As traditional lead-based solders are banned and replaced by lead-free solders, the drop impact reliability is becoming increasingly crucial because there is little understanding of mechanical behaviors of these lead-free solders at high strain rates. In this paper, mechanical properties of one lead-based solder, Sn37Pb, and two lead-free solders, Sn3.5Ag and Sn3.0Ag0.5Cu, were investigated at strain rates that ranged from to by the split Hopkinson pressure and tensile bar technique. At high strain rates, tensile strengths of lead-free solders are about 1.5 times greater than that of the Sn37Pb solder, and also their ductility are significantly greater than that of the Sn37Pb. Based on the experimental data, strain rate dependent Johnson–Cook models for the three solders were derived and employed to predict behaviors of solder joints in a board level electronic package subjected to standard drop impact load. Results indicate that for the drop impact analysis of lead-free solder joints, the strain rate effect must be considered and rate-dependent material models of lead-free solders are indispensable.
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January 2010
Research Papers
Strain Rate Effects and Rate-Dependent Constitutive Models of Lead-Based and Lead-Free Solders
Fei Qin,
Fei Qin
Mem. ASME
College of Mechanical Engineering and Applied Electronics Technology,
e-mail: qfei@bjut.edu.cn
Beijing University of Technology
, Beijing 100124, P R China
Search for other works by this author on:
Tong An,
Tong An
College of Mechanical Engineering and Applied Electronics Technology,
Beijing University of Technology
, Beijing 100124, P R China
Search for other works by this author on:
Na Chen
Na Chen
College of Mechanical Engineering and Applied Electronics Technology,
Beijing University of Technology
, Beijing 100124, P R China
Search for other works by this author on:
Fei Qin
Mem. ASME
College of Mechanical Engineering and Applied Electronics Technology,
Beijing University of Technology
, Beijing 100124, P R Chinae-mail: qfei@bjut.edu.cn
Tong An
College of Mechanical Engineering and Applied Electronics Technology,
Beijing University of Technology
, Beijing 100124, P R China
Na Chen
College of Mechanical Engineering and Applied Electronics Technology,
Beijing University of Technology
, Beijing 100124, P R ChinaJ. Appl. Mech. Jan 2010, 77(1): 011008 (11 pages)
Published Online: September 30, 2009
Article history
Received:
July 22, 2008
Revised:
March 13, 2009
Published:
September 30, 2009
Citation
Qin, F., An, T., and Chen, N. (September 30, 2009). "Strain Rate Effects and Rate-Dependent Constitutive Models of Lead-Based and Lead-Free Solders." ASME. J. Appl. Mech. January 2010; 77(1): 011008. https://doi.org/10.1115/1.3168600
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