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Proceedings Papers

Small Cracks and High-Cycle Fatigue

R. O. Ritchie
Proc. ASME. IMECE96, Aerospace, 321-333, November 17–22, 1996
Paper No: IMECE1996-0641
https://doi.org/10.1115/IMECE1996-0641
View Paper titled, Small Cracks and High-Cycle Fatigue
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Topics: Fracture (Materials), High cycle fatigue, Dimensions, Damage, Aircraft, Alloys, Ceramics, Design, Failure, Fatigue cracks
Proceedings Papers

Mechanical Properties of Polycrystalline Lamellar TiAl-Intermetallics

S. M. Schlögl, E. A. Werner, F. D. Fischer
Proc. ASME. IMECE96, Recent Advances in Solids/Structures and Application of Metallic Materials, 219-225, November 17–22, 1996
Paper No: IMECE1996-0160
https://doi.org/10.1115/IMECE1996-0160
View Paper titled, Mechanical Properties of Polycrystalline Lamellar TiAl-Intermetallics
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Topics: Mechanical properties, Titanium aluminide, Deformation, Crystals, Anisotropy, Ductility, Elongation, Flow (Dynamics), Fracture (Materials), Fracture (Process)
Proceedings Papers

Step Soldering Factors Affecting the Reliability of Ag-Pd Thick Film Conductor Pads

Tsung-Yu Pan, Howard D. Blair, David Mitlin, Gary M. Crosbie, John M. Nicholson, Jon Hangas
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 115-124, November 17–22, 1996
Paper No: IMECE1996-0898
https://doi.org/10.1115/IMECE1996-0898
View Paper titled, Step Soldering Factors Affecting the Reliability of Ag-Pd Thick Film Conductor Pads
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Topics: Reliability, Soldering, Thick films, Solders, Tin, Displacement, Adhesives, Circuits, Diffusion (Physics), Failure
Proceedings Papers

An Investigation of Crack/Microstructure Interaction in a Layered Intermetallic Composite

Rong Wang, Fan Ye, Noriko Katsube, Wole Soboyejo
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 241-249, November 16–21, 1997
Paper No: IMECE1997-0670
https://doi.org/10.1115/IMECE1997-0670
View Paper titled, An Investigation of Crack/Microstructure Interaction in a Layered Intermetallic Composite
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Topics: Composite materials, Fracture (Materials), Intermetallic compounds, Damage, Finite element model, Micromechanics (Engineering)
Proceedings Papers

Simulation of Self-Propagating High-Temperature Synthesis Using Finite Element Method

Vinodh Swaminathan, Micheal J. Koczak, Surya R. Kalidindi
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 65-72, November 16–21, 1997
Paper No: IMECE1997-0652
https://doi.org/10.1115/IMECE1997-0652
View Paper titled, Simulation of Self-Propagating High-Temperature Synthesis Using Finite Element Method
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Topics: Finite element methods, High temperature, Simulation, Finite element analysis, Heat, Ceramics, Composite materials, Energy efficiency, Heat losses, Intermetallic compounds
Proceedings Papers

Laser Metal Deposition of Functionally Graded Ti-6Al-4V + Mo Samples and Characterization Studies

Subha Kumpaty, Brietta Coen, Liam Coen, Monnamme Tlotleng, Nana Arthur, Sisa Pityana
Proc. ASME. IMECE2021, Volume 2B: Advanced Manufacturing, V02BT02A030, November 1–5, 2021
Paper No: IMECE2021-68190
https://doi.org/10.1115/IMECE2021-68190
View Paper titled, Laser Metal Deposition of Functionally Graded Ti-6Al-4V + Mo Samples and Characterization Studies
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Topics: Lasers, Metals, Biomedicine, Aerospace industry, Alloys, Biocompatibility, Bonding, Cracking (Materials), Fracture (Process), Functionally graded materials
Proceedings Papers

Mechanical Strength Modeling of Particle Strengthened Nickel-Aluminum Alloys Strengthened by Intermetallic γ′ (Ni 3 Al) Precipitates

James M. Fragomeni
Proc. ASME. IMECE99, Recent Advances in Solids and Structures, 179-194, November 14–19, 1999
Paper No: IMECE1999-0629
https://doi.org/10.1115/IMECE1999-0629
View Paper titled, Mechanical Strength Modeling of Particle Strengthened Nickel-Aluminum Alloys Strengthened by Intermetallic γ′ (Ni 3 Al) Precipitates
Open the PDF for Mechanical Strength Modeling of Particle Strengthened Nickel-Aluminum Alloys Strengthened by Intermetallic γ′ (Ni 3 Al) Precipitates in another window
Topics: Alloys, Aluminum, Intermetallic compounds, Modeling, Nickel, Particulate matter, Strength (Materials), Dislocations, Deformation, Hardening
Proceedings Papers

