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Proceedings Papers

An Automated System for Temperature Dependent Mechanical Property Measurements

Yarom Polsky, Charles Ume
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 141-151, November 17–22, 1996
Paper No: IMECE1996-0784
https://doi.org/10.1115/IMECE1996-0784
View Paper titled, An Automated System for Temperature Dependent Mechanical Property Measurements
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Topics: Mechanical properties, Temperature, Data acquisition, Printed circuit boards, Computer software, Computers, Copper foil, Electrical resistance, Laminates, Lasers
Proceedings Papers

Two-Dimensional Stress Analysis of Single-Lap Joints of Dissimilar Adherends Subjected to External Bending Moments

Toshiyuki Sawa, Katsuyuki Nakano, Hiroshi To Ratani
Proc. ASME. IMECE96, Reliability, Stress Analysis, and Failure Prevention Issues in Fastening and Joining, Composite and Smart Structures, Numerical and FEA Methods, and Risk Minimization, 9-15, November 17–22, 1996
Paper No: IMECE1996-0854
https://doi.org/10.1115/IMECE1996-0854
View Paper titled, Two-Dimensional Stress Analysis of Single-Lap Joints of Dissimilar Adherends Subjected to External Bending Moments
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Topics: Adhesive joints, Adhesives, Contact mechanics, Elasticity, Strain measurement, Stress, Stress analysis (Engineering), Stress concentration, Stress singularity, Strips
Proceedings Papers

Applications of Digital Correlation Method to Microscopic Strain Measurement and Materials’ Property Characterization

H. Lu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 423-428, November 16–21, 1997
Paper No: IMECE1997-1119
https://doi.org/10.1115/IMECE1997-1119
View Paper titled, Applications of Digital Correlation Method to Microscopic Strain Measurement and Materials’ Property Characterization
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Topics: Hardware, Manufacturing, Reliability, Resolution (Optics), Strain measurement
Proceedings Papers

Prediction of Thermal Deformation of Machine Tool With Strain Sensor

Toshimichi Moriwaki, Eiji Shamoto, Masahiro Kawano
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 137-142, November 16–21, 1997
Paper No: IMECE1997-1086
https://doi.org/10.1115/IMECE1997-1086
View Paper titled, Prediction of Thermal Deformation of Machine Tool With Strain Sensor
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Topics: Machine tools, Strain sensors, Thermal deformation, Sensors, Deformation, Displacement, Machining centers, Strain gages, Strain measurement, Temperature distribution
Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997
Paper No: IMECE1997-0508
https://doi.org/10.1115/IMECE1997-0508
View Paper titled, Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC
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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination
Proceedings Papers

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Daqing Zou, Xiaoyuan He, Minfu Lu, Sheng Liu, Yifan Guo
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 59-64, November 15–20, 1998
Paper No: IMECE1998-0429
https://doi.org/10.1115/IMECE1998-0429
View Paper titled, Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages
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Topics: Circuits, Control equipment, Corners (Structural elements), Deformation, Density, Displacement, Electronic packages, Flip-chip, Flip-chip packages, Interferometers
Proceedings Papers

Quantification of Femoral Surface Strain by Computer Analysis of the Photoelastic Method

Randal P. Morris, Michael J. Grecula, William L. Buford, Jr., Rita M. Patterson
Proc. ASME. IMECE98, Advances in Bioengineering, 225-226, November 15–20, 1998
Paper No: IMECE1998-0112
https://doi.org/10.1115/IMECE1998-0112
View Paper titled, Quantification of Femoral Surface Strain by Computer Analysis of the Photoelastic Method
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Topics: Arthroplasty, Artificial limbs, Bone, Computers, Design, Finite element analysis, Prostheses, Strain gages, Strain measurement, Stress
Proceedings Papers

Evaluation of Fiber Optic Sensors for Measuring Strain in Aircraft Applications

Jim Tarter, Jim Sirkis, Tom Boyer
Proc. ASME. IMECE98, Adaptive Structures and Material Systems, 277-282, November 15–20, 1998
Paper No: IMECE1998-0962
https://doi.org/10.1115/IMECE1998-0962
View Paper titled, Evaluation of Fiber Optic Sensors for Measuring Strain in Aircraft Applications
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Topics: Aircraft, Fiber optic sensors, Strain measurement, Cantilever beams, Fibers, Sensors, Strain gages
Proceedings Papers

