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Proceedings Papers

A Fracture Toughness Test of Bone-Biomaterial Interfaces Under Mixed Mode Loading Conditions

X. D. Wang, C. M. Agrawal

Proc. ASME. IMECE97, Advances in Bioengineering, 323-324, November 16–21, 1997

Paper No: IMECE1997-0359

DOI: https://doi.org/10.1115/IMECE1997-0359

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Topics: Biomaterials, Bone, Fracture toughness, Orthopedics, Artificial limbs, Bonding, Cements (Adhesives), Dental materials, Fracture mechanics, Numerical analysis

Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

William T. Chen, David Questad, David Read, Bahgat Sammakia

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997

Paper No: IMECE1997-0515

DOI: https://doi.org/10.1115/IMECE1997-0515

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Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing

Proceedings Papers

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

Xiang Dai, Mark V. Brillhart, Paul S. Ho

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 115-124, November 16–21, 1997

Paper No: IMECE1997-0506

DOI: https://doi.org/10.1115/IMECE1997-0506

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Topics: Adhesion, Flip-chip packages, Delamination, Failure, Flip-chip, Flip-chip assemblies, Fracture mechanics, Junctions, Manufacturing, Polymers

Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997

Paper No: IMECE1997-0508

DOI: https://doi.org/10.1115/IMECE1997-0508

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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination

Proceedings Papers

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

J. M. Snodgrass, S.-Y. Kook, A. Kirtikar, R. H. Dauskardt

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 33-39, November 16–21, 1997

Paper No: IMECE1997-0497

DOI: https://doi.org/10.1115/IMECE1997-0497

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Topics: Adhesion, Polymers, Reliability, Fracture (Materials), Fracture (Process), Fatigue, Fracture toughness, Cycles, Deformation, Fracture mechanics

Proceedings Papers

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

E. Madenci, S. Shkarayev, R. Mahajan

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 61-71, November 16–21, 1997

Paper No: IMECE1997-0501

DOI: https://doi.org/10.1115/IMECE1997-0501

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Topics: Failure, Flip-chip packages, Stress, Design, Electronic packages, Thermomechanics, Adhesive joints, Cracking (Materials), Fillers (Materials), Finite element analysis

Proceedings Papers

Sustained-Load Cracking in Mill Annealed Ti-6Al-4V at Room Temperature

Youri Lenets, James P. Thomas, Theodore Nicholas

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 315-321, November 16–21, 1997

Paper No: IMECE1997-0547

DOI: https://doi.org/10.1115/IMECE1997-0547

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Topics: Cracking (Materials), Fracture (Process), Stress, Temperature, Fracture (Materials), Diffusion processes, Fatigue, Forging, Fracture mechanics, Hydrogen

Proceedings Papers

Stub-Sill Tank Car Damage Tolerance Analysis Full-Scale Validation Test

Keith B. Smith, Joseph W. Cardinal, Peter C. McKeighan

Proc. ASME. IMECE97, Rail Transportation, 43-48, November 16–21, 1997

Paper No: IMECE1997-0592

DOI: https://doi.org/10.1115/IMECE1997-0592

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Topics: Damage, Railway tank cars, Tolerance analysis, Fatigue, Fracture mechanics, Inspection

Proceedings Papers

High Strain Rate Normal Indentation of Ceramics: Implications for Material Removal Mechanisms

Ghatu Subhash, Brian J. Koeppel, Richard J. Anton, Yonggang Y. Huang, Abhijit Chandra

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 417-424, November 16–21, 1997

Paper No: IMECE1997-0695

DOI: https://doi.org/10.1115/IMECE1997-0695

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Topics: Ceramics, Dynamic testing (Materials), Cracking (Materials), Failure, Fracture (Process), Fracture mechanics, Grinding, Stress

Proceedings Papers

Process Modeling and Interfacial Behavior in the VSPA Package

Richard Harries, Suresh Sitaraman

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 293-299, November 16–21, 1997

Paper No: IMECE1997-0676

DOI: https://doi.org/10.1115/IMECE1997-0676

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Topics: Delamination, Electronic packages, Failure mechanisms, Finite element model, Fracture (Materials), Fracture mechanics, Geometry, Manufacturing, Materials properties, Modeling

Proceedings Papers

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

Y. Feng, V. R. Raju, E. Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 89-139, November 16–21, 1997

Paper No: IMECE1997-0817

DOI: https://doi.org/10.1115/IMECE1997-0817

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Topics: Failure, Adhesion, Fracture mechanics, Manufacturing, Mechanical behavior, Microelectronic devices, Modeling, Molding, Reliability, Surfaces (Materials)

Proceedings Papers

Design and Strength Evaluation of an Anodically Bonded Pressurized Cavity Array for Wafer-Level MEMS Packaging

Jeung Sang Go, Young-Ho Cho

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 357-360, November 15–20, 1998

Paper No: IMECE1998-1268

DOI: https://doi.org/10.1115/IMECE1998-1268

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Topics: Cavities, Design, MEMS packaging, Semiconductor wafers, Bonding, Plates (structures), Pressure, Design methodology, Failure, Finite element analysis

Proceedings Papers

Crack Linkup at Multiple Site Damage

L. Ma, A. S. Kobayashi, S. N. Atluri, P. W. Tan

Proc. ASME. IMECE98, Recent Advances in Mechanics of Aerospace Structures and Materials, 1-2, November 15–20, 1998

