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Technical Briefs

Numerical Investigation of a Silicon Six-Wafer Microcombustor Under the Effect of Heat Loss Through the Outer Walls

[+] Author and Article Information
Lin Zhu

School of Engineering, Anhui Agricultural University, Hefei 230036, P.R. China; Department of Mechanical Engineering, University of Wisconsin, Milwaukee, WI 53211zl009@mail.ustc.edu.cn

Tien-Chien Jen

Department of Mechanical Engineering, University of Wisconsin, Milwaukee, WI 53211jent@uwm.edu

Xiao-Ling Kong

School of Engineering, Anhui Agricultural University, Hefei 230036, P.R. Chinakong923@126.com

J. Mech. Des 132(12), 124501 (Nov 23, 2010) (5 pages) doi:10.1115/1.4002804 History: Received November 04, 2009; Revised October 12, 2010; Published November 23, 2010; Online November 23, 2010

In this paper, the influences of low heat transfer condition at the outer walls on the microcombustor are investigated due to the fact that a sufficiently small heat transfer coefficient at the outer wall incurs the upstream burning in the recirculation jacket, results in the high wall temperature, and hence possibly damages the microcombustor. Numerical simulation approaches focused on the microcombustor with the flame burning in the recirculation jacket. Combustion characteristics of the combustor were first analyzed based on 2D computational fluid dynamics (CFD), and then the most dangerous locations on the combustor were predicted by means of the 3D finite element analysis method. The study demonstrates the effectiveness of CFD and stress modeling for the design and improvement of the microcombustors.

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Copyright © 2010 by American Society of Mechanical Engineers
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Figures

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Figure 1

Schematic of half of the axisymmetric six-wafer microcombustor

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Figure 2

(a) Total CFD mesh, (b) CFD mesh for heat exchange area, and (c) CFD mesh for flow and combustion area

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Figure 3

Temperature distributions on the microcombustor with different heat transfer coefficients: (a) 50 W/m2 K, (b) 150 W/m2 K, and (c) 250 W/m2 K

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Figure 4

Temperature distributions on the cross section of the microcombustor at heat transfer coefficients=50 W/m2 K(2)

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Figure 5

(a) Infrared image of five-wafer stack, (b) close-up view of a protrusion, and (c) surface image of the propagated defects (10)

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Figure 6

Flow of the mixture in (a) an exploded view, (b) an unexploded view, and (c) temperature distribution on the microcombustor with upstream burning in the recirculation jacket

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Figure 7

Schematic of (a) wafers 1, 2, and 3 and (b) wafer 3

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Figure 8

Thermal stress distribution of wafer 3

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Figure 9

Thermal strain distribution of wafer 3

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Figure 10

Schematic of (a) wafers 3 and 4, (b) of wafer 4, and (c) the tail of wafer 4

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Figure 11

Thermal stress distribution on the tail of wafer 4

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Figure 12

Thermal strain distribution on the tail of wafer 4

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Figure 13

Thermal stress distribution on the interfaces of other wafers

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