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Proceedings Papers

An Investigation of Crack/Microstructure Interaction in a Layered Intermetallic Composite

Rong Wang, Fan Ye, Noriko Katsube, Wole Soboyejo

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 241-249, November 16–21, 1997

Paper No: IMECE1997-0670

DOI: https://doi.org/10.1115/IMECE1997-0670

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Topics: Composite materials, Fracture (Materials), Intermetallic compounds, Damage, Finite element model, Micromechanics (Engineering)

Proceedings Papers

Simulation of Self-Propagating High-Temperature Synthesis Using Finite Element Method

Vinodh Swaminathan, Micheal J. Koczak, Surya R. Kalidindi

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 65-72, November 16–21, 1997

Paper No: IMECE1997-0652

DOI: https://doi.org/10.1115/IMECE1997-0652

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Topics: Finite element methods, High temperature, Simulation, Finite element analysis, Heat, Ceramics, Composite materials, Energy efficiency, Heat losses, Intermetallic compounds

Proceedings Papers

Laser Metal Deposition of Functionally Graded Ti-6Al-4V + Mo Samples and Characterization Studies

Subha Kumpaty, Brietta Coen, Liam Coen, Monnamme Tlotleng, Nana Arthur, Sisa Pityana

Proc. ASME. IMECE2021, Volume 2B: Advanced Manufacturing, V02BT02A030, November 1–5, 2021

Paper No: IMECE2021-68190

DOI: https://doi.org/10.1115/IMECE2021-68190

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Topics: Lasers, Metals, Biomedicine, Aerospace industry, Alloys, Biocompatibility, Bonding, Cracking (Materials), Fracture (Process), Functionally graded materials

Proceedings Papers

Mechanical Strength Modeling of Particle Strengthened Nickel-Aluminum Alloys Strengthened by Intermetallic γ′ (Ni 3 Al) Precipitates

James M. Fragomeni

Proc. ASME. IMECE99, Recent Advances in Solids and Structures, 179-194, November 14–19, 1999

Paper No: IMECE1999-0629

DOI: https://doi.org/10.1115/IMECE1999-0629

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Topics: Alloys, Aluminum, Intermetallic compounds, Modeling, Nickel, Particulate matter, Strength (Materials), Dislocations, Deformation, Hardening

Proceedings Papers

Failure Mechanisms and Modeling in High Power Optical Device Packaging: Semiconductor Laser Diodes — A Case Study

Ajit R. Dhamdhere, W. F. Schmidt, Ajay P. Malshe, W. D. Brown, S. N. Yedave

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 193-200, November 11–16, 2001

Paper No: IMECE2001/EPP-24724

DOI: https://doi.org/10.1115/IMECE2001/EPP-24724

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Topics: Failure mechanisms, Lasers, Modeling, Optical instruments, Packaging, Power semiconductor devices, Reliability, Semiconductor lasers, Solders, Stress

Proceedings Papers

Creep Behavior of PB-Free Solders

F. Hua, C. M. Garner, H. G. Song, J. W. Morris

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 219-229, November 11–16, 2001

Paper No: IMECE2001/EPP-24728

DOI: https://doi.org/10.1115/IMECE2001/EPP-24728

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Topics: Creep, Lead-free solders, Tin, Cooling, Solder joints, Stress, Diffusion (Physics), Solders, Furnaces, Intermetallic compounds

Proceedings Papers

Effect of Moisture on Durability of Flip-Chip-on-Board (FCOB) Interconnects

J. H. Okura, A. Dasgupta, J. F. J. M. Caers

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 145-151, November 5–10, 2000

Paper No: IMECE2000-2256

DOI: https://doi.org/10.1115/IMECE2000-2256

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Topics: Durability, Failure mechanisms, Absorption, Cracking (Materials), Diffusion (Physics), Engineering simulation, Finite element analysis, Fracture (Process), Intermetallic compounds, Life testing

Proceedings Papers

The Effect of Aging on the Microstructure and Precipitation Response of an Aluminum-Lithium Alloy

James M. Fragomeni

Proc. ASME. IMECE2000, Recent Advances in Solids and Structures, 105-113, November 5–10, 2000

Paper No: IMECE2000-1260

DOI: https://doi.org/10.1115/IMECE2000-1260

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Topics: Alloys, Aluminum, Intermetallic compounds, Lithium, Particulate matter, Precipitation, Precipitation hardening, Zirconium, Particle size, Heat

