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Proceedings Papers

Reliability of Welded Joints With Short Fatigue Cracks

David B. Lanning, Jr., M.-H. Herman Shen
Proc. ASME. IMECE96, Recent Advances in Solids/Structures and Application of Metallic Materials, 45-51, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0143
https://doi.org/10.1115/IMECE1996-0143
View Paper titled, Reliability of Welded Joints With Short Fatigue Cracks
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Topics: Fatigue cracks, Reliability, Welded joints, Fracture (Materials), Crack propagation, Event history analysis, Fatigue, Flat plates, Fracture mechanics, Magnification
Proceedings Papers

Flow and Heat Transfer Problems in the Semiconductor Manufacturing Processes

Masato Ikegawa
Proc. ASME. IMECE96, Transport Phenomena in Materials Processing and Manufacturing, 183, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1044
https://doi.org/10.1115/IMECE1996-1044
View Paper titled, Flow and Heat Transfer Problems in the Semiconductor Manufacturing Processes
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Topics: Flow (Dynamics), Heat transfer, Integrated circuit fabrication, Semiconductor wafers, Manufacturing, Particulate matter, Chemical reactions, Chemical vapor deposition, Contamination, Etching
Proceedings Papers

Valve Stiction in Reciprocating Compressors

B. G. Shiva Prasad, Daniel Panayil
Proc. ASME. IMECE96, Advanced Energy Systems, 171-180, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0272
https://doi.org/10.1115/IMECE1996-0272
View Paper titled, Valve Stiction in Reciprocating Compressors
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Topics: Compressors, Stiction, Valves, Dynamics (Mechanics), Evacuations, Magnetic recording, Reliability, Surface tension, Tribology
Proceedings Papers

Discrete-Time Well-Conditioned State Observer Design and Evaluation

Kunsoo Huh, Byunggil Kwak, Jeffrey L. Stein
Proc. ASME. IMECE96, Dynamic Systems and Control, 235-242, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0342
https://doi.org/10.1115/IMECE1996-0342
View Paper titled, Discrete-Time Well-Conditioned State Observer Design and Evaluation
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Topics: Design, State estimation, Robustness, Discrete time systems, Errors, Kalman filters, Machinery, Monitoring systems, Design methodology, Eigenvalues
Proceedings Papers

Flow and Particle Paths in Three-Dimensional Model Skeletal Muscle Ventricles

F. Iudicello, F. S. Henry, M. W. Collins, A. Shortland, R. Black, J. C. Jarvis, S. Salmons
Proc. ASME. IMECE96, Advances in Bioengineering, 467-468, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1317
https://doi.org/10.1115/IMECE1996-1317
View Paper titled, Flow and Particle Paths in Three-Dimensional Model Skeletal Muscle Ventricles
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Topics: Flow (Dynamics), Muscle, Particulate matter, Three-dimensional models, Engineering simulation, Reliability, Simulation
Proceedings Papers

A Computational Tool for Failure Modes and Effects Analysis of Hydraulic Systems

D. R. Bull, C. R. Burrows, K. A. Edge, P. G. Hawkins, D. J. Woollons
Proc. ASME. IMECE96, Fluid Power Systems and Technology, 113-118, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0551
https://doi.org/10.1115/IMECE1996-0551
View Paper titled, A Computational Tool for Failure Modes and Effects Analysis of Hydraulic Systems
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Topics: Failure mechanisms, Hydraulic drive systems, Design, Failure mode and effects analysis, Hydrostatics, Reliability
Proceedings Papers

Demonstration of the Electric Controlled Pneumatic Brakes on the Union Pacific Railroad

Robert A. Cartwright, David S. McConnell
Proc. ASME. IMECE96, Rail Transportation, 11-15, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0586
https://doi.org/10.1115/IMECE1996-0586
View Paper titled, Demonstration of the Electric Controlled Pneumatic Brakes on the Union Pacific Railroad
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Topics: Brakes, Pacific Ocean, Railroads, Reliability, Trains, Wire
Proceedings Papers

Criticality-Based Maintenance: Prioritizing Maintenance Activities for Optimum Equipment Reliability

V. Anthony Ciliberti
Proc. ASME. IMECE96, Safety Engineering and Risk Analysis, 17-20, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0701
https://doi.org/10.1115/IMECE1996-0701
View Paper titled, Criticality-Based Maintenance: Prioritizing Maintenance Activities for Optimum Equipment Reliability
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Topics: Maintenance, Reliability, Hazard analysis, Petrochemical processing, Regulations, Safety
Proceedings Papers

A Process to Quantify and Optimize the Effectiveness of Maintenance on Unavailability and Risk

W. E. Vesely
Proc. ASME. IMECE96, Safety Engineering and Risk Analysis, 21-27, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0702
https://doi.org/10.1115/IMECE1996-0702
View Paper titled, A Process to Quantify and Optimize the Effectiveness of Maintenance on Unavailability and Risk
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Topics: Maintenance, Risk, Reliability, Valves, Engines, Failure data, Motors, Nuclear power stations, Plant maintenance
Proceedings Papers

Predicted Dynamic Strength and Durability of a Network Interface Unit (NIU) Enclosure

