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Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

William T. Chen, David Questad, David Read, Bahgat Sammakia

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997

Paper No: IMECE1997-0515

DOI: https://doi.org/10.1115/IMECE1997-0515

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Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing

Proceedings Papers

A Cost Model of New Electronic Products for Use During the Design and Development Phases

Sammy G. Shina, Anil Saigal

Proc. ASME. IMECE97, Concurrent Product Design and Environmentally Conscious Manufacturing, 67-78, November 16–21, 1997

Paper No: IMECE1997-0008

DOI: https://doi.org/10.1115/IMECE1997-0008

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Topics: Design, Electronic products, Manufacturing, Simulation, Tradeoffs

Proceedings Papers

Industrial Design to Rapid Mold Making for Accelerated Time-to-Market of Consumer Electronic Products

Fu-Chung Wang, Juan Plancarte, Paul K. Wright, Vito Fabbrizio, Alan Kramer

Proc. ASME. IMECE99, Manufacturing Science and Engineering, 107-113, November 14–19, 1999

Paper No: IMECE1999-0661

DOI: https://doi.org/10.1115/IMECE1999-0661

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Topics: Aluminum, Computer-aided design, Cycles, Design, Electronic products, Electronics, Engineering prototypes, Fingerprints, Industrial design, Manufacturing

Proceedings Papers

Compliant Wafer Level Package

Chirag Patel, Kevin P. Martin, James D. Meindl

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 53-61, November 11–16, 2001

Paper No: IMECE2001/EPP-24706

DOI: https://doi.org/10.1115/IMECE2001/EPP-24706

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Topics: Semiconductor wafers, Manufacturing, Density, Electronic products, Integrated circuits, Packaging, Semiconductors (Materials)

Proceedings Papers

Design of a Power Waveform Capture Platform for Plug Load Monitoring

Joseph Hoffbeck, Heather Dillon, Stephen Hildebrand

Proc. ASME. IMECE2016, Volume 6A: Energy, V06AT08A046, November 11–17, 2016

Paper No: IMECE2016-65984

DOI: https://doi.org/10.1115/IMECE2016-65984

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Topics: Design, Stress, Hardware, Computer software, Computers, Control systems, Electrical measurement, Electronic products, Electronic systems, Storage

Proceedings Papers

Improvement of Thermal Conductivity of Electroplated Copper Thin-Film Interconnections by Controlling Their Micro Texture

Pornvitoo Rittinon, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A053, November 14–20, 2014

Paper No: IMECE2014-36863

DOI: https://doi.org/10.1115/IMECE2014-36863

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Topics: Copper, Texture (Materials), Thermal conductivity, Thin films, Grain boundaries, Heat conduction, Brittle fracture, Electrical resistance, Electrical resistivity, Electron backscatter diffraction

Proceedings Papers

Cohesive Fracture Mechanics Based Finite Element Analysis to the Performance of Lead Free Solders in BGA Packaging Under Drop Impact

Yao Yao

Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 757-765, November 9–15, 2012

Paper No: IMECE2012-88629

DOI: https://doi.org/10.1115/IMECE2012-88629

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Topics: Ball-Grid-Array packaging, Finite element analysis, Fracture mechanics, Lead-free solders, Solders, Alloys, Packaging, Electronic packaging, Failure, Fracture (Materials)

Proceedings Papers

Low Cost, Open-Loop Temperature Controller for MEMS and Modular Microfluidics Applications

Brooks B. Lowrey, Christopher R. Brown, Daniel S. Park, Michael C. Murphy

Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 335-336, November 11–17, 2011

Paper No: IMECE2011-65543

DOI: https://doi.org/10.1115/IMECE2011-65543

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Topics: Microelectromechanical systems, Microfluidics, Temperature controls, Temperature, Control equipment, Thermal reactors, Aluminum, Boundary-value problems, Calibration, Chain

