0
RESEARCH PAPERS

Automated Hybrid Analysis of Surface Mounted Electronic Assemblies

[+] Author and Article Information
T.-L. Wong, K. K. Stevens

Department of Mechanical Engineering, Florida Atlantic University, Boca Raton, FL 33431

J. Wang

Cypress Semiconductor, San Jose, CA 95134

J. Mech. Des 115(3), 435-440 (Sep 01, 1993) (6 pages) doi:10.1115/1.2919208 History: Received October 01, 1990; Revised September 01, 1991; Online June 02, 2008

Abstract

Simulations of surface mounted electronic assemblies under general mechanical loading conditions have been performed using an hybrid analytical/experimental analysis approach. This method combines analytical techniques with experimentally determined load-deformation characteristics of the surface-mounted assemblies to predict loadings and deformations of the assemblies. An automated analysis procedure which integrated the finite element method, optimization theory, and the hybrid analysis approach was developed. This procedure can be used to study the strength of surface mounted devices located anywhere on a printed circuit board subjected to specified loading conditions.

Copyright © 1993 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In