Computational Fluid Dynamics (CFD) codes have proved their high potential as a tool of thermal design of electronic equipment. However, as the product development cycle is shortened, the CFD-based thermal design needs a new format that allows the packaging designer fast and versatile searches for better design options. The most serious factor that slows the CFD-based design is geometric complexity created by packing various components in a tight space of the system box. In a proposed methodology coined “Build-up Approach (BUA),” CFD simulations are conducted on a set of hardware models to gain insight into the effects of component placement on the junction temperature. Two algorithms are introduced before and after CFD simulations: one defines the geometric parameters through singular value decomposition (SVD) of components placement patterns and the other identifies important geometric parameters by means of the Taguchi method. A case study was conducted on a simple hardware model (benchmark model) that embodies essential features of portable electronic equipment. The results proved the effectiveness of these algorithms in measuring the relative importance of geometric parameters and weeding out unimportant geometric details.
Skip Nav Destination
Article navigation
December 2004
Research Papers
A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model
Wataru Nakayama,
Wataru Nakayama
ThermTech International, 920-7 Higashi Koiso, Oh-Iso, Kanagawa 255-0004, Japan
**
Search for other works by this author on:
Ryuichi Matsuki,
Ryuichi Matsuki
Shinko Electric Industries Co. Ltd., Advanced Product Design & Development Division, Engineering Department, 80 Oshimada-Cho, Nagano, Nagano 381-2287, Japan
Search for other works by this author on:
Yukari Hacho,
Yukari Hacho
Shinko Electric Industries Co. Ltd., Advanced Product Design & Development Division, Engineering Department, 80 Oshimada-Cho, Nagano, Nagano 381-2287, Japan
Search for other works by this author on:
Kiyoko Yajima
Kiyoko Yajima
Shinko Electric Industries Co. Ltd., Advanced Product Design & Development Division, Engineering Department, 80 Oshimada-Cho, Nagano, Nagano 381-2287, Japan
Search for other works by this author on:
Wataru Nakayama
**
ThermTech International, 920-7 Higashi Koiso, Oh-Iso, Kanagawa 255-0004, Japan
Ryuichi Matsuki
Shinko Electric Industries Co. Ltd., Advanced Product Design & Development Division, Engineering Department, 80 Oshimada-Cho, Nagano, Nagano 381-2287, Japan
Yukari Hacho
Shinko Electric Industries Co. Ltd., Advanced Product Design & Development Division, Engineering Department, 80 Oshimada-Cho, Nagano, Nagano 381-2287, Japan
Kiyoko Yajima
Shinko Electric Industries Co. Ltd., Advanced Product Design & Development Division, Engineering Department, 80 Oshimada-Cho, Nagano, Nagano 381-2287, Japan
Manuscript received April 25, 2004; revision received April 30, 2004. Review conducted by: B. Sammakia.
J. Electron. Packag. Dec 2004, 126(4): 440-448 (9 pages)
Published Online: January 24, 2005
Article history
Received:
April 25, 2004
Revised:
April 30, 2004
Online:
January 24, 2005
Citation
Nakayama, W., Matsuki , R., Hacho , Y., and Yajima, K. (January 24, 2005). "A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model ." ASME. J. Electron. Packag. December 2004; 126(4): 440–448. https://doi.org/10.1115/1.1827259
Download citation file:
Get Email Alerts
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag
Related Articles
Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages
J. Electron. Packag (March,2011)
Computational Fluid Dynamics Thermal Analysis of ITER Pressure Suppression Tanks
ASME J of Nuclear Rad Sci (January,2021)
Steady-State Thermal Simulation of Weld Applied to a Practical Axisymmetric Weldment
J. Pressure Vessel Technol (May,2007)
Aerodynamic and Thermal Analysis of an Engine Cylinder Head Using Numerical Flow Simulation
J. Eng. Gas Turbines Power (July,1990)
Related Proceedings Papers
Related Chapters
Introduction
Thermal Management of Microelectronic Equipment
Methods to Select and Compound Noise Factors
Taguchi Methods: Benefits, Impacts, Mathematics, Statistics and Applications
System Thermal Analysis-Rack (Part II)
Thermal Management of Telecommunication Equipment, Second Edition