center Thermal Management Systems
,”
Microelectron. J.
0026-2692,
39
(
7
), pp.
1023
1029
.
21.
Schmidt
,
R.
,
Iyengar
,
M.
,
Beaty
,
D.
, and
Shrivastava
,
S.
, 2005, “
Thermal Profile of a High Density Data Center—Hot Spot Heat Fluxes of 512 Watts/ft2
,”
Proceedings of the ASHRAE Annual Meeting
, Denver, CO, Jun. 25–29, Paper No. DE-05-11.
22.
Schmidt
,
R.
, 2004, “
Thermal Profile of a High Density Data Center—Methodology to Thermally Characterize a Data Center
,”
Proceedings of the ASHRAE Symposium
, Nashville, TN.
23.
ASHRAE
, 2004, “
Thermal Guidelines for Data Processing Environments
,” available from http://tc99.ashraecs.org/http://tc99.ashraecs.org/
24.
Innovative Research, Inc.
, TILEFLOW, Plymouth, MN.
25.
Iyengar
,
M.
, and
Schmidt
,
R.
, 2007, “
Temperature/Flow Distribution in Small Room Housing One Server Rack
,”
Proceedings of the InterPack 2007
, Vancouver, BC, Canada, Jul. 8–12.
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