Paper No: IMECE1998-0354

DOI: https://doi.org/10.1115/IMECE1998-0354

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Topics: Damage, Fracture (Materials), Stress, Collapse, Displacement, Aircraft, Aluminum, Design, Fasteners, Fatigue

Proceedings Papers

A Generalized Self-Consistent Method for Osteonal Cortical Bone Modeling

X. Edward Guo, X. Neil Dong, Y. Young Huang

Proc. ASME. IMECE98, Advances in Bioengineering, 271-272, November 15–20, 1998

Paper No: IMECE1998-0135

DOI: https://doi.org/10.1115/IMECE1998-0135

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Topics: Bone, Modeling, Composite materials, Fibers, Damage mechanics, Mechanical properties, Microcracks, Bone mechanics, Elasticity, Fracture mechanics

Proceedings Papers

Crack Propagating in a Bimaterial Functionally Graded Multilayered Composite Media

Sandeep Muju

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 231-232, November 15–20, 1998

Paper No: IMECE1998-1184

DOI: https://doi.org/10.1115/IMECE1998-1184

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Topics: Composite materials, Fracture (Materials), Stress, Anisotropy, Flamelet generated manifold, Functionally graded materials, Materials properties, Approximation, Eigenfunctions, Eigenvalues

Proceedings Papers

Mechanistically-Based Fracture Mechanics Models for the Prediction of Multiple Semi-Elliptical Crack Growth in Q1N (HY80) Pressure Vessel Steel Under Fatigue Loading

W. O. Soboyejo, J. F. Knott

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 67-77, November 15–20, 1998

Paper No: IMECE1998-1141

DOI: https://doi.org/10.1115/IMECE1998-1141

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Topics: Fatigue, Fracture (Materials), Fracture mechanics, Pressure vessels, Steel, Fatigue cracks, Fatigue life

Proceedings Papers

Failure Prediction of Bonded Joints of Composite Engineering Structures

Alexander E. Bogdanovich, Sergei P. Yushanov

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 267-268, November 15–20, 1998

Paper No: IMECE1998-1199

DOI: https://doi.org/10.1115/IMECE1998-1199

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Topics: Composite materials, Failure, Structures, Adhesives, Fracture (Materials), Bricks, Displacement, Crack propagation, Failure mechanisms, Temperature

Proceedings Papers

Fatigue and Fracture Testing of Microelectromechanical Systems

Roberto Ballarini, Robert L. Mullen, Harold Kahn, Arthur H. Heuer

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 151-152, November 15–20, 1998

Paper No: IMECE1998-1152

DOI: https://doi.org/10.1115/IMECE1998-1152

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Topics: Fatigue, Fracture (Materials), Fracture (Process), Microelectromechanical systems, Testing, Bending strength, Crack propagation, Design, Dimensions, Electrostatic actuators

Proceedings Papers

Potential Effects of Micromechanical Stresses on the Failure Initiation in Composite Laminates

N. J. Pagano, F. G. Yuan

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 163-164, November 15–20, 1998

Paper No: IMECE1998-1156

DOI: https://doi.org/10.1115/IMECE1998-1156

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Topics: Composite materials, Failure, Laminates, Stress, Fibers, Failure mechanisms, Boundary-value problems, Delamination, Elasticity, Modeling

Proceedings Papers

Cracking of Plates With Randomly Distributed Holes by a Maximum Entropy Method

M. Ostoja-Starzewski, Ahmed Al-Ostaz, I. Jasiuk

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 287-288, November 15–20, 1998

Paper No: IMECE1998-1208

DOI: https://doi.org/10.1115/IMECE1998-1208

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Topics: Entropy, Fracture (Process), Plates (structures), Fracture (Materials), Aluminum, Brittleness, Damage, Electromagnetic scattering, Epoxy adhesives, Epoxy resins

2 3 4 5

NARROW

A Fracture Toughness Test of Bone-Biomaterial Interfaces Under Mixed Mode Loading Conditions

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

Sustained-Load Cracking in Mill Annealed Ti-6Al-4V at Room Temperature

Stub-Sill Tank Car Damage Tolerance Analysis Full-Scale Validation Test

High Strain Rate Normal Indentation of Ceramics: Implications for Material Removal Mechanisms

Process Modeling and Interfacial Behavior in the VSPA Package

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

Design and Strength Evaluation of an Anodically Bonded Pressurized Cavity Array for Wafer-Level MEMS Packaging

Crack Linkup at Multiple Site Damage

A Generalized Self-Consistent Method for Osteonal Cortical Bone Modeling

Crack Propagating in a Bimaterial Functionally Graded Multilayered Composite Media

Mechanistically-Based Fracture Mechanics Models for the Prediction of Multiple Semi-Elliptical Crack Growth in Q1N (HY80) Pressure Vessel Steel Under Fatigue Loading

Failure Prediction of Bonded Joints of Composite Engineering Structures

Fatigue and Fracture Testing of Microelectromechanical Systems

Potential Effects of Micromechanical Stresses on the Failure Initiation in Composite Laminates

Cracking of Plates With Randomly Distributed Holes by a Maximum Entropy Method

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