Surface Acoustic Wave Sensors for Temperature and Strain Measurements

Yang Yan, Yudong Wang, Fang Li
Proc. ASME. IMECE2020, Volume 13: Micro- and Nano-Systems Engineering and Packaging, V013T13A011, November 16–19, 2020
Paper No: IMECE2020-24340
https://doi.org/10.1115/IMECE2020-24340
View Paper titled, Surface Acoustic Wave Sensors for Temperature and Strain Measurements
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Topics: Sensors, Strain measurement, Surface acoustic waves, Temperature, Testing, Delays, Pressure, Design, Fuels, Hydrogen
Proceedings Papers

Large Deformation Strain Measurement Using Digital Image Correlation Technique During Axial Crushing of an Extruded AA-6063 Tube

Arun Kumar Sudalaiyandi, Ramesh Krishnamurthi, Raghu V. Prakash
Proc. ASME. IMECE2016, Volume 9: Mechanics of Solids, Structures and Fluids; NDE, Diagnosis, and Prognosis, V009T12A050, November 11–17, 2016
Paper No: IMECE2016-66339
https://doi.org/10.1115/IMECE2016-66339
View Paper titled, Large Deformation Strain Measurement Using Digital Image Correlation Technique During Axial Crushing of an Extruded AA-6063 Tube
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Topics: Deformation, Strain measurement, Displacement, Fracture (Process), Aircraft, Aluminum alloys, Automobiles, Buckling, Collisions (Physics), Computer simulation
Proceedings Papers

CPI Stress Induced Carrier Mobility Shift in Advanced Silicon Nodes

Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan, Henrik Hovsepyan, Uwe Muehle, Ehrenfried Zschech, Riko Radojcic
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A046, November 11–17, 2016
Paper No: IMECE2016-65171
https://doi.org/10.1115/IMECE2016-65171
View Paper titled, CPI Stress Induced Carrier Mobility Shift in Advanced Silicon Nodes
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Topics: Electron mobility, Silicon, Stress, Simulation, Design, Flow (Dynamics), Calibration, Circuits, Finite element analysis, Fittings
Proceedings Papers

Measurement of Leadframe Strain in Electrically Active Power Semiconductors

Seth M. Avery, Robert D. Lorenz
Proc. ASME. IMECE2015, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A018, November 13–19, 2015
Paper No: IMECE2015-50357
https://doi.org/10.1115/IMECE2015-50357
View Paper titled, Measurement of Leadframe Strain in Electrically Active Power Semiconductors
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Topics: Deformation, Displacement, Displacement measurement, Electronic speckle pattern interferometry, Modeling, Noise (Sound), Power semiconductor devices, Resolution (Optics), Strain measurement, Stress
Proceedings Papers

Comparing Methods for Establishing Multiscale Material Properties of 0.2 mm Thick Annealed ASTM 304

William J. Emblom, Md. F. S. Ibne Islam, Richard J. Jones, Mitra Aithal, Scott Wagner, Thomas Pesacreta, Gary A. Glass
Proc. ASME. IMECE2015, Volume 2A: Advanced Manufacturing, V02AT02A020, November 13–19, 2015
Paper No: IMECE2015-50019
https://doi.org/10.1115/IMECE2015-50019
View Paper titled, Comparing Methods for Establishing Multiscale Material Properties of 0.2 mm Thick Annealed ASTM 304
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Topics: ASTM International, Materials properties, Microscale devices, Membranes, Strain measurement, Errors, Finite element analysis, Poles (Building), Constitutive equations, Continuum mechanics
Proceedings Papers

Operating Strain Mode Identification Using Acceleration Measurements

Jakerson R. Gevinski, Robson Pederiva
Proc. ASME. IMECE2013, Volume 14: Vibration, Acoustics and Wave Propagation, V014T15A055, November 15–21, 2013
Paper No: IMECE2013-65306
https://doi.org/10.1115/IMECE2013-65306
View Paper titled, Operating Strain Mode Identification Using Acceleration Measurements
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Topics: Accelerometers, Aluminum plate, Computer simulation, Deflection, Displacement, Finite element methods, Gages, Machinery, Shapes, Signals
Proceedings Papers