Proceedings Papers

Thermal and Structural Response of Pin Fins for Different Interface Conditions

Abul Fazal M. Arif, Sulaman Pashah, Syed M. Zubair, M. Inam

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 375-384, November 12–18, 2010

Paper No: IMECE2010-39972

DOI: https://doi.org/10.1115/IMECE2010-39972

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Topics: Adhesives, Design, Electronic products, Energy dissipation, Finite element methods, Finite element model, Fins, Heat, Heat sinks, Heat transfer

Proceedings Papers

Failure-Mode Clustering for Electronics Under Shock and Vibration Using Neural-Net Based Self-Organized Maps

Pradeep Lall, Prashant Gupta

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 517-531, November 12–18, 2010

Paper No: IMECE2010-40666

DOI: https://doi.org/10.1115/IMECE2010-40666

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Topics: Artificial neural networks, Electronics, Failure mechanisms, Shock (Mechanics), Vibration, Failure, Damage, Electronic systems, Fracture (Process), Solders

Proceedings Papers

Coupled Thermal and Structural Parametric Analysis of TSVs in 3D Electronics

Fahad Mirza, Bharathkrishnan Muralidharan, Poornima Mynampati, Saket Karajgikar, Dereje Agonafer

Proc. ASME. IMECE2010, Volume 10: Micro and Nano Systems, 675-680, November 12–18, 2010

Paper No: IMECE2010-40803

DOI: https://doi.org/10.1115/IMECE2010-40803

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Topics: Electronics, Energy dissipation, Heat, Silicon, Delays, Density, Electronic products, Failure, Insulation, Integrated circuits

Proceedings Papers

Investigation of Board-Level and Package-Level Drop Reliability of RF MEMS Packages

Li Sun, Dana DeReus, Shawn Cunningham, Arthur Morris

Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 225-230, November 13–19, 2009

Paper No: IMECE2009-11741

DOI: https://doi.org/10.1115/IMECE2009-11741

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Topics: MEMS packages, Reliability, Stress, Modeling, Metals, Microelectromechanical systems, Solders, Transients (Dynamics), Electronic products, Excitation

Proceedings Papers

Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems

Farbod Askari Farahani, Moustafa Al-Bassyiouni, Abhigit Dasgupta, Sheldon Tolchinsky

Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 137-143, October 31–November 6, 2008

Paper No: IMECE2008-67749

DOI: https://doi.org/10.1115/IMECE2008-67749

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Topics: Electronic systems, Modeling, Shock (Mechanics), Simulation, Design, Failure mechanisms, Transients (Dynamics), Circuits, Cycles, Dynamic testing (Materials)

Proceedings Papers

Synthesis of CFD Analyses and Experiments in Developing a Thermal Network Model of a Simulated Heat Spreader Panel

Masaru Ishizuka, Shinji Nakagawa, Tatsuro Yoshida, Wataru Nakayama

Proc. ASME. IMECE2008, Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C, 1471-1478, October 31–November 6, 2008

Paper No: IMECE2008-66091

DOI: https://doi.org/10.1115/IMECE2008-66091

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Topics: Computational fluid dynamics, Flat heat pipes, Network models, Heat, Temperature, Uncertainty, Computation, Corners (Structural elements), Design, Electronic products

Proceedings Papers

Use Direct Cyclic and Sub-Modeling Approach to Analyze Solder Joint Fatigue Reliability

Tieyu Zheng, Zhen-Zhong Du

Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 333-338, November 11–15, 2007

Paper No: IMECE2007-42366

DOI: https://doi.org/10.1115/IMECE2007-42366

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Topics: Fatigue, Modeling, Reliability, Solder joints, Ball-Grid-Array packaging, Crack propagation, Electronic products, Fatigue life, Low cycle fatigue, Packaging

Proceedings Papers

Flip Chip Process Development and Relaibility Evaluation With Lead-Free Solder Alloy

