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Proceedings Papers

Serial and Parallel Fast-Floquet Analyses in Rotorcraft Aeroelasticity

S. Subramanian, S. Venkataratnam, G. H. Gaonkar

Proc. ASME. IMECE97, 4th International Symposium on Fluid-Structure Interactions, Aeroelasticity, Flow-Induced Vibration and Noise: Volume III, 41-58, November 16–21, 1997

Paper No: IMECE1997-0158

DOI: https://doi.org/10.1115/IMECE1997-0158

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Topics: Aeroelasticity, Blades, Computers, Databases, Eigenvalues, Hardware, Reliability, Rotors, Stability

Proceedings Papers

Monitoring Technology for Achieving Intelligent Grinding System

Ichiro Inasaki

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 75-81, November 16–21, 1997

Paper No: IMECE1997-1078

DOI: https://doi.org/10.1115/IMECE1997-1078

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Topics: Grinding, Sensors, Wheels, Acoustic emissions, Monitoring systems, Abrasives, Artificial intelligence, Databases, Genetic algorithms, Reliability

Proceedings Papers

CBGA Solder Fillet Shape Prediction and Design Optimization

Y. Li, R. L. Mahajan

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 431-438, November 16–21, 1997

Paper No: IMECE1997-1120

DOI: https://doi.org/10.1115/IMECE1997-1120

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Topics: Design, Optimization, Shapes, Solders, Mathematical analysis, Reliability, Ball-Grid-Array packaging, Ceramics, Composite materials, Experimental design

Proceedings Papers

Closing the Gap Between CAD/CAM and Machining Process Simulation: A Generic Solution

Hazim A. El-Mounayri, Behnam M. Imani, Mohamed. A. Elbestawi, Allan D. Spence

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 127-134, November 16–21, 1997

Paper No: IMECE1997-1144

DOI: https://doi.org/10.1115/IMECE1997-1144

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Topics: Computer-aided design, Machining, Process simulation, Milling, Cutting, Modeling, Reliability, Simulation

Proceedings Papers

A Thermomechanical Model of Machine Tool Spindles for Use in the Design of Reconfigurable Angular Contact Spindle Bearing Load Control Systems

Alex O. Gibson, Jeffrey L. Stein, Jay F. Tu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 23-30, November 16–21, 1997

Paper No: IMECE1997-1071

DOI: https://doi.org/10.1115/IMECE1997-1071

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Topics: Bearings, Control systems, Design, Machine tool spindles, Stress, Thermomechanics, Roller bearings, Thermal expansion, Centrifugal force, Deflection

Proceedings Papers

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

Xiaohua Wu, Xinyu Dou, Chao-pin Yeh, Karl Waytt

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 391-395, November 16–21, 1997

Paper No: IMECE1997-1115

DOI: https://doi.org/10.1115/IMECE1997-1115

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Topics: Simulation, Solder joints, Geometry, Solders, Engineering simulation, Failure, Reliability, Wetting, Alloys, Computer simulation

Proceedings Papers

Applications of Digital Correlation Method to Microscopic Strain Measurement and Materials’ Property Characterization

H. Lu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 423-428, November 16–21, 1997

Paper No: IMECE1997-1119

DOI: https://doi.org/10.1115/IMECE1997-1119

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Topics: Hardware, Manufacturing, Reliability, Resolution (Optics), Strain measurement

Proceedings Papers

Investigation of the Lead-On-Chip Package’s Reliability

P.-H. Tsao, L. C. Chang, T. C. Chen, Chender Haung, C. Z. Chen

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 347-351, November 16–21, 1997

Paper No: IMECE1997-1109

DOI: https://doi.org/10.1115/IMECE1997-1109

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Topics: Reliability, Epoxy adhesives, Epoxy resins, Silicon chips, Crack propagation, Failure mechanisms, Finite element analysis, Fracture (Materials), Manufacturing, Molding

Proceedings Papers

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Jiansen Zhu, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 361-368, November 16–21, 1997

Paper No: IMECE1997-1111

DOI: https://doi.org/10.1115/IMECE1997-1111

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Topics: Simulation, Thermal deformation, Temperature, Finite element analysis, Interferometry, Diffraction patterns, Electronic packaging, Packaging, Reliability, Diffraction gratings

Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997

Paper No: IMECE1997-1221

DOI: https://doi.org/10.1115/IMECE1997-1221

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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards

Proceedings Papers

Testing and Measurement Techniques Applied to Electronic Packaging Development

Yifan Guo, Vijay Sarihan

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 85-90, November 16–21, 1997

Paper No: IMECE1997-1231

DOI: https://doi.org/10.1115/IMECE1997-1231

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Topics: Electronic packaging, Testing, Cycles, Design, Electronic packages, Electronics, Engineering disciplines, Event history analysis, Experimental methods, Packaging

Proceedings Papers

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Yifan Guo, Vijay Sarihan, Tom Lee

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 23-27, November 16–21, 1997

Paper No: IMECE1997-1223

DOI: https://doi.org/10.1115/IMECE1997-1223

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Topics: Accelerated life testing, Membranes, Sensors, Reliability, Testing, Failure, High temperature, Stress, Cycles, Deformation

Proceedings Papers

Advances in Stress Test Chips

Richard C. Jaeger, Jeffrey C. Suhling

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 1-5, November 16–21, 1997

Paper No: IMECE1997-1220

DOI: https://doi.org/10.1115/IMECE1997-1220

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Topics: Stress, Sensors, Silicon, Circuits, Electronic packages, Energy dissipation, Integrated circuits, Operating temperature, Reliability, Resistors

Proceedings Papers

Application of the Thermal Network Method to the Transient Thermal Analysis of Multichip Modules

Masaru Ishizuka, Hideo Iwasaki

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 75-81, November 16–21, 1997

Paper No: IMECE1997-1216

DOI: https://doi.org/10.1115/IMECE1997-1216

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Topics: Multi-chip modules, Thermal analysis, Transients (Dynamics), Density, Design, Electronic circuits, Energy dissipation, Heat, Packaging, Reliability

Proceedings Papers

Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

K. Ramakrishna, J. R. Trent

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 13-21, November 16–21, 1997

Paper No: IMECE1997-1210

DOI: https://doi.org/10.1115/IMECE1997-1210

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Topics: Automotive industry, Ball-Grid-Array packaging, Temperature, Junctions, Printed circuit boards, Computational fluid dynamics, Thermal conductivity, Heat transfer, Transients (Dynamics), Energy dissipation

Proceedings Papers

Transient Thermal Analysis of Outdoor Electronic Equipment

L. T. Yeh

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 65-73, November 16–21, 1997

Paper No: IMECE1997-1215

DOI: https://doi.org/10.1115/IMECE1997-1215

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Topics: Electronic equipment, Thermal analysis, Transients (Dynamics), Temperature, Cycles, Design, Electronic components, Flow (Dynamics), Junctions, Reliability

Proceedings Papers

Finite Element Modeling of Submerged Aquaculture Net-Pen Systems

M. Gosz, K. Kestler, M. R. Swift, B. Celikkol

Proc. ASME. IMECE97, Ocean Engineering, 243-250, November 16–21, 1997

Paper No: IMECE1997-1262

DOI: https://doi.org/10.1115/IMECE1997-1262

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Topics: Finite element analysis, Modeling, Design, Dynamic response, Fluids, Equilibrium (Physics), Ocean engineering, Stress, Computer simulation, Computers

Proceedings Papers

Estimation of an Improved Technique for Measuring a Near Wake Flow Field of a Bluff Body With a Parallel Triple-Wire Probe

R. Waka, T. Suzuki, Y. Ochiai, T. Watanabe

Proc. ASME. IMECE97, 4th International Symposium on Fluid-Structure Interactions, Aeroelasticity, Flow-Induced Vibration and Noise: Volume I, 191-198, November 16–21, 1997

Paper No: IMECE1997-0059

DOI: https://doi.org/10.1115/IMECE1997-0059

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Topics: Probes, Wakes, Wire, Cylinders, Flow (Dynamics), Reliability

Proceedings Papers

Vibrotactile Feedback for Industrial Telemanipulators

Jack Tigh Dennerlein, Paul A. Millman, Robert D. Howe

Proc. ASME. IMECE97, Dynamic Systems and Control, 189-195, November 16–21, 1997

Paper No: IMECE1997-0396

DOI: https://doi.org/10.1115/IMECE1997-0396

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Topics: Feedback, Sensors, Engineering prototypes, Plates (structures), Frequency response, Grippers, Haptics, Manipulators, Oscillating frequencies, Reliability

Proceedings Papers

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Carole A. Le Gall, Jianmin Qu, David L. McDowell

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 85-95, November 16–21, 1997

Paper No: IMECE1997-0503

DOI: https://doi.org/10.1115/IMECE1997-0503

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Topics: Flip-chip, Flip-chip devices, Reliability, Thermomechanics, Stress, Creep, Dimensions, Elasticity, Flip-chip assemblies, Geometry

2 3 4 5

NARROW

Serial and Parallel Fast-Floquet Analyses in Rotorcraft Aeroelasticity

Monitoring Technology for Achieving Intelligent Grinding System

CBGA Solder Fillet Shape Prediction and Design Optimization

Closing the Gap Between CAD/CAM and Machining Process Simulation: A Generic Solution

A Thermomechanical Model of Machine Tool Spindles for Use in the Design of Reconfigurable Angular Contact Spindle Bearing Load Control Systems

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

Applications of Digital Correlation Method to Microscopic Strain Measurement and Materials’ Property Characterization

Investigation of the Lead-On-Chip Package’s Reliability

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Testing and Measurement Techniques Applied to Electronic Packaging Development

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Advances in Stress Test Chips

Application of the Thermal Network Method to the Transient Thermal Analysis of Multichip Modules

Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

Transient Thermal Analysis of Outdoor Electronic Equipment

Finite Element Modeling of Submerged Aquaculture Net-Pen Systems

Estimation of an Improved Technique for Measuring a Near Wake Flow Field of a Bluff Body With a Parallel Triple-Wire Probe

Vibrotactile Feedback for Industrial Telemanipulators

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

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