A molding model is established in this study based on a real integrated circuit for simulating the molding process. This paper presents both the temperature distribution and the thermal stress field of the molding model while the simulation proceeded along the molding time. In addition, the concept of strain energy density is incorporated under the acquisition of thermal stress field of the molding model in order to analyze possible positions of the onset of yield or damage in the molding model. The simulation results also include the extent of deformation in the package body. The results provide references to the subsequent process for determining whether the strips were affected by such deformation while being loaded in the magazine after the molding process. Besides, the displacement of internal lead position could also be derived through the simulation for reference in the design of bonding wire length. The results derived in this paper help in the constructive estimations of the molding design in the integrated packaging process and help designers to avoid the defect caused by the thermal effect during the molding process.
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e-mail: zclin@mail.ntust.edu.tw
e-mail: ccchen@mail.ntist.edu.tw
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March 2007
Research Papers
An Investigation of Stresses Induced by Temperature Variation in Integrated Circuit Molding Process
Zone-Ching Lin,
Zone-Ching Lin
Professor
Department of Mechanical Engineering,
e-mail: zclin@mail.ntust.edu.tw
National Taiwan University of Science and Technology
, 43 Keelung Road, Section 4, Taipei, Taiwan, R.O.C.
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Chang-Cheng Chen
Chang-Cheng Chen
Associate Professor
Department of Mechanical Engineering,
e-mail: ccchen@mail.ntist.edu.tw
Northern Taiwan Institute of Science and Technology
, 2 Xueyuan Road, Beitou, 112 Taipei, Taiwan, R.O.C.
Search for other works by this author on:
Zone-Ching Lin
Professor
Department of Mechanical Engineering,
National Taiwan University of Science and Technology
, 43 Keelung Road, Section 4, Taipei, Taiwan, R.O.C.e-mail: zclin@mail.ntust.edu.tw
Chang-Cheng Chen
Associate Professor
Department of Mechanical Engineering,
Northern Taiwan Institute of Science and Technology
, 2 Xueyuan Road, Beitou, 112 Taipei, Taiwan, R.O.C.e-mail: ccchen@mail.ntist.edu.tw
J. Electron. Packag. Mar 2007, 129(1): 19-27 (9 pages)
Published Online: September 20, 2006
Article history
Received:
February 24, 2004
Revised:
September 20, 2006
Citation
Lin, Z., and Chen, C. (September 20, 2006). "An Investigation of Stresses Induced by Temperature Variation in Integrated Circuit Molding Process." ASME. J. Electron. Packag. March 2007; 129(1): 19–27. https://doi.org/10.1115/1.2429705
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