In the electronic industry, the dominant failure mode for solder joints is assumed to be thermal cycling. When semiconductor devices are used in vibrating environment, such as automotive and military applications, dynamic stresses contribute to the failure mechanism of the solder joint, and can become the dominant failure mode. In this paper, a damage mechanics based unified constitutive model for Pb40/Sn60 solder joints has been developed to accurately predict the thermomechanical behavior of solder joints under concurrent thermal and dynamic loading. It is shown that simultaneous application of thermal and dynamic loads significantly shorten the fatigue life. Hence, damage induced in the solder joint by the vibrations have to be included, in fatigue life predictions to correctly predict the reliability of solder joints. The common practice of relating only thermal cycling induced inelastic strain to fatigue life can be inadequate to predict solder joint reliability. A series of parametric studies were conducted to show that contrary to popular opinion all dynamic loading induced strains are not elastic. Hence, vibrations can significantly affect the fatigue life and reliability of solder joints in spite of their small mass.
1.
ANSYS, 1992, User’s Manual, Swanson Analysis Systems Inc., Version 5.3.
2.
ABAQUS, 1996, User’s Manual, Hibbit, Karlsson and Sorrensen Inc., Version 5.6.
3.
Barker
D.
Vodzak
J.
Dasgupta
A.
Pecht
M.
1990
, “Combined Vibrational and Thermal Solder Joint Fatigue—A Generalized Strain Versus Life Approach
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 112
, pp. 129
–134
.4.
Basaran, C., and Chandaroy, R., 1999a, “Nonlinear Dynamic Analysis of Surface Mount Interconnects, Part I: Theory,” ASME JOURNAL OF ELECTRONIC PACKAGING, March, Vol. 121.
5.
Basaran, C., and Chandaroy, R., 1999b, “Nonlinear Dynamic Analysis of Surface Mount Interconnects, Part II: Applications,” ASME JOURNAL OF ELECTRONIC PACKAGING, March, Vol. 121.
6.
Basaran
C.
Desai
C. S.
Kundu
T.
1998
, “Thermomechanical Finite Element Analysis of Microelectronics Packaging, Part I: Theory
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 120
, (1
), 41
–47
.7.
Blanks, H. S., 1976, “Accelerated Vibration Fatigue Life Testing of Leads and Solder Joint,” in Microelectronics and Reliability, Pergamon Press, Vol. 15, pp. 213–219.
8.
Bonda, N. R., and Noyan, I. C., 1996, “Effect of the Specimen size in Predicting the Mechanical properties of PbSn Solder Alloys,” IEEE Trans. on Comp. Pack. and Manuf. Tech., Part A, Vol. 19, No. 2.
9.
Bathe, K. B., 1996, Finite Element Procedures in Engineering Analysis, Prentice Hall, Inc., Englewood Cliffs, NJ.
10.
Clech, I.-P., and Augis, J. A., 1987, “Engineering Analysis of Thermal Cycling Accelerated Test for Surface-Mount Attachment Reliability Evaluation,” Proceedings, VII Annual Electronic Packaging Conf., Vol. 1, pp. 385–411.
11.
Clough, R. W., and Penzien, J., 1993, Dynamics of Structures, McGraw-Hill, New York.
12.
Coffin
L. F.
1954
, Trans. of ASME
, Vol. 76
, pp. 931
–950
.13.
Coffin, Jr., L. F., 1969, Fracture 1969, Chapman and Hall, London.
14.
Cosserat, E., and Cosserat, F., 1909, Theorie des Corps Deformables, Herman, Paris, France.
15.
Darveaux, R., Edward, Y., Turlik, I., and Murthy, K. I., 1991, “Mechanical Characteristics of IN and Pb55Sn Solders in a Thinfilm Multichip Package,” Proceedings, Mat. Res. Symp., Vol. 203, pp. 443–449.
16.
Dasgupta, A., Oyan, C., Barker, D., Pecht, M., 1992, “Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 114.
17.
Desai, C., 1995, “Constitutive Modeling Using the Disturbed State Concept,” chap. 8 in Continuum Models for Materials with Microstructure, H. B. Muhlhars, ed., John Wiley & Sons, UK.
18.
Frear, D. R., Burchet, S. N., and Rashid, M. M., 1995, “A Microstructurally Based Model of Solder Joints Under Conditions of Thermomechanical Fatigue,” Proceedings, Advances in Electronic Packaging, EEP-Vol. 10, ASME, New York, pp. 347–360.
19.
Guo
Q.
Cutiongco
E. C.
Keer
L. M.
Fine
M. E.
1992
, “Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 114
, pp. 145
–151
.20.
Hall, P. M., and Sherry, W. M., 1986, “Materials, Structures and Mechanics of Solder-Joints for Surface-Mount Microelectronics Technology,” Proceedings, Lectures of the 3rd International Conference on Techniques de Connexion en Electronique, Feb, 18–20, Welding Society, Fellbach, Dusseldorf, Germany.
21.
Harper, C. A., 1970, Handbook of Materials and Processes for Electronics, McGraw Hill, New York, pp. 9–71.
22.
Huang
J. H.
Pei
J. Y.
Qian
Y. Y.
Jiang
Y. H.
1994
, “Life Predictions of SMT Solder Joints Under Thermal Cycling
,” Soldering and Surface Mount Technology
, Vol. 16
, pp. 31
–50
.23.