Proceedings Papers

Influence of Brazing on the Heat Transfer Performance of Fins in Radiators

Bengt Sundén, Andreas Abdon, Daniel Eriksson

Proc. ASME. IMECE2000, Advances in Enhanced Heat Transfer, 35-39, November 5–10, 2000

Paper No: IMECE2000-1276

DOI: https://doi.org/10.1115/IMECE2000-1276

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Topics: Brazing, Fins, Heat transfer, Brass (Metal), Convection, Copper, Heat conduction, Intermetallic compounds, Numerical analysis, Temperature distribution

Proceedings Papers

Pore Growth in Foamed Intermetallics for Structural Implants

Olusegun J. Ilegbusi, Matthew W. Ballas

Proc. ASME. IMECE2000, Processing and Design of Multicomponent Materials, 37-47, November 5–10, 2000

Paper No: IMECE2000-2642

DOI: https://doi.org/10.1115/IMECE2000-2642

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Topics: Intermetallic compounds, Alloys, Bubbles, Rheology

Proceedings Papers

Challenges and Opportunities for Prime Reliant Thermal Barrier Coating Systems

Anthony G. Evans

Proc. ASME. IMECE2000, Materials: Book of Abstracts, 67, November 5–10, 2000

Paper No: IMECE2000-2677

DOI: https://doi.org/10.1115/IMECE2000-2677

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Topics: Thermal barrier coatings, Coatings, Durability, Failure, Oxidation, Adhesion, Buckling, Energy generation, Failure mechanisms, Fatigue

Proceedings Papers

Probabilistic Micromechanical Fatigue Model for High Temperature Materials

Robert G. Tryon

Proc. ASME. IMECE2000, Materials: Book of Abstracts, 21, November 5–10, 2000

Paper No: IMECE2000-2654

DOI: https://doi.org/10.1115/IMECE2000-2654

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Topics: Fatigue, High temperature materials, Fracture (Materials), Electromagnetic scattering, Damage, Design, Cycles, Engineers, Failure, Fatigue cracks

Proceedings Papers

A Probabilistic Approach to the Modeling of Fatigue in Gamma-Based Titanium Aluminides

J. Lou, W. Shen, W. O. Soboyejo

Proc. ASME. IMECE2000, Materials: Book of Abstracts, 9, November 5–10, 2000

Paper No: IMECE2000-2648

DOI: https://doi.org/10.1115/IMECE2000-2648

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Topics: Fatigue, Modeling, Titanium, Fatigue life, Intermetallic compounds, Titanium aluminide, Alloys, Fatigue cracks, Flow (Dynamics), Fracture mechanics

Proceedings Papers

Mechanisms Controlling the Performance and Durability of Thermal Barrier Coatings

Daniel R. Mumm, Anthony G. Evans

Proc. ASME. IMECE2000, Materials: Book of Abstracts, 81, November 5–10, 2000

Paper No: IMECE2000-2684

DOI: https://doi.org/10.1115/IMECE2000-2684

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Topics: Durability, Thermal barrier coatings, Fracture (Materials), Coating processes, Coatings, Failure, Adhesion, Aluminum, Buckling, Ceramic coatings

Proceedings Papers

Effect of Process Parameters on Friction Stir Lap Welded 304 Stainless Steel and 5052 Aluminium Alloys

Veerendra Chitturi, Srinivasa Rao Pedapati, Mokhtar Awang

Proc. ASME. IMECE2020, Volume 2A: Advanced Manufacturing, V02AT02A004, November 16–19, 2020

Paper No: IMECE2020-23807

DOI: https://doi.org/10.1115/IMECE2020-23807

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Topics: Aluminum alloys, Friction, Intermetallic compounds, Stainless steel, Welding

Proceedings Papers

Effect of Sample Preparation on Volta Potential Measurements of Plastically Deformed Mg-Al Alloys

Svitlana Fialkova, Honglin Zhang, Zhigang Xu, Jagannathan Sankar

Proc. ASME. IMECE2019, Volume 12: Advanced Materials: Design, Processing, Characterization, and Applications, V012T10A031, November 11–14, 2019

Paper No: IMECE2019-11783

DOI: https://doi.org/10.1115/IMECE2019-11783

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Topics: Alloys, Magnesium alloys, Microscopy, Probes, Magnesium (Metal), Polishing, Aluminum, Grain boundaries, Chemical etching, Corrosion

