As a follow-up and conclusion to previous work in stencil printing process modeling and optimization (Li et al., 1996), we investigate the effect of stencil printing optimization on the reliability of the ceramic and plastic ball grid arrays. For ceramic ball grid arrays, the eutectic solder fillet shape is calculated using a series of simple mathematical equations. The thermal strain distributions within the solder joints after two cycles of accelerated thermal cycling test are estimated using three-dimensional finite element models. The modified Coffin-Manson relationship is applied to calculate the mean fatigue lives of the solder joints. The results reveal that an optimized stencil printing process significantly reduces variation in the fatigue life of ceramic ball grid arrays. The results also show that the fatigue life of ceramic ball grid arrays is very sensitive to the card-side solder volume. The maximum strain region shifts from the card-side eutectic solder to the module side as the card-side eutectic solder volume increases. This shift in maximum strain suggests that there exists an optimum ratio between the card-side solder volume and the module-side solder volume for the reliability of a given ceramic ball grid array design. The implications of this for the package developers and users are discussed. The calculations indicate that the fatigue life of plastic ball grid arrays is almost insensitive to the card-side solder volume.
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March 1998
Technical Papers
The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints
Y. Li,
Y. Li
CAMPmode, Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309-0427
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R. L. Mahajan,
R. L. Mahajan
CAMPmode, Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309-0427
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G. Subbarayan
G. Subbarayan
CAMPmode, Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309-0427
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Y. Li
CAMPmode, Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309-0427
R. L. Mahajan
CAMPmode, Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309-0427
G. Subbarayan
CAMPmode, Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309-0427
J. Electron. Packag. Mar 1998, 120(1): 54-60 (7 pages)
Published Online: March 1, 1998
Article history
Received:
March 15, 1997
Revised:
August 11, 1997
Online:
November 6, 2007
Citation
Li, Y., Mahajan, R. L., and Subbarayan, G. (March 1, 1998). "The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints." ASME. J. Electron. Packag. March 1998; 120(1): 54–60. https://doi.org/10.1115/1.2792286
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