A Simulated Annealing-Based Approach to Three-Dimensional Component Packing

[+] Author and Article Information
S. Szykman, J. Cagan

Department of Mechanical Engineering, Carnegie Mellon University, Pittsburgh, PA 15213

J. Mech. Des 117(2A), 308-314 (Jun 01, 1995) (7 pages) doi:10.1115/1.2826140 History: Received February 01, 1994; Revised October 01, 1994; Online December 11, 2007


This paper introduces a simulated annealing-based approach to three-dimensional component packing that employs simulated annealing to generate optimal solutions. Simulated annealing has been used extensively for two-dimensional layout of VLSI circuits; this research extends techniques developed for two-dimensional layout optimization to three-dimensional problems which are more representative of mechanical engineering applications. This research also provides a framework in which to solve general component layout problems.

Copyright © 1995 by The American Society of Mechanical Engineers
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