Proceedings Papers

Study on Grinding Force and Surface Roughness of Ni3Al Based Superalloy

Xiaoxiang Zhu, Wenhu Wang, Ruisong Jiang, Xiaofen Liu

Proc. ASME. IMECE2018, Volume 2: Advanced Manufacturing, V002T02A006, November 9–15, 2018

Paper No: IMECE2018-86959

DOI: https://doi.org/10.1115/IMECE2018-86959

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Topics: Grinding, Superalloys, Surface roughness, Grinding wheels, Aircraft engines, Creep, High temperature, Intermetallic compounds, Machinability, Surface quality

Proceedings Papers

Influence of the Microstructure on the Creep Behaviour of Tin-Silver-Copper Solder

Pedro E. Ribeiro, Delfim F. Soares, Maria F. Cerqueira, Senhorinha F. Teixeira, Daniel A. Barros, José C. Teixeira, Pauline Capela, Francisco Macedo

Proc. ASME. IMECE2018, Volume 12: Materials: Genetics to Structures, V012T11A023, November 9–15, 2018

Paper No: IMECE2018-87789

DOI: https://doi.org/10.1115/IMECE2018-87789

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Topics: Copper, Creep, Silver, Solders, Cooling, Temperature, Solder joints, Stress, Fatigue life, Clamps (Tools)

Proceedings Papers

Scanning Kelvin Probe Microscopy Study of Mg-Zn-Ca Alloys

Svitlana Fialkova, Zhigang Xu, Devdas Pai, Jagannathan Sankar

Proc. ASME. IMECE2017, Volume 14: Emerging Technologies; Materials: Genetics to Structures; Safety Engineering and Risk Analysis, V014T11A038, November 3–9, 2017

Paper No: IMECE2017-72285

DOI: https://doi.org/10.1115/IMECE2017-72285

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Topics: Alloys, Microscopy, Probes, Corrosion, Atomic force microscopy, Particulate matter, Chemical properties, Circuits, Fundamental forces (Physics), Grain boundaries

Proceedings Papers

Study on Bonding and Shear Flow Phenomena of Shear Probe Test for BGA Solder Joint in Nano-Scale Analysis

Bao-Hsin Liu, Yu-Liang Chen, Quang-Cherng Hsu

Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A022, November 11–17, 2016

Paper No: IMECE2016-66773

DOI: https://doi.org/10.1115/IMECE2016-66773

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Topics: Ball-Grid-Array packaging, Bonding, Nanoscale phenomena, Probes, Shear (Mechanics), Shear flow, Solder joints, Tin, Atoms, Crystal structure

2 3 4

NARROW

An Investigation of Crack/Microstructure Interaction in a Layered Intermetallic Composite

Simulation of Self-Propagating High-Temperature Synthesis Using Finite Element Method

Laser Metal Deposition of Functionally Graded Ti-6Al-4V + Mo Samples and Characterization Studies

Mechanical Strength Modeling of Particle Strengthened Nickel-Aluminum Alloys Strengthened by Intermetallic γ′ (Ni 3 Al) Precipitates

Failure Mechanisms and Modeling in High Power Optical Device Packaging: Semiconductor Laser Diodes — A Case Study

Creep Behavior of PB-Free Solders

Effect of Moisture on Durability of Flip-Chip-on-Board (FCOB) Interconnects

The Effect of Aging on the Microstructure and Precipitation Response of an Aluminum-Lithium Alloy

Influence of Brazing on the Heat Transfer Performance of Fins in Radiators

Pore Growth in Foamed Intermetallics for Structural Implants

Challenges and Opportunities for Prime Reliant Thermal Barrier Coating Systems

Probabilistic Micromechanical Fatigue Model for High Temperature Materials

A Probabilistic Approach to the Modeling of Fatigue in Gamma-Based Titanium Aluminides

Mechanisms Controlling the Performance and Durability of Thermal Barrier Coatings

Effect of Process Parameters on Friction Stir Lap Welded 304 Stainless Steel and 5052 Aluminium Alloys

Effect of Sample Preparation on Volta Potential Measurements of Plastically Deformed Mg-Al Alloys

Study on Grinding Force and Surface Roughness of Ni3Al Based Superalloy

Influence of the Microstructure on the Creep Behaviour of Tin-Silver-Copper Solder

Scanning Kelvin Probe Microscopy Study of Mg-Zn-Ca Alloys

Study on Bonding and Shear Flow Phenomena of Shear Probe Test for BGA Solder Joint in Nano-Scale Analysis

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