In the present work, a compact modeling method based on a volume-averaging technique is presented. Its application to an analysis of fluid flow and heat transfer in straight fin heat sinks is then analyzed. In this study, the straight fin heat sink is modeled as a porous medium through which fluid flows. The volume-averaged momentum and energy equations for developing flow in these heat sinks are obtained using the local volume-averaging method. The permeability and the interstitial heat transfer coefficient required to solve these equations are determined analytically from forced convective flow between infinite parallel plates. To validate the compact model proposed in this paper, three aluminum straight fin heat sinks having a base size of are tested with an inlet velocity ranging from 0.5 m/s to 2 m/s. In the experimental investigation, the heat sink is heated uniformly at the bottom. The resulting pressure drop across the heat sink and the temperature distribution at its bottom are then measured and are compared with those obtained through the porous medium approach. Upon comparison, the porous medium approach is shown to accurately predict the pressure drop and heat transfer characteristics of straight fin heat sinks. In addition, evidence indicates that the entrance effect should be considered in the thermal design of heat sinks when
Skip Nav Destination
Article navigation
June 2004
Technical Papers
Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks
Duckjong Kim,
Duckjong Kim
Thermo-Fluid System Department, Korea Institute of Machinery and Materials, Daejeon, 305-660, Korea
Search for other works by this author on:
Sung Jin Kim
Sung Jin Kim
Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 305-701, Korea
Search for other works by this author on:
Duckjong Kim
Thermo-Fluid System Department, Korea Institute of Machinery and Materials, Daejeon, 305-660, Korea
Sung Jin Kim
Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 305-701, Korea
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received May 2003; final revision, December 2003. Associate Editor: B. Sammakia.
J. Electron. Packag. Jun 2004, 126(2): 247-255 (9 pages)
Published Online: July 8, 2004
Article history
Revised:
May 1, 2003
Revised:
December 1, 2003
Online:
July 8, 2004
Citation
Kim, D., and Kim, S. J. (July 8, 2004). "Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks ." ASME. J. Electron. Packag. June 2004; 126(2): 247–255. https://doi.org/10.1115/1.1756149
Download citation file:
Get Email Alerts
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag
Related Articles
Numerical Analysis of Convective Heat Transfer From an Elliptic Pin Fin Heat Sink With and Without Metal Foam Insert
J. Heat Transfer (July,2010)
Compact Modeling of Fluid Flow and Heat Transfer in Pin Fin Heat Sinks
J. Electron. Packag (September,2004)
The Green Function and Its Application to Heat Transfer in a Low Permeability Porous Channel
J. Electron. Packag (September,2000)
Enhanced Heat Transfer Using Porous Carbon Foam in Cross Flow—Part I: Forced Convection
J. Heat Transfer (June,2007)
Related Proceedings Papers
Related Chapters
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment, Second Edition
Introduction
Thermal Management of Microelectronic Equipment
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment