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Proceedings Papers

Sequential Processing Mechanics Modeling for a Model IC Package

Jianjun Wang, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 401-410, November 16–21, 1997

Paper No: IMECE1997-1117

DOI: https://doi.org/10.1115/IMECE1997-1117

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Topics: Modeling, Stress, Manufacturing, Solders, Temperature, Finite element analysis, Finite element methods, Finite element model, Silicon chips, Bonding

Proceedings Papers

Video Based Manufacturing Courses for Electronics

John A. Fillo, Chittaranjan Sahay, Krishnaswami Srihari

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 471-477, November 16–21, 1997

Paper No: IMECE1997-1126

DOI: https://doi.org/10.1115/IMECE1997-1126

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Topics: Electronics, Manufacturing, Defense industry, Packaging, Students, Wire

Proceedings Papers

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Jiansen Zhu, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 361-368, November 16–21, 1997

Paper No: IMECE1997-1111

DOI: https://doi.org/10.1115/IMECE1997-1111

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Topics: Simulation, Thermal deformation, Temperature, Finite element analysis, Interferometry, Diffraction patterns, Electronic packaging, Packaging, Reliability, Diffraction gratings

Proceedings Papers

On the Equivalent Finite Element Beam Model for Ball Grid Array Analysis

Hsien-Chie Cheng, Kuo-Ning Chiang, Ming-Hsiao Lee

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 353-360, November 16–21, 1997

Paper No: IMECE1997-1110

DOI: https://doi.org/10.1115/IMECE1997-1110

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Topics: Ball-Grid-Array packaging, Finite element analysis, Optimization, Packaging, Pipes, Plastics, Solder joints

Proceedings Papers

Thermodynamics of Insulated Pressure Vessels for Vehicular Hydrogen Storage

Salvador M. Aceves, Gene D. Berry

Proc. ASME. IMECE97, Advanced Energy Systems, 155-163, November 16–21, 1997

Paper No: IMECE1997-0985

DOI: https://doi.org/10.1115/IMECE1997-0985

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Topics: Hydrogen storage, Pressure vessels, Thermodynamics, Hydrogen, Temperature, Vessels, Automobiles, Fuels, Low temperature, Pressure

Proceedings Papers

Testing and Measurement Techniques Applied to Electronic Packaging Development

Yifan Guo, Vijay Sarihan

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 85-90, November 16–21, 1997

Paper No: IMECE1997-1231

DOI: https://doi.org/10.1115/IMECE1997-1231

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Topics: Electronic packaging, Testing, Cycles, Design, Electronic packages, Electronics, Engineering disciplines, Event history analysis, Experimental methods, Packaging

Proceedings Papers

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Y. Zou, J. C. Suhling, R. C. Jaeger, S. T. Lin, L. Nguyen, S. A. Gee

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 15-21, November 16–21, 1997

Paper No: IMECE1997-1222

DOI: https://doi.org/10.1115/IMECE1997-1222

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Topics: Silicon, Stress, Finite element analysis, Temperature, Constitutive equations, Electronic packaging, Engineering simulation, Packaging, Sensors, Shear stress

Proceedings Papers

Application of the Thermal Network Method to the Transient Thermal Analysis of Multichip Modules

Masaru Ishizuka, Hideo Iwasaki

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 75-81, November 16–21, 1997

Paper No: IMECE1997-1216

DOI: https://doi.org/10.1115/IMECE1997-1216

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Topics: Multi-chip modules, Thermal analysis, Transients (Dynamics), Density, Design, Electronic circuits, Energy dissipation, Heat, Packaging, Reliability

Proceedings Papers

Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

K. Ramakrishna, J. R. Trent

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 13-21, November 16–21, 1997

Paper No: IMECE1997-1210

DOI: https://doi.org/10.1115/IMECE1997-1210

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Topics: Automotive industry, Ball-Grid-Array packaging, Temperature, Junctions, Printed circuit boards, Computational fluid dynamics, Thermal conductivity, Heat transfer, Transients (Dynamics), Energy dissipation

Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

William T. Chen, David Questad, David Read, Bahgat Sammakia

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997

Paper No: IMECE1997-0515

DOI: https://doi.org/10.1115/IMECE1997-0515

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Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing

Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997

Paper No: IMECE1997-0499

DOI: https://doi.org/10.1115/IMECE1997-0499

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Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip

Proceedings Papers

Low Cost Plastic Packaging of the Network Interface Unit

M. A. Zimmerman

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 65-80, November 16–21, 1997

Paper No: IMECE1997-0815

DOI: https://doi.org/10.1115/IMECE1997-0815

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Topics: Packaging, Electronics, Snap fitting, Design, Fire resistance, Gaskets, Heat, Hinges, Injection molded plastics, Low temperature

Proceedings Papers

Design Considerations in Avionics Electronic Packaging

Ali Jamnia, Robert E. Walter

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 1-13, November 16–21, 1997

Paper No: IMECE1997-0810

DOI: https://doi.org/10.1115/IMECE1997-0810

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Topics: Avionics, Design, Electronic packaging, Aeronautics, Aviation, Electronic packages, Engineers, Failure, Finite element methods, Packaging