M. Uschitsky, E. Suhir, L. Shepherd, W. R. Lambert, M. A. Zimmerman
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 1-36, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0720
https://doi.org/10.1115/IMECE1996-0720
View Paper titled, Predicted Dynamic Strength and Durability of a Network Interface Unit (NIU) Enclosure
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Topics: Design, Durability, Dynamic response, Fracture (Materials), Fracture (Process), Reliability, Service life (Equipment), Shock (Mechanics), Stress, Structural analysis
Proceedings Papers

Separation of a Molten Axisymmetric Solder Joint

Lewis S. Goldmann
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 169-173, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0731
https://doi.org/10.1115/IMECE1996-0731
View Paper titled, Separation of a Molten Axisymmetric Solder Joint
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Topics: Separation (Technology), Solder joints, Ball-Grid-Array packaging, Displacement, Flip-chip, Flip-chip devices, Joining, Reliability
Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep

Anthony J. Rafanelli
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 45-58, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0722
https://doi.org/10.1115/IMECE1996-0722
View Paper titled, A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep
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Topics: Creep, Epoxy adhesives, Epoxy resins, Reliability, Thermal stability, Thermomechanics, Solders, Adhesives, Bonding, Fatigue
Proceedings Papers

Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner

M. Uschitsky, E. Suhir
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 67-100, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0724
https://doi.org/10.1115/IMECE1996-0724
View Paper titled, Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner
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Topics: Corners (Structural elements), Epoxy adhesives, Epoxy resins, Molding, Stress, Delamination, Adhesion, Fracture (Materials), Reliability, Design
Proceedings Papers

Impact of Polymerization on Warpage Prediction of Molded Plastic Packages

Sue Y. Teng, Vijay Sarihan, Ron Thomas, Indira Adhihetty
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 127-131, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0726
https://doi.org/10.1115/IMECE1996-0726
View Paper titled, Impact of Polymerization on Warpage Prediction of Molded Plastic Packages
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Topics: Molded plastics, Polymerization, Warping, Heat sinks, Temperature, Cycles, Design, Energy dissipation, Finite element methods, Finite element model
Proceedings Papers

Physics of Failure Based CAD Software for Reliability Assessment of Hybrid Optoelectronic Packages

Patricia F. Mead, Patrick McCluskey, Qing Yan Chen, Don Haislett
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 205-211, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0735
https://doi.org/10.1115/IMECE1996-0735
View Paper titled, Physics of Failure Based CAD Software for Reliability Assessment of Hybrid Optoelectronic Packages
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Topics: Computer software, Computer-aided design, Failure, Physics, Reliability, Lasers, Light-emitting diodes, Optoelectronic devices, Printed circuit board assemblies, Computer-aided engineering
Proceedings Papers

Procedure for CAD Assessment of Thermal Management Performance in a Diode Laser Structure

Rajesh R. Kamath, Patricia F. Mead
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 213-216, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0736
https://doi.org/10.1115/IMECE1996-0736
View Paper titled, Procedure for CAD Assessment of Thermal Management Performance in a Diode Laser Structure
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Topics: Computer-aided design, Lasers, Thermal management, Finite element analysis, Steady state, Heat sinks, Heat transfer, Operating temperature, Design, Energy dissipation
Proceedings Papers

Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

M. Asheghi, M. N. Touzelbaev, K. E. Goodson, Y. K. Leung, S. S. Wong
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 83-91, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1340
https://doi.org/10.1115/IMECE1996-1340
View Paper titled, Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates
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Topics: Crystals, Silicon, Silicon-on-insulator, Temperature, Thermal conductivity, Semiconductor wafers, Phonons, Transistors, Cantilevers, Electromagnetic scattering
Proceedings Papers

Short-Timescale Thermometry and Reliability Studies of Metal Interconnects in VLSI Circuits

Y. S. Ju, K. E. Goodson
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 31-36, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1333
https://doi.org/10.1115/IMECE1996-1333
View Paper titled, Short-Timescale Thermometry and Reliability Studies of Metal Interconnects in VLSI Circuits
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Topics: Circuits, Metals, Reliability, Temperature measurement, Resolution (Optics), Reflectance, Temperature, Atomic force microscopy, Calibration, Current density
Proceedings Papers

The Development of Machine Fault Detection Using Artificial Neural Network and Fuzzy Logic Technologies

Mo-yuen Chow, Yuan-Shin Lee
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 549-554, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0825
https://doi.org/10.1115/IMECE1996-0825
View Paper titled, The Development of Machine Fault Detection Using Artificial Neural Network and Fuzzy Logic Technologies
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Topics: Artificial neural networks, Flaw detection, Fuzzy logic, Machinery, Economics , Engines, Motors, Reliability, Safety
Proceedings Papers

A Methodology to Study Wafer Level Response of Silicon Microstructures to Mechanical Shock

David G. McIntyre, Shawn J. Cunningham, Judd S. Carper, Paul D. Jaramillo, William C. Tang
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 435-439, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1386
https://doi.org/10.1115/IMECE1996-1386
View Paper titled, A Methodology to Study Wafer Level Response of Silicon Microstructures to Mechanical Shock
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Topics: Semiconductor wafers, Shock (Mechanics), Silicon, Reliability, Explosives, Innovation, Microelectromechanical systems, Sensors, Stress