A unified creep plasticity damage (UCPD) constitutive model was developed to predict the fatigue of 95.5Sn–3.9Ag–0.6Cu solder joints. Compression, stress-strain and creep properties were generated in previous studies of this solder. Crack damage was reflected in a single state variable, , in the model. Isothermal fatigue tests were performed at , , and using a double-lap shear test specimen. A new approach to fitting the revised damage model is proposed based on finite element analysis (FEA) simulation of the load decay of the fatigued solder material. Accurate predictions required that those parameters be temperature dependent. The UCPD constitutive model was successfully implemented as a subroutine in the commercial finite element code ANSYS®. Consistent predictions were obtained as demonstrated by a comparison of results generated from FEA simulation of the test assembly against analogous experimental results.
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March 2008
Research Papers
Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder
David M. Pierce,
David M. Pierce
Department of Mechanical Engineering,
Stanford University
, Stanford, CA 94305
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Sheri D. Sheppard,
Sheri D. Sheppard
Department of Mechanical Engineering,
Stanford University
, Stanford, CA 94305
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Arlo F. Fossum,
Arlo F. Fossum
Sandia National Laboratories
, Albuquerque, NM 87185
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Paul T. Vianco,
Paul T. Vianco
Sandia National Laboratories
, Albuquerque, NM 87185
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Mike K. Neilsen
Mike K. Neilsen
Sandia National Laboratories
, Albuquerque, NM 87185
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David M. Pierce
Department of Mechanical Engineering,
Stanford University
, Stanford, CA 94305
Sheri D. Sheppard
Department of Mechanical Engineering,
Stanford University
, Stanford, CA 94305
Arlo F. Fossum
Sandia National Laboratories
, Albuquerque, NM 87185
Paul T. Vianco
Sandia National Laboratories
, Albuquerque, NM 87185
Mike K. Neilsen
Sandia National Laboratories
, Albuquerque, NM 87185J. Electron. Packag. Mar 2008, 130(1): 011002 (10 pages)
Published Online: January 31, 2008
Article history
Received:
September 27, 2006
Revised:
July 6, 2007
Published:
January 31, 2008
Citation
Pierce, D. M., Sheppard, S. D., Fossum, A. F., Vianco, P. T., and Neilsen, M. K. (January 31, 2008). "Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder." ASME. J. Electron. Packag. March 2008; 130(1): 011002. https://doi.org/10.1115/1.2837513
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Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
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