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Proceedings Papers

Applications of Digital Correlation Method to Microscopic Strain Measurement and Materials’ Property Characterization

H. Lu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 423-428, November 16–21, 1997

Paper No: IMECE1997-1119

DOI: https://doi.org/10.1115/IMECE1997-1119

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Topics: Hardware, Manufacturing, Reliability, Resolution (Optics), Strain measurement

Proceedings Papers

Prediction of Thermal Deformation of Machine Tool With Strain Sensor

Toshimichi Moriwaki, Eiji Shamoto, Masahiro Kawano

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 137-142, November 16–21, 1997

Paper No: IMECE1997-1086

DOI: https://doi.org/10.1115/IMECE1997-1086

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Topics: Machine tools, Strain sensors, Thermal deformation, Sensors, Deformation, Displacement, Machining centers, Strain gages, Strain measurement, Temperature distribution

Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997

Paper No: IMECE1997-0508

DOI: https://doi.org/10.1115/IMECE1997-0508

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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination

Proceedings Papers

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Daqing Zou, Xiaoyuan He, Minfu Lu, Sheng Liu, Yifan Guo

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 59-64, November 15–20, 1998

Paper No: IMECE1998-0429

DOI: https://doi.org/10.1115/IMECE1998-0429

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Topics: Circuits, Control equipment, Corners (Structural elements), Deformation, Density, Displacement, Electronic packages, Flip-chip, Flip-chip packages, Interferometers

Proceedings Papers

Quantification of Femoral Surface Strain by Computer Analysis of the Photoelastic Method

Randal P. Morris, Michael J. Grecula, William L. Buford, Jr., Rita M. Patterson

Proc. ASME. IMECE98, Advances in Bioengineering, 225-226, November 15–20, 1998

Paper No: IMECE1998-0112

DOI: https://doi.org/10.1115/IMECE1998-0112

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Topics: Arthroplasty, Artificial limbs, Bone, Computers, Design, Finite element analysis, Prostheses, Strain gages, Strain measurement, Stress

Proceedings Papers

Evaluation of Fiber Optic Sensors for Measuring Strain in Aircraft Applications

Jim Tarter, Jim Sirkis, Tom Boyer

Proc. ASME. IMECE98, Adaptive Structures and Material Systems, 277-282, November 15–20, 1998

Paper No: IMECE1998-0962

DOI: https://doi.org/10.1115/IMECE1998-0962

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Topics: Aircraft, Fiber optic sensors, Strain measurement, Cantilever beams, Fibers, Sensors, Strain gages

Proceedings Papers

Surface Acoustic Wave Sensors for Temperature and Strain Measurements

Yang Yan, Yudong Wang, Fang Li

Proc. ASME. IMECE2020, Volume 13: Micro- and Nano-Systems Engineering and Packaging, V013T13A011, November 16–19, 2020

Paper No: IMECE2020-24340

DOI: https://doi.org/10.1115/IMECE2020-24340

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Topics: Sensors, Strain measurement, Surface acoustic waves, Temperature, Testing, Delays, Pressure, Design, Fuels, Hydrogen

Proceedings Papers

Large Deformation Strain Measurement Using Digital Image Correlation Technique During Axial Crushing of an Extruded AA-6063 Tube

Arun Kumar Sudalaiyandi, Ramesh Krishnamurthi, Raghu V. Prakash

Proc. ASME. IMECE2016, Volume 9: Mechanics of Solids, Structures and Fluids; NDE, Diagnosis, and Prognosis, V009T12A050, November 11–17, 2016

Paper No: IMECE2016-66339

DOI: https://doi.org/10.1115/IMECE2016-66339

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Topics: Deformation, Strain measurement, Displacement, Fracture (Process), Aircraft, Aluminum alloys, Automobiles, Buckling, Collisions (Physics), Computer simulation

Proceedings Papers

CPI Stress Induced Carrier Mobility Shift in Advanced Silicon Nodes

Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan, Henrik Hovsepyan, Uwe Muehle, Ehrenfried Zschech, Riko Radojcic

Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A046, November 11–17, 2016

Paper No: IMECE2016-65171

DOI: https://doi.org/10.1115/IMECE2016-65171

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Topics: Electron mobility, Silicon, Stress, Simulation, Design, Flow (Dynamics), Calibration, Circuits, Finite element analysis, Fittings

Proceedings Papers

Measurement of Leadframe Strain in Electrically Active Power Semiconductors

Seth M. Avery, Robert D. Lorenz

Proc. ASME. IMECE2015, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A018, November 13–19, 2015

Paper No: IMECE2015-50357

DOI: https://doi.org/10.1115/IMECE2015-50357

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Topics: Deformation, Displacement, Displacement measurement, Electronic speckle pattern interferometry, Modeling, Noise (Sound), Power semiconductor devices, Resolution (Optics), Strain measurement, Stress

Proceedings Papers

Comparing Methods for Establishing Multiscale Material Properties of 0.2 mm Thick Annealed ASTM 304

William J. Emblom, Md. F. S. Ibne Islam, Richard J. Jones, Mitra Aithal, Scott Wagner, Thomas Pesacreta, Gary A. Glass

Proc. ASME. IMECE2015, Volume 2A: Advanced Manufacturing, V02AT02A020, November 13–19, 2015

Paper No: IMECE2015-50019

DOI: https://doi.org/10.1115/IMECE2015-50019

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Topics: ASTM International, Materials properties, Microscale devices, Membranes, Strain measurement, Errors, Finite element analysis, Poles (Building), Constitutive equations, Continuum mechanics

Proceedings Papers

Operating Strain Mode Identification Using Acceleration Measurements

Jakerson R. Gevinski, Robson Pederiva

Proc. ASME. IMECE2013, Volume 14: Vibration, Acoustics and Wave Propagation, V014T15A055, November 15–21, 2013

Paper No: IMECE2013-65306

DOI: https://doi.org/10.1115/IMECE2013-65306

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Topics: Accelerometers, Aluminum plate, Computer simulation, Deflection, Displacement, Finite element methods, Gages, Machinery, Shapes, Signals

Proceedings Papers

Buckling Measurement of Cylindrical Shells by Digital Image Correlation Method

Tzu-Yu Kuo, Wei-Chung Wang, Chun-I Chu, Jia-He Chen, Te-Heng Hung, Jen-Yuan (James) Chang

Proc. ASME. IMECE2013, Volume 9: Mechanics of Solids, Structures and Fluids, V009T10A089, November 15–21, 2013

Paper No: IMECE2013-62332

DOI: https://doi.org/10.1115/IMECE2013-62332

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Topics: Buckling, Pipes, Deformation, Strain gages, Strain measurement, ASTM International, Reliability, Safety, Stress

Proceedings Papers

On the Dynamics of an Inverted Flexible Pendulum With Tip Mass on a Cart

Prasanna Gandhi, Ojas Patil

Proc. ASME. IMECE2012, Volume 4: Dynamics, Control and Uncertainty, Parts A and B, 415-423, November 9–15, 2012

Paper No: IMECE2012-87187

DOI: https://doi.org/10.1115/IMECE2012-87187

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Topics: Dynamics (Mechanics), Pendulums, Equilibrium (Physics), Deflection, Design, Dynamic models, Nonlinear dynamics, Strain measurement, Weight (Mass)

Proceedings Papers

Identification and Quantification of Residual Strains During Curing of Carbon Fiber Epoxy Laminates

Russell Mailen, David A. Jack, Lesley M. Wright

Proc. ASME. IMECE2012, Volume 8: Mechanics of Solids, Structures and Fluids, 139-147, November 9–15, 2012

Paper No: IMECE2012-88385

DOI: https://doi.org/10.1115/IMECE2012-88385

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Topics: Carbon fibers, Epoxy adhesives, Epoxy resins, Hardening (Curing), Laminates, Composite materials, Cycles, Differential scanning calorimetry, Shapes, Shrinkage (Materials)

Proceedings Papers

Creep Strain Measurement of an Actual Leadfree Solder Interconnect Using Digital Image Correlation

Hohyung Lee, Seungbae Park

Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 485-490, November 9–15, 2012

