Technical Briefs

Structural Reliability Methods Applied to Power Switch Devices: Example of an Aeronautical IGBT Module

[+] Author and Article Information
Adrien Zéanh1

Olivier Dalverny

 Laboratoire de Génie de Production Université de Toulouse, INPT/ENIT, 47, avenue d’Azereix, Tarbes 65016, Franceolivier.dalverny@enit.fr

Arezki Bouzourene

Christophe Bruzy

 THALES Avionics Electrical Systems 41, boulevard de la république, Chatou 78401, Francechristophe.bruzy@fr.thalesgroup.com


Corresponding author.

J. Mech. Des 133(9), 094503 (Sep 09, 2011) (9 pages) doi:10.1115/1.4004585 History: Received November 24, 2010; Revised July 03, 2011; Published September 09, 2011; Online September 09, 2011

In this paper, an Insulated Gate Bipolar Transistor (IGBT) module designed for aeronautic applications is investigated using structural reliability methods coupled with Finite Elements (FE) modeling. The lifetime of the module with respect to its solder joints failure, is evaluated using its thermomechanical response, in association with a low cycle fatigue model. The simulation of an aeronautic typical Accelerated Thermal Cycling (ATC) test configuration allows checking in a first step, the relevancy of the numerical procedure by assessing the experimental lifetime of the connections, and comparing them to experimental results. Then, the structural reliability of the module is evaluated over the target aircraft predicted useful lifetime, comparing the First Order Reliability Method (FORM) and Monte-Carlo Simulation (M-CS). The appropriate temperature mission profile and flight time are therefore considered with their scatters, in addition to those of the parameters of the fatigue model. Regarding these latter parameters, a simulation based approach is proposed and applied for the determination of their probability density function (pdf). For reasonable reliability analysis time, the thermomechanical response of the module was surrogated using Kriging metamodels. The paper ends with the exploitation of the reliability importance factors for identifying and proposing improvements, with the demonstration of considerable reliability increase.

Copyright © 2011 by American Society of Mechanical Engineers
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Figure 1

Structure of the power switch module with aluminium metallizations

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Figure 2

Die collector solder joint damage after power cycling

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Figure 3

Bump connection solder joint damage after power cycling

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Figure 4

View of the meshed module, the top substrate being removed and the critical connections highlighted

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Figure 5

The ATC temperature profile

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Figure 6

ISA parameterized temperature loading profile

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Figure 7

ISA maximal temperature statistical distribution for an engine zone application

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Figure 8

VSED distribution in base plate solder after five most representative flight cycles [mJmm3]

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Figure 9

VSED distribution in bumps solder after five most representative flight cycles [mJmm3]

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Figure 10

Kriging plots for the mechanical bump n°2 solder VSED [Jm3]

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Figure 12

Plot of the identified pdf of K1

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Figure 14

Mechanical bump n°1 solder joint failure probability elasticities to the variables statistical distributions parameters

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Figure 13

Plot of the identified pdf of K2

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Figure 11

Goodness of fit of the FE output with the Kriging model on the mechanical bump n°2 solder joint



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