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Technical Briefs

Estimating the Carbon Footprint of Telecommunications Products: A Heuristic Approach

[+] Author and Article Information
Toby Joyce

 Alcatel-Lucent, Blanchardstown Industrial Park, Snugboro Road, Dublin 15, Irelandtoby.joyce@alcatel-lucent.com

Thomas A. Okrasinski

 Alcatel-Lucent, 600-700 Mountain Avenue, P.O. Box 636, Murray Hill, NJ 07974-0636tom.okrasinski@alcatel-lucent.com

William Schaeffer

 Alcatel-Lucent, 600-700 Mountain Avenue, P.O. Box 636, Murray Hill, NJ 07974-0636bill.schaeffer@alcatel-lucent.com

J. Mech. Des 132(9), 094502 (Sep 03, 2010) (4 pages) doi:10.1115/1.4002143 History: Received December 24, 2009; Revised July 07, 2010; Published September 03, 2010; Online September 03, 2010

Estimation of the carbon footprint for telecommunications and electronics products has become a key design activity. Improvement in carbon footprint must be demonstrated consistently on all new products. Current methods of providing a useful estimate are laborious and time-consuming. A simplified approach is described, which uses basic statistical methods for estimation and promises significant improvements over existing methods.

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Copyright © 2010 by American Society of Mechanical Engineers
Topics: Carbon
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References

Figures

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Figure 1

Percent carbon footprint contribution for each component of a complete CP assembly

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Figure 2

Plot of CO2 per unit area for boards with two types of finish

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Figure 3

Carbon content of large ICs for four package types

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Figure 4

Scatter plot of joint distributions of subtotals and totals for circuit packs assembly carbon content. The y=x line is shown for comparison.

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Figure 5

Cumulative frequency of the percent error in the circuit packs investigated

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