Failure Mechanisms and Modeling in High Power Optical Device Packaging: Semiconductor Laser Diodes — A Case Study

Ajit R. Dhamdhere, W. F. Schmidt, Ajay P. Malshe, W. D. Brown, S. N. Yedave
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 193-200, November 11–16, 2001
Paper No: IMECE2001/EPP-24724
https://doi.org/10.1115/IMECE2001/EPP-24724
View Paper titled, Failure Mechanisms and Modeling in High Power Optical Device Packaging: Semiconductor Laser Diodes — A Case Study
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Topics: Failure mechanisms, Lasers, Modeling, Optical instruments, Packaging, Power semiconductor devices, Reliability, Semiconductor lasers, Solders, Stress
Proceedings Papers

Creep Behavior of PB-Free Solders

F. Hua, C. M. Garner, H. G. Song, J. W. Morris
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 219-229, November 11–16, 2001
Paper No: IMECE2001/EPP-24728
https://doi.org/10.1115/IMECE2001/EPP-24728
View Paper titled, Creep Behavior of PB-Free Solders
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Topics: Creep, Lead-free solders, Tin, Cooling, Solder joints, Stress, Diffusion (Physics), Solders, Furnaces, Intermetallic compounds
Proceedings Papers

A Probabilistic Approach to the Modeling of Fatigue in Gamma-Based Titanium Aluminides

J. Lou, W. Shen, W. O. Soboyejo
Proc. ASME. IMECE2000, Materials: Book of Abstracts, 9, November 5–10, 2000
Paper No: IMECE2000-2648
https://doi.org/10.1115/IMECE2000-2648
View Paper titled, A Probabilistic Approach to the Modeling of Fatigue in Gamma-Based Titanium Aluminides
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Topics: Fatigue, Modeling, Titanium, Fatigue life, Intermetallic compounds, Titanium aluminide, Alloys, Fatigue cracks, Flow (Dynamics), Fracture mechanics
Proceedings Papers

Mechanisms Controlling the Performance and Durability of Thermal Barrier Coatings

Daniel R. Mumm, Anthony G. Evans
Proc. ASME. IMECE2000, Materials: Book of Abstracts, 81, November 5–10, 2000
Paper No: IMECE2000-2684
https://doi.org/10.1115/IMECE2000-2684
View Paper titled, Mechanisms Controlling the Performance and Durability of Thermal Barrier Coatings
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Topics: Durability, Thermal barrier coatings, Fracture (Materials), Coating processes, Coatings, Failure, Adhesion, Aluminum, Buckling, Ceramic coatings
Proceedings Papers

Effect of Moisture on Durability of Flip-Chip-on-Board (FCOB) Interconnects

J. H. Okura, A. Dasgupta, J. F. J. M. Caers
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 145-151, November 5–10, 2000
Paper No: IMECE2000-2256
https://doi.org/10.1115/IMECE2000-2256
View Paper titled, Effect of Moisture on Durability of Flip-Chip-on-Board (FCOB) Interconnects
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Topics: Durability, Failure mechanisms, Absorption, Cracking (Materials), Diffusion (Physics), Engineering simulation, Finite element analysis, Fracture (Process), Intermetallic compounds, Life testing
Proceedings Papers

Pore Growth in Foamed Intermetallics for Structural Implants

Olusegun J. Ilegbusi, Matthew W. Ballas
Proc. ASME. IMECE2000, Processing and Design of Multicomponent Materials, 37-47, November 5–10, 2000
Paper No: IMECE2000-2642
https://doi.org/10.1115/IMECE2000-2642
View Paper titled, Pore Growth in Foamed Intermetallics for Structural Implants
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Topics: Intermetallic compounds, Alloys, Bubbles, Rheology
Proceedings Papers

