0
RESEARCH PAPERS

Reasoning on the Location of Components for Assembly Packaging

[+] Author and Article Information
J. J. Kim

T. J. Watson Research Center, Interactive Geometric Modeling, IBM Research Division, Yorktown, NY 10598

D. C. Gossard

Computer-Aided Design Laboratory, Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139

J. Mech. Des 113(4), 402-407 (Dec 01, 1991) (6 pages) doi:10.1115/1.2912796 History: Received May 01, 1990; Online June 02, 2008

Abstract

The process of locating components in an available space while satisfying spatial relationships among the components is called packaging. The task requires extensive spatial reasoning about geometric shapes. It is a generic design task common to many domains. It is also very time-consuming, especially as machines become more compact and complex. This paper describes progress toward automation of the packaging problem. An approach is proposed to determine the optimal locations of components in an assembly from spatial relationships between the components. The approach utilizes a novel combination of optimization and solid modeling techniques.

Copyright © 1991 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In