A numerical and experimental study of conduction heat transfer from low power magnetic components with gull wing leads was conducted to determine the effects of distributing the power loss between the core, the winding and the thermal underfill on the thermal resistance. The numerical study was conducted in the power loss ratio range of 0.5⩽PR⩽1.0, where the only active power loss was from the winding at PR=1. In addition, the effect of the thermal underfill material between the substrate and the lower surface of the magnetic package on the thermal performance of the magnetic device was also examined. For comparison, a test was conducted on a magnetic component at PR=1, without thermal underfill. This comparison revealed good agreement between the numerical and experimental results. Finally, a general model was proposed for conduction heat transfer from the surface mount power magnetic packages. The agreement between the model and the experimental results was within 8 percent. [S1043-7398(00)00704-0]
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December 2000
Technical Papers
Thermal Management of Surface Mount Power Magnetic Components
G. Refai-Ahmed, Mem. ASME,,
G. Refai-Ahmed, Mem. ASME,
Astec Advanced Power Systems Ltd., Power Group, MS. 042, 185 Corkstown Rd., Nepean, Ontario, K2H 8V4 Canada
11
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M. M. Yovanovich, Fellow ASME,
M. M. Yovanovich, Fellow ASME,
Department of Mechanical Engineering, University of Waterloo, Waterloo, Ontario, N2L 3G1 Canada
Search for other works by this author on:
G. Refai-Ahmed, Mem. ASME,
11
Astec Advanced Power Systems Ltd., Power Group, MS. 042, 185 Corkstown Rd., Nepean, Ontario, K2H 8V4 Canada
M. M. Yovanovich, Fellow ASME,
Department of Mechanical Engineering, University of Waterloo, Waterloo, Ontario, N2L 3G1 Canada
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EEPD Division November 25, 1999. Associate Technical Editor: Y. Joshi.
J. Electron. Packag. Dec 2000, 122(4): 323-327 (5 pages)
Published Online: November 25, 1999
Article history
Received:
November 25, 1999
Citation
Refai-Ahmed, G., and Yovanovich, M. M. (November 25, 1999). "Thermal Management of Surface Mount Power Magnetic Components ." ASME. J. Electron. Packag. December 2000; 122(4): 323–327. https://doi.org/10.1115/1.1289634
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