One of the most important issues whether anisotropic conductive film (ACF) interconnection technology is suitable to be used for flip chip on organic board applications is thermal cycling reliability. In this study, thermally induced deformations and warpages of ACF flip chip assemblies as a function of distance from neutral point (DNP) and ACF materials properties were investigated using in situ high sensitivity moire´ interferometry. For a nondestructive failure analysis, scanning acoustic microscopy investigation was performed for tested assemblies. To elucidate the effects of ACF material properties and DNP on the thermal cycling reliability of ACF assembly, Weibull analysis for the lifetime estimation of ACF joint was performed, and compared with thermal deformations of ACF flip chip assembly investigated by moire´ interferometry. Results indicate that the properties of ACF have a significant role in the thermal deformation and reliability performance during thermal cycling testing. Therefore, optimized ACF properties can enhance ACF package reliability during thermal cycling regime.
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e-mail: wskwon@kaist.ac.kr
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June 2005
Research Papers
Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation
Woon-Seong Kwon,
e-mail: wskwon@kaist.ac.kr
Woon-Seong Kwon
Department of Materials Science and Engineering Korea Advanced Institute of Science and Technology Daejon 305-701, Korea
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Myung-Jin Yim,
Myung-Jin Yim
Department of Materials Science and Engineering Korea Advanced Institute of Science and Technology Daejon 305-701, Korea
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Kyung-Wook Paik,
Kyung-Wook Paik
Department of Materials Science and Engineering Korea Advanced Institute of Science and Technology Daejon 305-701, Korea
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Suk-Jin Ham,
Suk-Jin Ham
MEMS Lab. Samsung Advanced Institute of Technology P.O. Box 111 Suwon 440-600 Korea
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Soon-Bok Lee, Member ASME
Soon-Bok Lee, Member ASME
CARE-Electronic Packaging Laboratory, Department of Mechanical Engineering Korea Advanced Institute of Science and Technology, Daejeon, 305-701, Korea
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Woon-Seong Kwon
Department of Materials Science and Engineering Korea Advanced Institute of Science and Technology Daejon 305-701, Korea
e-mail: wskwon@kaist.ac.kr
Myung-Jin Yim
Department of Materials Science and Engineering Korea Advanced Institute of Science and Technology Daejon 305-701, Korea
Kyung-Wook Paik
Department of Materials Science and Engineering Korea Advanced Institute of Science and Technology Daejon 305-701, Korea
Suk-Jin Ham
MEMS Lab. Samsung Advanced Institute of Technology P.O. Box 111 Suwon 440-600 Korea
Soon-Bok Lee, Member ASME
CARE-Electronic Packaging Laboratory, Department of Mechanical Engineering Korea Advanced Institute of Science and Technology, Daejeon, 305-701, Korea
Paper presented at the 3rd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Montreux, Switzerland, 2003. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received January 6, 2004; revision received November 15, 2004. Review conducted by: Y. C. Chan. Packaging.
J. Electron. Packag. Jun 2005, 127(2): 86-90 (5 pages)
Published Online: June 3, 2005
Article history
Received:
January 6, 2004
Revised:
November 15, 2004
Online:
June 3, 2005
Citation
Kwon, W., Yim , M., Paik, K., Ham, S., and Lee, S. (June 3, 2005). "Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation ." ASME. J. Electron. Packag. June 2005; 127(2): 86–90. https://doi.org/10.1115/1.1846062
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