Challenges and Opportunities for Prime Reliant Thermal Barrier Coating Systems

Anthony G. Evans
Proc. ASME. IMECE2000, Materials: Book of Abstracts, 67, November 5–10, 2000
Paper No: IMECE2000-2677
https://doi.org/10.1115/IMECE2000-2677
View Paper titled, Challenges and Opportunities for Prime Reliant Thermal Barrier Coating Systems
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Topics: Thermal barrier coatings, Coatings, Durability, Failure, Oxidation, Adhesion, Buckling, Energy generation, Failure mechanisms, Fatigue
Proceedings Papers

Probabilistic Micromechanical Fatigue Model for High Temperature Materials

Robert G. Tryon
Proc. ASME. IMECE2000, Materials: Book of Abstracts, 21, November 5–10, 2000
Paper No: IMECE2000-2654
https://doi.org/10.1115/IMECE2000-2654
View Paper titled, Probabilistic Micromechanical Fatigue Model for High Temperature Materials
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Topics: Fatigue, High temperature materials, Fracture (Materials), Electromagnetic scattering, Damage, Design, Cycles, Engineers, Failure, Fatigue cracks
Proceedings Papers

The Effect of Aging on the Microstructure and Precipitation Response of an Aluminum-Lithium Alloy

James M. Fragomeni
Proc. ASME. IMECE2000, Recent Advances in Solids and Structures, 105-113, November 5–10, 2000
Paper No: IMECE2000-1260
https://doi.org/10.1115/IMECE2000-1260
View Paper titled, The Effect of Aging on the Microstructure and Precipitation Response of an Aluminum-Lithium Alloy
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Topics: Alloys, Aluminum, Intermetallic compounds, Lithium, Particulate matter, Precipitation, Precipitation hardening, Zirconium, Particle size, Heat
Proceedings Papers

Influence of Brazing on the Heat Transfer Performance of Fins in Radiators

Bengt Sundén, Andreas Abdon, Daniel Eriksson
Proc. ASME. IMECE2000, Advances in Enhanced Heat Transfer, 35-39, November 5–10, 2000
Paper No: IMECE2000-1276
https://doi.org/10.1115/IMECE2000-1276
View Paper titled, Influence of Brazing on the Heat Transfer Performance of Fins in Radiators
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Topics: Brazing, Fins, Heat transfer, Brass (Metal), Convection, Copper, Heat conduction, Intermetallic compounds, Numerical analysis, Temperature distribution
Proceedings Papers

Effect of Process Parameters on Friction Stir Lap Welded 304 Stainless Steel and 5052 Aluminium Alloys

Veerendra Chitturi, Srinivasa Rao Pedapati, Mokhtar Awang
Proc. ASME. IMECE2020, Volume 2A: Advanced Manufacturing, V02AT02A004, November 16–19, 2020
Paper No: IMECE2020-23807
https://doi.org/10.1115/IMECE2020-23807
View Paper titled, Effect of Process Parameters on Friction Stir Lap Welded 304 Stainless Steel and 5052 Aluminium Alloys
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Topics: Aluminum alloys, Friction, Intermetallic compounds, Stainless steel, Welding
Proceedings Papers

Effect of Sample Preparation on Volta Potential Measurements of Plastically Deformed Mg-Al Alloys

Svitlana Fialkova, Honglin Zhang, Zhigang Xu, Jagannathan Sankar
Proc. ASME. IMECE2019, Volume 12: Advanced Materials: Design, Processing, Characterization, and Applications, V012T10A031, November 11–14, 2019
Paper No: IMECE2019-11783
https://doi.org/10.1115/IMECE2019-11783
View Paper titled, Effect of Sample Preparation on Volta Potential Measurements of Plastically Deformed Mg-Al Alloys
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Topics: Alloys, Magnesium alloys, Microscopy, Probes, Magnesium (Metal), Polishing, Aluminum, Grain boundaries, Chemical etching, Corrosion
Proceedings Papers

Influence of the Microstructure on the Creep Behaviour of Tin-Silver-Copper Solder

Pedro E. Ribeiro, Delfim F. Soares, Maria F. Cerqueira, Senhorinha F. Teixeira, Daniel A. Barros, José C. Teixeira, Pauline Capela, Francisco Macedo
Proc. ASME. IMECE2018, Volume 12: Materials: Genetics to Structures, V012T11A023, November 9–15, 2018
Paper No: IMECE2018-87789
https://doi.org/10.1115/IMECE2018-87789
View Paper titled, Influence of the Microstructure on the Creep Behaviour of Tin-Silver-Copper Solder
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Topics: Copper, Creep, Silver, Solders, Cooling, Temperature, Solder joints, Stress, Fatigue life, Clamps (Tools)