Proceedings Papers

Packaging and Instrumentation of a Commercial Pressure Sensor for a High-G Impact and the Martian Environment

J. Kurth Reynolds, David C. Catling, Randy C. Blue, Nadim Maluf, Thomas W. Kenny

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 401-406, November 15–20, 1998

Paper No: IMECE1998-1276

DOI: https://doi.org/10.1115/IMECE1998-1276

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Topics: Instrumentation, Packaging, Pressure sensors, Sensors, Temperature, Atmospheric pressure, Calibration, Errors, Fluctuations (Physics), NASA

Proceedings Papers

Ceramic Tape-Based Meso Systems Technology

Haim H. Bau, Suresh G. K. Ananthasuresh, Jorge J. Santiago-Avilés, Jihua Zhong, Moon Kim, Mingqiang Yi, Patricio Espinoza-Vallejos, Luis Sola-Laguna

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 491-498, November 15–20, 1998

Paper No: IMECE1998-1290

DOI: https://doi.org/10.1115/IMECE1998-1290

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Topics: Ceramics, Glass, Manufacturing, Silicon, Binders (Materials), Firing, Flow (Dynamics), Lamination, Low temperature, Microelectromechanical systems

Proceedings Papers

Structural Analysis of a Sensor Module for the “Smart” Bearing

Robert Gao, Priyaranjan Sahay

Proc. ASME. IMECE98, Dynamic Systems and Control, 615-621, November 15–20, 1998

Paper No: IMECE1998-0309

DOI: https://doi.org/10.1115/IMECE1998-0309

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Topics: Bearings, Sensors, Structural analysis, Ball bearings, Deflection, Design, Electronic components, Modal analysis, Packaging, Stress

Proceedings Papers

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Daqing Zou, Xiaoyuan He, Minfu Lu, Sheng Liu, Yifan Guo

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 59-64, November 15–20, 1998

Paper No: IMECE1998-0429

DOI: https://doi.org/10.1115/IMECE1998-0429

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Topics: Circuits, Control equipment, Corners (Structural elements), Deformation, Density, Displacement, Electronic packages, Flip-chip, Flip-chip packages, Interferometers

Proceedings Papers

Die Stress Measurements Using High Temperature Die-Attachment Materials

Yida Zou, Jeffrey C. Suhling, Richard C. Jaeger, Shun-Tien Lin, Jeffrey T. Benoit, Richard R. Grzybowski

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 107-117, November 15–20, 1998

Paper No: IMECE1998-0436

DOI: https://doi.org/10.1115/IMECE1998-0436

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Topics: High temperature, Stress, Temperature, Adhesives, Sensors, Ceramics, Engineering simulation, Finite element analysis, Glass, Packaging

Proceedings Papers

Flow Modeling and Validation of the Encapsulation of Plastic Packages

L. Nguyen, C. Quentin, W. Lee, S. Bayyuk, S. A. Bidstrup-Allen, S.-T. Wang

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 119-134, November 15–20, 1998

Paper No: IMECE1998-0437

DOI: https://doi.org/10.1115/IMECE1998-0437

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Topics: Flow (Dynamics), Modeling, Simulation, Chemically reactive flow, Computer software, Computer-aided design, Cycles, Deformation, Design, Design for Manufacturing

Proceedings Papers

Automatic Warpage Measurement of Advanced Packages by Optical Method

Xiaoyuan He, Jiabin Dai, Sheng Liu

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 65-70, November 15–20, 1998

Paper No: IMECE1998-0430

DOI: https://doi.org/10.1115/IMECE1998-0430

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Topics: Warping, Deformation, Ball-Grid-Array packaging, Shapes, Computer software, Diffraction gratings, Imaging, Manufacturing, Modeling, Packaging

2 3 4 5

NARROW

Sequential Processing Mechanics Modeling for a Model IC Package

Video Based Manufacturing Courses for Electronics

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

On the Equivalent Finite Element Beam Model for Ball Grid Array Analysis

Thermodynamics of Insulated Pressure Vessels for Vehicular Hydrogen Storage

Testing and Measurement Techniques Applied to Electronic Packaging Development

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Application of the Thermal Network Method to the Transient Thermal Analysis of Multichip Modules

Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

Stress Analysis of High Density Bare Chip Packaging Technologies

Low Cost Plastic Packaging of the Network Interface Unit

Design Considerations in Avionics Electronic Packaging

Packaging and Instrumentation of a Commercial Pressure Sensor for a High-G Impact and the Martian Environment

Ceramic Tape-Based Meso Systems Technology

Structural Analysis of a Sensor Module for the “Smart” Bearing

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Die Stress Measurements Using High Temperature Die-Attachment Materials

Flow Modeling and Validation of the Encapsulation of Plastic Packages

Automatic Warpage Measurement of Advanced Packages by Optical Method

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