Mohammad Yunus, Muthiah Venkateswaran, Peter Borgesen

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 117-123, November 17–22, 2002

Paper No: IMECE2002-39253

DOI: https://doi.org/10.1115/IMECE2002-39253

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Topics: Alloys, Flip-chip, Flip-chip devices, Lead-free solders, Tin, Solders, Alpha particles, Ceramics, Copper alloys, Electronic products

Proceedings Papers

Drop-Impact Reliability of Chip-Scale Packages in Handheld Products

Guoyun Tian, Yueli Liu, Pradeep Lall, R. Wayne Johnson, Sanan Abderrahman, Mike Palmer, Nokib Islam, Dhananjay Panchgade, Jeffrey Suhling, Larry Crane

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 135-143, November 15–21, 2003

Paper No: IMECE2003-42075

DOI: https://doi.org/10.1115/IMECE2003-42075

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Topics: Reliability, Corners (Structural elements), Bonding, Flow (Dynamics), Manufacturing, Cycles, Electronic products, Finite element analysis, Modeling, Shock (Mechanics)

Proceedings Papers

Three Dimensional Packaging of Bare IC Into Printed Circuit Boards for SIP

Erik Jung, Dirk Wojakowski, Alexander Neumann, Rolf Aschenbrenner, Herbert Reichl

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 153-157, November 15–21, 2003

Paper No: IMECE2003-41116

DOI: https://doi.org/10.1115/IMECE2003-41116

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Topics: Electronic products, Engineering simulation, Finite element methods, Finite element model, Laminates, Manufacturing, Packaging, Printed circuit boards, Silicon, Simulation

Proceedings Papers

Highlights From the European Thermal Project PROFIT

Clemens J. M. Lasance

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 559-564, November 15–21, 2003

Paper No: IMECE2003-42173

DOI: https://doi.org/10.1115/IMECE2003-42173

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Topics: Electronic products, Modeling, Reliability, Safety, Temperature gradient, Thermal characterization

Proceedings Papers

Test Methodology for Impact Testing of Portable Electronic Products

J. Varghese, A. Dasgupta

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 71-77, November 15–21, 2003

Paper No: IMECE2003-41844

DOI: https://doi.org/10.1115/IMECE2003-41844

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Topics: Damage, Electronic products, Impact testing, Testing

NARROW

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

A Cost Model of New Electronic Products for Use During the Design and Development Phases

Industrial Design to Rapid Mold Making for Accelerated Time-to-Market of Consumer Electronic Products

Compliant Wafer Level Package

Design of a Power Waveform Capture Platform for Plug Load Monitoring

Improvement of Thermal Conductivity of Electroplated Copper Thin-Film Interconnections by Controlling Their Micro Texture

Cohesive Fracture Mechanics Based Finite Element Analysis to the Performance of Lead Free Solders in BGA Packaging Under Drop Impact

Low Cost, Open-Loop Temperature Controller for MEMS and Modular Microfluidics Applications

Thermal and Structural Response of Pin Fins for Different Interface Conditions

Failure-Mode Clustering for Electronics Under Shock and Vibration Using Neural-Net Based Self-Organized Maps

Coupled Thermal and Structural Parametric Analysis of TSVs in 3D Electronics

Investigation of Board-Level and Package-Level Drop Reliability of RF MEMS Packages

Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems

Synthesis of CFD Analyses and Experiments in Developing a Thermal Network Model of a Simulated Heat Spreader Panel

Use Direct Cyclic and Sub-Modeling Approach to Analyze Solder Joint Fatigue Reliability

Flip Chip Process Development and Relaibility Evaluation With Lead-Free Solder Alloy

Drop-Impact Reliability of Chip-Scale Packages in Handheld Products

Three Dimensional Packaging of Bare IC Into Printed Circuit Boards for SIP

Highlights From the European Thermal Project PROFIT

Test Methodology for Impact Testing of Portable Electronic Products

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