The growing application of advanced electronic packages under harsh environmental conditions, extreme temperatures especially in automotive applications is often a reason for damage, fatigue, and failure of entire components and systems. Consequently, their thermo-mechanical reliability is one of the most important preconditions for adopting these technologies in industrial applications. To prevent chips from being exposed to the external environment integrated circuits are usually encapsulated into packages. As a result, a microelectronic package is basically a compound of several materials with quite different Young’s moduli and thermal expansion coefficients. Additionally, various kinds of inhomogeneity, residual stresses from several steps of the manufacturing process contribute to interface delaminations, chip cracking, and fatigue of solder interconnects. This paper intends to investigate mixed mode interface delamination phenomena in micro components by using combined numerical investigations by means of nonlinear FEA and experimental investigations. It explains how experimental data were used as input for the quantitative evaluation of fatigue and fracture of microcomponents. Both numerical and experimental investigations provide the basis for understanding and evaluating failure mechanisms especially in solder joints, as well as several polymer material interfaces, and should support further applications for raising the thermo-mechanical reliability of advanced electronic packages.
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December 2002
Technical Papers
Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches
J. Auersperg,
J. Auersperg
AMIC Angewandte Micro-Messtechnik GmbH, 12489 Berlin, Germany
Fraunhofer Institute IZM, Department of Mechanical Reliability and MicroMaterials, D-13355 Berlin, Germany
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E. Kieselstein,
E. Kieselstein
CWM Chemnitzer Wekstoffmechanik GmbH, D-09117 Chemnitz, Germany
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A. Schubert,
A. Schubert
Fraunhofer Institute IZM, Department of Mechanical Reliability and MicroMaterials, D-13355 Berlin, Germany
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B. Michel
B. Michel
Fraunhofer Institute IZM, Department of Mechanical Reliability and MicroMaterials, D-13355 Berlin, Germany
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J. Auersperg
AMIC Angewandte Micro-Messtechnik GmbH, 12489 Berlin, Germany
Fraunhofer Institute IZM, Department of Mechanical Reliability and MicroMaterials, D-13355 Berlin, Germany
E. Kieselstein
CWM Chemnitzer Wekstoffmechanik GmbH, D-09117 Chemnitz, Germany
A. Schubert
Fraunhofer Institute IZM, Department of Mechanical Reliability and MicroMaterials, D-13355 Berlin, Germany
B. Michel
Fraunhofer Institute IZM, Department of Mechanical Reliability and MicroMaterials, D-13355 Berlin, Germany
Contributed by the Electronic and Photonic Packaging Division and presented at Poly 2000, London, United Kingdom, December 4–5, 2000. Manuscript received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel.
J. Electron. Packag. Dec 2002, 124(4): 318-322 (5 pages)
Published Online: December 12, 2002
Article history
Received:
May 1, 2002
Online:
December 12, 2002
Citation
Auersperg, J., Kieselstein, E., Schubert , A., and Michel , B. (December 12, 2002). "Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches ." ASME. J. Electron. Packag. December 2002; 124(4): 318–322. https://doi.org/10.1115/1.1501303
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