A general fatigue life prediction methodology, based on a unified creep plasticity damage (UCPD) model, was developed for predicting fatigue cracks in 95.5Sn–3.9Ag–0.6Cu (wt %) solder interconnects. The methodology was developed from isothermal fatigue tests using a double-lap-shear specimen. Finite element analysis model geometries, mesh densities, and assumptions were detailed for both a full model (an octant-symmetry slice of the entire ball grid array (BGA) assembly) and a submodel (the solder joint deemed most likely to fail and the surrounding package layers) to facilitate fatigue prediction. Model validation was based on the thermal mechanical fatigue of plastic BGA solder joints (250–4000 thermal cycles, , and ). Metallographic cross sections were used to quantitatively measure crack development. The methodology generally underpredicted the crack lengths but, nonetheless, captured the measured crack lengths within a error band. Possible shortcomings in the methodology, including inaccurate materials properties and part geometries, as well as computational techniques, are discussed in terms of improving both the UCPD constitutive model and the fatigue life prediction methodology fidelity and decreasing the solution time.
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March 2008
Research Papers
Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects
David M. Pierce,
David M. Pierce
Department of Mechanical Engineering,
Stanford University
, Stanford, CA 94305
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Sheri D. Sheppard,
Sheri D. Sheppard
Department of Mechanical Engineering,
Stanford University
, Stanford, CA 94305
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Paul T. Vianco,
Paul T. Vianco
Sandia National Laboratories
, Albuquerque, NM 87185
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Jerome A. Regent,
Jerome A. Regent
Sandia National Laboratories
, Albuquerque, NM 87185
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J. Mark Grazier
J. Mark Grazier
Sandia National Laboratories
, Albuquerque, NM 87185
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David M. Pierce
Department of Mechanical Engineering,
Stanford University
, Stanford, CA 94305
Sheri D. Sheppard
Department of Mechanical Engineering,
Stanford University
, Stanford, CA 94305
Paul T. Vianco
Sandia National Laboratories
, Albuquerque, NM 87185
Jerome A. Regent
Sandia National Laboratories
, Albuquerque, NM 87185
J. Mark Grazier
Sandia National Laboratories
, Albuquerque, NM 87185J. Electron. Packag. Mar 2008, 130(1): 011003 (12 pages)
Published Online: January 31, 2008
Article history
Received:
October 13, 2006
Revised:
July 19, 2007
Published:
January 31, 2008
Citation
Pierce, D. M., Sheppard, S. D., Vianco, P. T., Regent, J. A., and Grazier, J. M. (January 31, 2008). "Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects." ASME. J. Electron. Packag. March 2008; 130(1): 011003. https://doi.org/10.1115/1.2837515
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