Paper No: IMECE2012-89799

DOI: https://doi.org/10.1115/IMECE2012-89799

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Topics: Creep, Lead-free solders, Strain measurement, Solders, Solder joints, Ball-Grid-Array packaging, Displacement, Temperature, Alloys, Ball-Grid-Array packages

Proceedings Papers

A New Approach to Measure Strain During Friction Stir Welding Using Visioplasticity

Mohamadreza Nourani, Abbas S. Milani, Spiro Yannacopoulos

Proc. ASME. IMECE2011, Volume 8: Mechanics of Solids, Structures and Fluids; Vibration, Acoustics and Wave Propagation, 1-7, November 11–17, 2011

Paper No: IMECE2011-62061

DOI: https://doi.org/10.1115/IMECE2011-62061

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Topics: Friction, Welding, Plates (structures), Aluminum alloys, Aluminum plate, Composite materials, Computer simulation, Deformation, Mechanical properties, Modeling

Proceedings Papers

Investigation of Hole Expansion Characteristics of DP 600 With Testing and Modeling

Siddharth Mohan Ram, Hong-Tae Kang

Proc. ASME. IMECE2010, Volume 3: Design and Manufacturing, Parts A and B, 47-51, November 12–18, 2010

Paper No: IMECE2010-39455

DOI: https://doi.org/10.1115/IMECE2010-39455

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Topics: Automotive industry, Deformation, Failure, Finite element analysis, Flanges, Modeling, Sheet metal, Simulation results, Steel sheet, Strain measurement

Proceedings Papers

Piezoelectric Strain Measurement for Low Power Microsensor Applications

Alborz Amini, Behraad Bahreyni

Proc. ASME. IMECE2010, Volume 10: Micro and Nano Systems, 495-499, November 12–18, 2010

Paper No: IMECE2010-40508

DOI: https://doi.org/10.1115/IMECE2010-40508

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Topics: Microsensors, Strain measurement, Impedance (Electricity), Stress, Computer simulation, Engineering simulation, Finite element analysis, Frequency response, Piezoelectric materials, Piezoelectric transducers

Proceedings Papers

Experimental Validation of a CORE Type Power Transformer

E. Emanuel Almeida, He´lder G. Mendes, A. Marques Pinho

Proc. ASME. IMECE2009, Volume 11: Mechanics of Solids, Structures and Fluids, 129-136, November 13–19, 2009

Paper No: IMECE2009-10446

DOI: https://doi.org/10.1115/IMECE2009-10446

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Topics: Power transformers, Finite element methods, Finite element model, Stress, Design, Design methodology, Feedback, Finite element analysis, Mechanical structures, Strain measurement

NARROW

Applications of Digital Correlation Method to Microscopic Strain Measurement and Materials’ Property Characterization

Prediction of Thermal Deformation of Machine Tool With Strain Sensor

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Quantification of Femoral Surface Strain by Computer Analysis of the Photoelastic Method

Evaluation of Fiber Optic Sensors for Measuring Strain in Aircraft Applications

Surface Acoustic Wave Sensors for Temperature and Strain Measurements

Large Deformation Strain Measurement Using Digital Image Correlation Technique During Axial Crushing of an Extruded AA-6063 Tube

CPI Stress Induced Carrier Mobility Shift in Advanced Silicon Nodes

Measurement of Leadframe Strain in Electrically Active Power Semiconductors

Comparing Methods for Establishing Multiscale Material Properties of 0.2 mm Thick Annealed ASTM 304

Operating Strain Mode Identification Using Acceleration Measurements

Buckling Measurement of Cylindrical Shells by Digital Image Correlation Method

On the Dynamics of an Inverted Flexible Pendulum With Tip Mass on a Cart

Identification and Quantification of Residual Strains During Curing of Carbon Fiber Epoxy Laminates

Creep Strain Measurement of an Actual Leadfree Solder Interconnect Using Digital Image Correlation

A New Approach to Measure Strain During Friction Stir Welding Using Visioplasticity

Investigation of Hole Expansion Characteristics of DP 600 With Testing and Modeling

Piezoelectric Strain Measurement for Low Power Microsensor Applications

Experimental Validation of a CORE Type Power Transformer

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