Hill, R., 1950, The Mathematical Theory of Plasticity, Oxford University Press, Oxford, UK.
24.
Ishikawa, H., and Sasaki, K., 1992, “Constitutive Model for 60Sn–40Pb Solder Under Cycling Loading,” Advances in Electronic Packaging, Proceedings, Joint ASME/JSME Conf. on Electronic Packaging, W. T. Chen, and H. Abe, eds., Vol. 1, pp. 401–408.
25.
Kachanov, L. M., 1986, Introduction of Continuum Damage Mechanics, Martinus Nijhoff Publishers, Dordrecht, The Netherlands.
26.
Knecht
S.
Fox
L. R.
1990
, “Constitutive Relation and Creep-Fatigue Life Model for Eutectic Tin-Lead Solder
,” IEEE Trans. on Comp. Hybr. and Manufacturing Technology
, Vol. 13
, No. 2
, pp. 424
–433
.27.
Lau
J.
Erasmus
S.
1993
, “Reliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints Under Bending Twisting and Thermal Conditions
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 115
, pp. 322
–328
.28.
Manson, S. S., 1953, “Behavior of Materials Under Conditions of Thermal Stress,” Proceedings, Heat Transfer Symp., Univ. of Michigan Press, Ann Arbor, MI.
29.
Manson
S. S.
1960
, Mechanical Design
, Vol. 32
(14
), pp. 139
–144
.30.
Markstein, H. W., 1987, “Designing Electronics for High Vibration and Shock,” Electronic Packaging and Production, April, pp. 40–43.
31.
MIL-HDBK-304, Military Standards Handbook.
32.
Miner, M. A., 1945, “Cumulative Damage in Fatigue,” ASME JOURNAL OF APPLIED MECHANICS, Sept.
33.
Oshida, Y., and Chen, P., 1991, “High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 113.
34.
Owen, D. R. J., and Hinton, E., 1980, Finite Elements in Plasticity, Pineridge Press Limited, Swansea, U.K.
35.
Ozmat, B., 1990, “A Nonlinear Thermal Stress Analysis of Surface Mount Solder Joints,” Proceedings, 40th Electronic Components & Technology Conference.
36.
Pan, T., 1991, “Thermal Cycling Induced Plastic Deformation in Solder Joints: Part III: Strain-Energy Based Fatigue Life Model and Effects of Ramp Rate and Hold Time,” Proceedings, ASME Winter Annual Meeting, ASME, New York.
37.
Pao
Y. H.
Govila
R.
Badgley
S.
Jih
E.
1993
, “An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 115
, pp. 1
–8
.38.
Perzyna, P., 1966, “Fundamental Problems in Viscoplasticity,” in Recent Advances in Applied Mechanics, Academic Press, New York.
39.
Ross
R. G.
Wen
L. C.
Mon
G. R.
Jetter
E.
1992
, “Solder Crep-Fatigue Interactions with Flexible Leaded Parts
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 114
, pp. 185
–192
.40.
Sauber
J.
Seyyedi
1992
, “Predicting Thermal Fatigue Lifetimes for SMT Solder Joints
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 114
, pp. 472
–476
.41.
Schmidt
C. G.
1992
, “A Simple Model for Fatigue of Leadless Ceramic Chip Carrier Solder Attachments
,”J. Electronic Manuf.
, Vol. 2
, pp. 31
–36
.42.
Skipor, A., Harren, S., and Botsis, J., 1992, “Constitutive Characterization of 63/37 Sn/Pn Eutectic Solder Using the Bodner-Partom Unified Creep-Plasticity Model,” Advances in Electronic Packaging, Proceedings, Joint ASME/JSME Conf. on Electronic Packaging, Vol. 2, W. T. Chen, and H. Abe, eds., ASME, New York, pp. 661–672.
43.
Solomon
H. D.
Tolksdorf
E. D.
1996
, “Energy Approach to the Fatigue of 60/40 Solder: Part II—Influence of Hold Time and Asymmetric Loading
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 118
, pp. 67
–71
.44.
Subrahmanyan, R., Wilcox, J. R., and Li, C., 1989, “A Damage Integral Approach to Thermal Fatigue of Solder Joints,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 12, No. 4.
45.
Steinberg, D. S., 1988, Vibration Analysis for Electronic Equipment, John Wiley & Sons, New York.
46.
Suhir, E., and Lee, Y. C., 1988, “Thermal, Mechanical and Environmental Durability Design Methodologies,” Electronics Materials Handbook, Vol. 1, ASM International.
47.
Tien, J. K., Headrix, B.C., and Attarwala, A. I., 1991, “Understanding the Cycling Mechanical Behavior of Lead/Tin Solder,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 113.
48.
Verma
S.
Dasgupta
A.
Barker
D.
1993
, “A Numerical Study of Fatigue Life of J-Leaded Solder Joints Using the Energy Partitioning Approach
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 115
, pp. 416
–423
.49.
Zubelewicz, A., Guo, Q., Cutiongco, E. C., Fine, M. E., and Kheer, L. M., 1990, “Micromechanical Method to Predict Fatigue Life of Solder,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 112.
This content is only available via PDF.
Copyright © 1999
by The American Society of Mechanical Engineers
You do not currently have access to this content.
