For through-silicon optical probing of microprocessors, the heat generated by devices with power over 100W must be dissipated 1. To accommodate optical probing, a seemingly elaborate cooling system that controls the microprocessor temperature from 60 to 100°C for device power up to 150 W was designed 2. The system parameters to achieve the desired thermal debug environment were cooling air temperature and air flow. A mathematical model was developed to determine both device temperature and input power. The 3D heat equation that governs the temperature distribution was simplified to a case of a 1D rod with one end at the device center and the other at the cooling air intake. Thus the cooling system was reduced to an analytical expression. From experimental data, we computed all coefficients in the model, then ran extensive tests to verify—the accuracy was better than 10% over the entire temperature and power ranges.
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December 2004
Research Papers
Thermal Model of a Thinned-Die Cooling System
N. Boiadjieva,
N. Boiadjieva
Credence Systems Corporation, 150 Baytech Drive, San Jose, CA 95134
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P. Koev
P. Koev
Department of Mathematics, Massachusetts Institute of Technology, Cambridge, MA 02139
Search for other works by this author on:
N. Boiadjieva
Credence Systems Corporation, 150 Baytech Drive, San Jose, CA 95134
P. Koev
Department of Mathematics, Massachusetts Institute of Technology, Cambridge, MA 02139
Manuscript received April 23, 2004; revision received June 22, 2004. Review conducted by B. Sammakia.
J. Electron. Packag. Dec 2004, 126(4): 435-439 (5 pages)
Published Online: January 24, 2005
Article history
Received:
April 23, 2004
Revised:
June 22, 2004
Online:
January 24, 2005
Citation
Boiadjieva, N., and Koev, P. (January 24, 2005). "Thermal Model of a Thinned-Die Cooling System ." ASME. J. Electron. Packag. December 2004; 126(4): 435–439. https://doi.org/10.1115/1.1826079
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