Buckling Measurement of Cylindrical Shells by Digital Image Correlation Method

Tzu-Yu Kuo, Wei-Chung Wang, Chun-I Chu, Jia-He Chen, Te-Heng Hung, Jen-Yuan (James) Chang
Proc. ASME. IMECE2013, Volume 9: Mechanics of Solids, Structures and Fluids, V009T10A089, November 15–21, 2013
Paper No: IMECE2013-62332
https://doi.org/10.1115/IMECE2013-62332
View Paper titled, Buckling Measurement of Cylindrical Shells by Digital Image Correlation Method
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Topics: Buckling, Pipes, Deformation, Strain gages, Strain measurement, ASTM International, Reliability, Safety, Stress
Proceedings Papers

On the Dynamics of an Inverted Flexible Pendulum With Tip Mass on a Cart

Prasanna Gandhi, Ojas Patil
Proc. ASME. IMECE2012, Volume 4: Dynamics, Control and Uncertainty, Parts A and B, 415-423, November 9–15, 2012
Paper No: IMECE2012-87187
https://doi.org/10.1115/IMECE2012-87187
View Paper titled, On the Dynamics of an Inverted Flexible Pendulum With Tip Mass on a Cart
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Topics: Dynamics (Mechanics), Pendulums, Equilibrium (Physics), Deflection, Design, Dynamic models, Nonlinear dynamics, Strain measurement, Weight (Mass)
Proceedings Papers

Identification and Quantification of Residual Strains During Curing of Carbon Fiber Epoxy Laminates

Russell Mailen, David A. Jack, Lesley M. Wright
Proc. ASME. IMECE2012, Volume 8: Mechanics of Solids, Structures and Fluids, 139-147, November 9–15, 2012
Paper No: IMECE2012-88385
https://doi.org/10.1115/IMECE2012-88385
View Paper titled, Identification and Quantification of Residual Strains During Curing of Carbon Fiber Epoxy Laminates
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Topics: Carbon fibers, Epoxy adhesives, Epoxy resins, Hardening (Curing), Laminates, Composite materials, Cycles, Differential scanning calorimetry, Shapes, Shrinkage (Materials)
Proceedings Papers

Creep Strain Measurement of an Actual Leadfree Solder Interconnect Using Digital Image Correlation

Hohyung Lee, Seungbae Park
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 485-490, November 9–15, 2012
Paper No: IMECE2012-89799
https://doi.org/10.1115/IMECE2012-89799
View Paper titled, Creep Strain Measurement of an Actual Leadfree Solder Interconnect Using Digital Image Correlation
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Topics: Creep, Lead-free solders, Strain measurement, Solders, Solder joints, Ball-Grid-Array packaging, Displacement, Temperature, Alloys, Ball-Grid-Array packages
Proceedings Papers

A New Approach to Measure Strain During Friction Stir Welding Using Visioplasticity

Mohamadreza Nourani, Abbas S. Milani, Spiro Yannacopoulos
Proc. ASME. IMECE2011, Volume 8: Mechanics of Solids, Structures and Fluids; Vibration, Acoustics and Wave Propagation, 1-7, November 11–17, 2011
Paper No: IMECE2011-62061
https://doi.org/10.1115/IMECE2011-62061
View Paper titled, A New Approach to Measure Strain During Friction Stir Welding Using Visioplasticity
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Topics: Friction, Welding, Plates (structures), Aluminum alloys, Aluminum plate, Composite materials, Computer simulation, Deformation, Mechanical properties, Modeling
Proceedings Papers

Investigation of Hole Expansion Characteristics of DP 600 With Testing and Modeling

Siddharth Mohan Ram, Hong-Tae Kang
Proc. ASME. IMECE2010, Volume 3: Design and Manufacturing, Parts A and B, 47-51, November 12–18, 2010
Paper No: IMECE2010-39455
https://doi.org/10.1115/IMECE2010-39455
View Paper titled, Investigation of Hole Expansion Characteristics of DP 600 With Testing and Modeling
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Topics: Automotive industry, Deformation, Failure, Finite element analysis, Flanges, Modeling, Sheet metal, Simulation results, Steel sheet, Strain measurement